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DSL01-016SC5

STMicroelectronics

DSL01-016SC5 by STMicroelectronics

DSL01-016SC5 by STMicroelectronics is a compact surge protection IC designed for telecom applications. It operates in extreme temperatures from -40 °C to 125°C and features a low-profile, 5-terminal gull-wing package. Ideal for automotive use, it ensures reliable performance with a peak reflow temp of 260°C.

Median Price

$0.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 238 parts In-Stock

1+ parts

-

100+ parts

-

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-

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$0.500

238

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-

$0.500

Distributors (In-Stock)

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Digiode

USA . 4,904 parts In-Stock

1+ parts

$1.834

100+ parts

-

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-

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-

4,904

$1.834

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-

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Vyrian

USA . 8,467 parts In-Stock

1+ parts

-

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-

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8,467

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-

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Anansix

USA . 1,699 parts In-Stock

1+ parts

-

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1,699

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 966 parts In-Stock

1+ parts

$0.167

100+ parts

-

1k+ parts

-

10k+ parts

$0.160

966

$0.167

-

-

$0.160

Northwest PG Solutions

USA . 1,218 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

-

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$0.162

1,218

$0.184

-

-

$0.162

Component Stockers USA

USA . 2 parts In-Stock

1+ parts

$1.350

100+ parts

-

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-

10k+ parts

-

2

$1.350

-

-

-

Corphita

USA . 1,242 parts In-Stock

1+ parts

$1.737

100+ parts

-

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1,242

$1.737

-

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IDEA Electronic Components Group

UK . 1,493 parts In-Stock

1+ parts

$13.106

100+ parts

-

1k+ parts

$11.796

10k+ parts

-

1,493

$13.106

-

$11.796

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MKK Technologies

India . 1,148 parts In-Stock

1+ parts

$24.646

100+ parts

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1,148

$24.646

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DigiPath Technology Company

USA . 1,148 parts In-Stock

1+ parts

$24.646

100+ parts

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1,148

$24.646

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Kepictronics

USA . 33,000 parts In-Stock

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33,000

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Perfect Parts

USA . 6,266 parts In-Stock

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6,266

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Parana Technologies

USA . 1,044 parts In-Stock

1+ parts

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100+ parts

$15.671

1k+ parts

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1,044

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$15.671

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Overview

Elevate your telecom designs with the DSL01-016SC5 from STMicroelectronics, a leader in innovation and quality. This advanced surge protection IC ensures unparalleled reliability across various applications, from automotive to industrial systems. Its compact, low-profile design allows for seamless integration, while robust temperature tolerance guarantees performance in extreme conditions. Trust in STMicroelectronics’ legacy to safeguard your circuits while enhancing overall system longevity and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures excellent insulation and protection against environmental factors, making this IC suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easier integration into modern PCB designs, leading to enhanced manufacturing efficiency and reduced assembly costs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on the PCB, enabling compact design while providing robust performance.

No. of Terminals: 5

Having 5 terminals provides versatile connectivity options, ensuring compatibility with various applications within the telecom industry.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design make this IC ideal for modern compact circuitry, reducing the overall footprint of the device.

Maximum Operating Temperature: 125 °C

This high operating temperature threshold ensures reliability under extreme conditions, making it suitable for automotive and telecom applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C allows this IC to function effectively in harsh environments, providing peace of mind for outdoor and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances corrosion resistance and provides excellent solderability, ensuring reliable connections during assembly and throughout the product's lifespan.

Terminal Position: DUAL

The dual terminal position configuration offers flexibility in design, allowing for easier integration into different circuit layouts.

Maximum Seated Height: 1.45 mm

With a low seated height, this IC can be easily integrated into slimmer designs, making it a great choice for compact telecom applications.

Width: 1.625 mm

The narrow width aids in optimal PCB space management, permitting additional components to be placed closely while ensuring functionality.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds ensures it is compatible with modern manufacturing processes, reducing the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

The capacity to withstand peak temperatures of 260 °C ensures compatibility with various soldering methods, including lead-free processes.

Length: 2.9 mm

This compact length allows for flexible PCB layouts, making it suitable for a myriad of telecom devices with varying design requirements.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this IC ensures reliable performance even in critical environments, ensuring safety and functionality in vehicle electronics.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and effective heat dissipation, enhancing manufacturing efficiency and longevity.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Designed specifically for surge protection, this IC safeguards sensitive components from voltage spikes, enhancing the reliability and longevity of telecom devices.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch offers compatibility with various PCB designs, allowing for easier manufacturing and assembly processes.

Technical Specifications

Telecom - Protection ICs DSL01-016SC5 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

DSL01-016SC5 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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