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DSL02-005SC5

STMicroelectronics

DSL02-005SC5 by STMicroelectronics

STMicroelectronics' DSL02-005SC5 is a telecom surge protection IC with 5 terminals, suitable for automotive applications. It features a small outline package with low profile and shrink pitch, operating b/w -40 °C to 125°C. The Gull Wing terminal form and dual position make it ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,478 parts In-Stock

1+ parts

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6,478

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Anansix

USA . 2,569 parts In-Stock

1+ parts

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2,569

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Digiode

USA . 1,583 parts In-Stock

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1,583

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 239 parts In-Stock

1+ parts

$0.153

100+ parts

-

1k+ parts

-

10k+ parts

$0.147

239

$0.153

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-

$0.147

Northwest PG Solutions

USA . 1,998 parts In-Stock

1+ parts

$0.168

100+ parts

-

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$0.148

1,998

$0.168

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$0.148

AZTECH Wire

Italy . 516 parts In-Stock

1+ parts

$9.830

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516

$9.830

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IDEA Electronic Components Group

UK . 1,278 parts In-Stock

1+ parts

$9.953

100+ parts

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$8.957

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1,278

$9.953

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$8.957

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MKK Technologies

India . 2,059 parts In-Stock

1+ parts

$18.715

100+ parts

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2,059

$18.715

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DigiPath Technology Company

USA . 2,059 parts In-Stock

1+ parts

$18.715

100+ parts

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2,059

$18.715

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Perfect Parts

USA . 6,664 parts In-Stock

1+ parts

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6,664

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Corphita

USA . 2,569 parts In-Stock

1+ parts

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2,569

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Parana Technologies

USA . 982 parts In-Stock

1+ parts

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100+ parts

$11.900

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982

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$11.900

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Overview

Enhance your telecom systems with the DSL02-005SC5 by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics offers protection ICs that guarantee optimal performance and durability. This surge protection circuit is designed to safeguard your equipment from power surges, ensuring smooth and uninterrupted operation. With a small outline and low profile package style, this product is compact yet powerful, making it ideal for a wide range of telecom applications. Invest in the DSL02-005SC5 today and experience the peace of mind that comes with top-notch protection for your valuable equipment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the IC, ensuring reliable performance in various environments.

Surface Mount: YES

Facilitates easy installation and soldering onto circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Allows for efficient use of space on the PCB, making it suitable for compact telecom applications.

No. of Terminals: 5

Provides ample connectivity options for integrating the IC into the telecom circuit.

Package Style: SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Enables a compact and slim design, ideal for space-constrained telecom equipment.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high temperature environments, suitable for demanding telecom applications.

Minimum Operating Temperature: -40 °C

Allows the IC to function effectively in low temperature conditions, enhancing its versatility.

Terminal Position: DUAL

Offers flexibility in circuit design and connectivity options, accommodating different system configurations.

Maximum Seated Height: 1.45 mm

Low profile design saves valuable space in the overall system layout, ideal for telecom devices with limited space.

Width: 1.625 mm

Compact width dimension allows for efficient placement on the PCB, contributing to a streamlined design.

Length: 2.925 mm

Optimal length dimension for fitting into telecom equipment without taking up excessive space.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive-grade temperature variations, ensuring reliability in challenging operating conditions.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical stability and ease of soldering during assembly, enhancing the overall robustness of the IC.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Specifically designed to protect telecom infrastructure from power surges, ensuring the safety and longevity of connected devices.

Terminal Pitch: 0.95 mm

Fine terminal pitch enables high-density board integration, making it suitable for modern telecom systems with compact layout requirements.

Technical Specifications

Telecom - Protection ICs DSL02-005SC5 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G5

Length:

2.925 mm

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.45 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.625 mm

Trade Compliance

DSL02-005SC5 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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