Loading...

LCP1531RL

STMicroelectronics

LCP1531RL by STMicroelectronics

LCP1531RL by STMicroelectronics is a surge protection IC designed for telecom applications. It features an 8-terminal gull-wing package with a max height of 1.75 mm, and withstands peak reflow temps up to 260 °C. Its compact design ensures reliable performance in space-constrained environments.

Median Price

$0.840

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,797 parts In-Stock

1+ parts

$0.840

100+ parts

$0.586

1k+ parts

$0.370

10k+ parts

$0.273

4,797

$0.840

$0.586

$0.370

$0.273

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,729 parts In-Stock

1+ parts

$0.798

100+ parts

-

1k+ parts

-

10k+ parts

-

3,729

$0.798

-

-

-

Vyrian

USA . 661 parts In-Stock

1+ parts

$0.840

100+ parts

-

1k+ parts

-

10k+ parts

-

661

$0.840

-

-

-

Anansix

USA . 2,789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,789

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,217 parts In-Stock

1+ parts

$0.756

100+ parts

-

1k+ parts

-

10k+ parts

-

2,217

$0.756

-

-

-

IDEA Electronic Components Group

UK . 360 parts In-Stock

1+ parts

$10.855

100+ parts

-

1k+ parts

$9.770

10k+ parts

-

360

$10.855

-

$9.770

-

MKK Technologies

India . 689 parts In-Stock

1+ parts

$20.412

100+ parts

-

1k+ parts

-

10k+ parts

-

689

$20.412

-

-

-

DigiPath Technology Company

USA . 689 parts In-Stock

1+ parts

$20.412

100+ parts

-

1k+ parts

-

10k+ parts

-

689

$20.412

-

-

-

Perfect Parts

USA . 21,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,749

-

-

-

-

Eastek

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.540

10k+ parts

-

12,500

-

-

$0.540

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,962

-

-

-

-

Metaverse IC Inc.

Canada . 5,241 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,241

-

-

-

-

Alle Elektronik GmbH

Germany . 4,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,641

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

GreenTree Electronics

Israel . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Parana Technologies

USA . 322 parts In-Stock

1+ parts

-

100+ parts

$12.979

1k+ parts

-

10k+ parts

-

322

-

$12.979

-

-

Overview

Elevate your telecom designs with the LCP1531RL from STMicroelectronics, a trusted leader in semiconductor innovation. This advanced surge protection IC not only guarantees superior reliability and performance but also ensures your applications are safeguarded against unpredictable voltage spikes. Its compact design and premium materials enhance durability while simplifying integration. Choose LCP1531RL for peace of mind and robust protection that empowers your technology to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making the IC suitable for various environmental conditions.

Surface Mount: YES

Being surface mount compatible allows for efficient use of PCB space and facilitates automated assembly processes for higher production efficiency.

Package Shape: RECTANGULAR

The rectangular shape aids in easy integration into circuit designs, providing a compact solution for surge protection in telecom applications.

No. of Terminals: 8

With 8 terminals, this IC allows versatile connectivity options, accommodating various design requirements in telecom systems.

Package Style (Meter): SMALL OUTLINE

The small outline design is beneficial for space-constrained applications, making it ideal for modern telecommunications equipment.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish improves solderability and enhances the electrical performance, ensuring reliable connections.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and layout, aiding in better signal integrity.

Maximum Seated Height: 1.75 mm

A low maximum seated height contributes to the compactness of board designs, making it suitable for slim telecom devices.

Width: 3.9 mm

The width is optimized for fitting into tight spaces without compromising performance, making it ideal for a variety of applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with standard soldering processes, allowing for easier assembly.

Length: 4.9 mm

The length contributes to a compact footprint, making it suitable for high-density PCB layouts in telecom products.

Terminal Form: GULL WING

Gull wing terminals enhance the mechanical strength of solder joints, ensuring better reliability in challenging environments.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC provides essential protection for sensitive telecom components, enhancing their longevity and performance.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many applications, facilitating easier integration into existing designs.

Technical Specifications

Telecom - Protection ICs LCP1531RL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LCP1531RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 10