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LCDP1521RL

STMicroelectronics

LCDP1521RL by STMicroelectronics

LCDP1521RL by STMicroelectronics is a robust surge protection IC designed for telecom applications. It features an industrial temp range of -40 °C to 85 °C, an 8-terminal gull-wing design, and a peak reflow temp of 260 °C. Ideal for enhancing circuit reliability in harsh environments.

Median Price

$1.053

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$0.667

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$0.667

-

-

-

Chip1Stop

Japan . 1,745 parts In-Stock

1+ parts

$1.053

100+ parts

$0.800

1k+ parts

$0.703

10k+ parts

-

1,745

$1.053

$0.800

$0.703

-

DigiKey

USA . 555 parts In-Stock

1+ parts

$2.490

100+ parts

$1.094

1k+ parts

$0.878

10k+ parts

$0.709

555

$2.490

$1.094

$0.878

$0.709

Verical

USA . 1,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,745

-

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 446 parts In-Stock

1+ parts

$0.875

100+ parts

-

1k+ parts

-

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446

$0.875

-

-

-

Chip Stock

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,000

-

-

-

-

Anansix

USA . 2,861 parts In-Stock

1+ parts

-

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2,861

-

-

-

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Vyrian

USA . 2,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,411

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Bristol Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.703

1k+ parts

$0.487

10k+ parts

-

2,000

-

$0.703

$0.487

-

Dan-Mar Components

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

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Pride Electronics

USA . 358 parts In-Stock

1+ parts

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100+ parts

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358

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Cyclops Electronics Ltd

UK . 50 parts In-Stock

1+ parts

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50

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 650 parts In-Stock

1+ parts

$0.280

100+ parts

$0.990

1k+ parts

$0.750

10k+ parts

-

650

$0.280

$0.990

$0.750

-

Corphita

USA . 4,433 parts In-Stock

1+ parts

$0.829

100+ parts

-

1k+ parts

-

10k+ parts

-

4,433

$0.829

-

-

-

IDEA Electronic Components Group

UK . 79 parts In-Stock

1+ parts

$8.020

100+ parts

-

1k+ parts

$7.218

10k+ parts

-

79

$8.020

-

$7.218

-

MKK Technologies

India . 2,352 parts In-Stock

1+ parts

$15.080

100+ parts

-

1k+ parts

-

10k+ parts

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2,352

$15.080

-

-

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DigiPath Technology Company

USA . 2,352 parts In-Stock

1+ parts

$15.080

100+ parts

-

1k+ parts

-

10k+ parts

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2,352

$15.080

-

-

-

RC Electronics

USA . 69,711 parts In-Stock

1+ parts

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69,711

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-

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Kepictronics

USA . 47,500 parts In-Stock

1+ parts

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47,500

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Perfect Parts

USA . 6,496 parts In-Stock

1+ parts

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6,496

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-

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A-Z Elektronik GmbH

Germany . 4,536 parts In-Stock

1+ parts

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100+ parts

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4,536

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-

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

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100+ parts

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4,500

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-

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Alle Elektronik GmbH

Germany . 3,024 parts In-Stock

1+ parts

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3,024

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-

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Parana Technologies

USA . 2,229 parts In-Stock

1+ parts

-

100+ parts

$9.589

1k+ parts

-

10k+ parts

-

2,229

-

$9.589

-

-

Overview

Elevate your telecom applications with the LCDP1521RL from STMicroelectronics, a trusted leader in protection ICs. Designed for reliability and efficiency, this compact surge protection circuit safeguards your devices against voltage spikes, ensuring optimal performance in harsh environments. With its robust construction and superior thermal stability, it offers unmatched durability and peace of mind. Choose STMicroelectronics for quality that empowers your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material ensures durability and resistance to moisture, making it suitable for various environmental conditions commonly found in telecom applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into PCB layouts, leading to smaller overall device footprints and facilitating automated manufacturing processes.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and allows for efficient heat dissipation, essential for maintaining performance in high-demand applications.

No. of Terminals: 8

Having 8 terminals provides multiple connection options for enhanced circuit design flexibility and improved circuit integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact device size, ideal for high-density circuit designs typical in modern telecom systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is capable of performing reliably in higher temperature environments, which is critical for telecom applications in extreme conditions.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in cold environments, extending the versatility and application scope of the device in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and enhances solderability, ensuring reliable and long-lasting electrical connections.

Terminal Position: DUAL

The dual terminal position supports effective integration into both sides of a PCB, improving layout flexibility and simplifying assembly.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm aids in maintaining a low profile design, ideal for space-constrained applications while ensuring stability during operation.

Width: 3.9 mm

A compact width of 3.9 mm allows for denser packing of components on a PCB, facilitating more compact designs in telecom equipment.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature of 260 °C indicates compatibility with various soldering processes, ensuring ease of assembly in high-volume productions.

Length: 4.9 mm

The length of 4.9 mm is well-suited for minimizing PCB space usage while maintaining functionality, making it an ideal choice for small form factor devices.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this IC can withstand harsh operational environments, providing reliability and performance in telecom applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and assembly processes, enhancing manufacturing efficiency and reliability in connections.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC is specifically designed to safeguard telecom equipment against voltage spikes, enhancing durability and reliability in critical applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of soldering, enabling versatile layout options while maintaining reliable electrical performance.

Technical Specifications

Telecom - Protection ICs LCDP1521RL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LCDP1521RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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