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CLP30-200B1RL

STMicroelectronics

CLP30-200B1RL by STMicroelectronics

CLP30-200B1RL by STMicroelectronics is a Telecom IC with surge protection circuit. It features 8 terminals in a small outline package, measuring 3.9mm width and 4.9mm length. Ideal for telecom applications requiring surface mount protection against surges.

Median Price

$1.288

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,430 parts In-Stock

1+ parts

-

100+ parts

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$1.288

2,430

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-

$1.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,559 parts In-Stock

1+ parts

$1.288

100+ parts

-

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4,559

$1.288

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Zilex Electronics Inc.

Canada . 5,000 parts In-Stock

1+ parts

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5,000

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Digiode

USA . 3,563 parts In-Stock

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3,563

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A&K Electronics

USA . 1,936 parts In-Stock

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1,936

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Rotakorn

Sweden . 1,936 parts In-Stock

1+ parts

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1,936

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Bristol Electronics

USA . 1,936 parts In-Stock

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1,936

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Anansix

USA . 1,173 parts In-Stock

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1,173

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,012 parts In-Stock

1+ parts

$7.208

100+ parts

-

1k+ parts

$6.487

10k+ parts

-

2,012

$7.208

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$6.487

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Native Components

USA . 100 parts In-Stock

1+ parts

$7.440

100+ parts

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100

$7.440

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MKK Technologies

India . 234 parts In-Stock

1+ parts

$13.555

100+ parts

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234

$13.555

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DigiPath Technology Company

USA . 234 parts In-Stock

1+ parts

$13.555

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234

$13.555

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Speed Components Ltd (Excess)

Israel . 12,470 parts In-Stock

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12,470

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Northwest PG Solutions

USA . 1,640 parts In-Stock

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$7.291

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1,640

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$7.291

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Parana Technologies

USA . 1,491 parts In-Stock

1+ parts

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$8.618

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1,491

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$8.618

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Corphita

USA . 690 parts In-Stock

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690

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Overview

Enhance the reliability of your telecom systems with the CLP30-200B1RL by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch protection ICs that guarantee high-quality performance and durability. This surge protection circuit is designed to safeguard your telecom equipment from power surges, ensuring uninterrupted communication and preventing costly damage. Upgrade your telecom systems today with the CLP30-200B1RL and experience peace of mind knowing your devices are well-protected.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, ensuring it can withstand various environmental conditions.

Surface Mount : YES

Surface mount capability makes it easy to incorporate the IC into various circuit boards and applications.

Package Shape : RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards, maximizing layout flexibility.

No. of Terminals : 8

Having 8 terminals provides ample connection points for integration with other components in the circuit.

Package Style (Meter) : SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact designs and applications.

Terminal Position : DUAL

Dual terminal position offers flexibility in connecting the IC to external components, enhancing ease of use.

Maximum Seated Height : 1.75 mm

Low height profile allows for a slim design, ideal for applications with space constraints.

Width : 3.9 mm

Narrow width makes it easy to fit the IC into tight spaces on the circuit board.

Length : 4.9 mm

Compact length ensures the IC takes up minimal space on the PCB, contributing to efficient layout design.

Terminal Form : GULL WING

Gull wing terminal form provides secure and reliable connections, ensuring stable performance of the IC.

Telecom IC Type : SURGE PROTECTION CIRCUIT

Designed specifically for surge protection in telecom applications, ensuring the safety and reliability of sensitive equipment.

Terminal Pitch : 1.27 mm

Fine terminal pitch allows for close and precise connections, contributing to the overall performance and reliability of the IC.

Technical Specifications

Telecom - Protection ICs CLP30-200B1RL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CLP30-200B1RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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