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LCP12-150B1RL

STMicroelectronics

LCP12-150B1RL by STMicroelectronics

LCP12-150B1RL by STMicroelectronics is a telecom surge protection IC designed for automotive applications. It features an operating temp range of -40 °C to 125°C, 8 terminals in a compact SO package, and withstands peak reflow temps up to 260°C. Ideal for safeguarding sensitive electronics from voltage spikes.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,276 parts In-Stock

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9,276

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Digiode

USA . 3,151 parts In-Stock

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3,151

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Bristol Electronics

USA . 2,752 parts In-Stock

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2,752

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Dan-Mar Components

USA . 2,752 parts In-Stock

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2,752

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Anansix

USA . 2,115 parts In-Stock

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2,115

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ACDS - Activité Composants Distribution Service

France . 647 parts In-Stock

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647

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,738 parts In-Stock

1+ parts

$14.037

100+ parts

-

1k+ parts

$12.634

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1,738

$14.037

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$12.634

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AZTECH Wire

Italy . 391 parts In-Stock

1+ parts

$15.390

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391

$15.390

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MKK Technologies

India . 506 parts In-Stock

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$26.396

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506

$26.396

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DigiPath Technology Company

USA . 506 parts In-Stock

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$26.396

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506

$26.396

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Component Stockers USA

USA . 375 parts In-Stock

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$99.990

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375

$99.990

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A-Z Elektronik GmbH

Germany . 6,380 parts In-Stock

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6,380

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Alle Elektronik GmbH

Germany . 4,253 parts In-Stock

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Corphita

USA . 3,394 parts In-Stock

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Perfect Parts

USA . 2,793 parts In-Stock

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2,793

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Parana Technologies

USA . 2,032 parts In-Stock

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$16.784

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2,032

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$16.784

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Kepictronics

USA . 96 parts In-Stock

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Overview

Elevate your telecom designs with the LCP12-150B1RL from STMicroelectronics, a leader in innovation and quality. This compact surge protection IC guarantees reliability under extreme conditions, ensuring your systems remain safe and effective. With its automotive-grade durability, it’s perfect for diverse applications, enhancing performance while minimizing downtime. Choose STMicroelectronics for unmatched value and peace of mind in your critical projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various telecom applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern electronic systems, enabling space-saving layouts.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and design versatility, allowing easier placement in various circuit configurations.

No. of Terminals: 8

Having 8 terminals provides multiple connection options, enhancing flexibility in circuit design and facilitating various electrical configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports high-density assembly, crucial in telecom applications where space is limited.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature increases reliability under extreme conditions, ideal for automotive and outdoor telecom environments.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this product can operate reliably in harsh environments, making it suitable for various automotive and industrial applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and helps to ensure reliable electrical connections, enhancing durability and performance.

Terminal Position: DUAL

Dual terminal positioning allows for better alignment in circuit boards, contributing to efficient PCB design and improved electrical performance.

Maximum Seated Height: 2.5 mm

The low seated height aids in maintaining a slim profile in design, accommodating compact electronic device requirements.

Width: 5.62 mm

A narrow width enhances packing density in PCB layouts, allowing more components to be placed on a board without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

This specification helps ensure effective soldering during assembly, providing thermal stability and preventing damage during the manufacturing process.

Peak Reflow Temperature (°C): 260

The ability to withstand peak temperatures up to 260 °C ensures compatibility with high-performance soldering processes in modern assembly techniques.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC is built to withstand rigorous testing standards and is suitable for use in vehicles, ensuring reliability.

Terminal Form: GULL WING

Gull wing terminals allow for easier soldering and provide robust mechanical support, improving overall connection reliability.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Specialized for surge protection, this IC safeguards sensitive telecom equipment, significantly extending the lifespan and reliability of devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with standard PCB design practices and supports higher density layouts while ensuring reliable connections.

Technical Specifications

Telecom - Protection ICs LCP12-150B1RL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.62 mm

Trade Compliance

LCP12-150B1RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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