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DSL02-010SC5

STMicroelectronics

DSL02-010SC5 by STMicroelectronics

DSL02-010SC5 by STMicroelectronics is a Telecom Protection IC with 5 terminals, operating from -40 to 125 °C. It features a small outline package style and surge protection circuit type, suitable for automotive applications. The package is made of plastic/epoxy with nickel palladium gold terminal finish, ideal for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,267 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,267

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-

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Anansix

USA . 2,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,342

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Digiode

USA . 833 parts In-Stock

1+ parts

-

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833

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 70 parts In-Stock

1+ parts

$0.157

100+ parts

-

1k+ parts

-

10k+ parts

$0.150

70

$0.157

-

-

$0.150

Northwest PG Solutions

USA . 1,990 parts In-Stock

1+ parts

$0.172

100+ parts

-

1k+ parts

-

10k+ parts

$0.152

1,990

$0.172

-

-

$0.152

IDEA Electronic Components Group

UK . 2,177 parts In-Stock

1+ parts

$10.087

100+ parts

-

1k+ parts

$9.078

10k+ parts

-

2,177

$10.087

-

$9.078

-

AZTECH Wire

Italy . 788 parts In-Stock

1+ parts

$10.270

100+ parts

-

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10k+ parts

-

788

$10.270

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-

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MKK Technologies

India . 638 parts In-Stock

1+ parts

$18.968

100+ parts

-

1k+ parts

-

10k+ parts

-

638

$18.968

-

-

-

DigiPath Technology Company

USA . 638 parts In-Stock

1+ parts

$18.968

100+ parts

-

1k+ parts

-

10k+ parts

-

638

$18.968

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-

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Perfect Parts

USA . 10,080 parts In-Stock

1+ parts

-

100+ parts

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10,080

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Corphita

USA . 3,999 parts In-Stock

1+ parts

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3,999

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Parana Technologies

USA . 1,640 parts In-Stock

1+ parts

-

100+ parts

$12.060

1k+ parts

-

10k+ parts

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1,640

-

$12.060

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Overview

Enhance the reliability and protection of your telecom applications with the DSL02-010SC5 from STMicroelectronics. This surge protection circuit offers top-notch quality and advanced technology, ensuring your devices are safeguarded against voltage spikes and surges. With its compact design and robust construction, this Telecom IC is perfect for automotive applications where space is limited. Trust in STMicroelectronics to deliver exceptional products that provide peace of mind and longevity to your telecom systems. Upgrade your protection today with the DSL02-010SC5.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the IC, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy installation and compatibility with modern PCB designs, enhancing the efficiency of the manufacturing process.

No. of Terminals: 5

Having 5 terminals allows for versatile connection options and interfaces, increasing flexibility in circuit design and integration.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C ensures reliable performance even in demanding thermal conditions, making it ideal for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this protection IC meets stringent quality and reliability standards required for automotive electronics, ensuring safe and reliable operation in vehicles.

Technical Specifications

Telecom - Protection ICs DSL02-010SC5 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.925 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

DSL02-010SC5 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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