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DSL01-008SC5

STMicroelectronics

DSL01-008SC5 by STMicroelectronics

DSL01-008SC5 by STMicroelectronics is a low-profile surge protection IC designed for telecom applications. It operates b/w -40 °C and 125°C, features a compact 5-terminal gull-wing package, and withstands peak reflow temps of 260°C. Ideal for automotive use, it ensures reliable circuit protection.

Median Price

$0.247

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,489 parts In-Stock

1+ parts

$1.120

100+ parts

$0.457

1k+ parts

$0.331

10k+ parts

$0.217

1,489

$1.120

$0.457

$0.331

$0.217

DigiKey

USA . 523 parts In-Stock

1+ parts

$1.120

100+ parts

$0.462

1k+ parts

$0.358

10k+ parts

-

523

$1.120

$0.462

$0.358

-

Arrow

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.247

6,000

-

-

-

$0.247

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.247

6,000

-

-

-

$0.247

Chip1Stop

Japan . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.238

6,000

-

-

-

$0.238

Avnet

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,167 parts In-Stock

1+ parts

$0.234

100+ parts

-

1k+ parts

-

10k+ parts

-

3,167

$0.234

-

-

-

Digiode

USA . 2,537 parts In-Stock

1+ parts

$0.808

100+ parts

-

1k+ parts

-

10k+ parts

-

2,537

$0.808

-

-

-

TME

Poland . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.369

6,000

-

-

-

$0.369

Anansix

USA . 912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

912

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 153 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

-

10k+ parts

$0.089

153

$0.093

-

-

$0.089

Northwest PG Solutions

USA . 169 parts In-Stock

1+ parts

$0.102

100+ parts

-

1k+ parts

-

10k+ parts

$0.090

169

$0.102

-

-

$0.090

Corphita

USA . 1,642 parts In-Stock

1+ parts

$0.765

100+ parts

-

1k+ parts

-

10k+ parts

-

1,642

$0.765

-

-

-

IDEA Electronic Components Group

UK . 728 parts In-Stock

1+ parts

$8.670

100+ parts

-

1k+ parts

$7.803

10k+ parts

-

728

$8.670

-

$7.803

-

MKK Technologies

India . 2,275 parts In-Stock

1+ parts

$16.304

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

$16.304

-

-

-

DigiPath Technology Company

USA . 2,275 parts In-Stock

1+ parts

$16.304

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

$16.304

-

-

-

Metaverse IC Inc.

Canada . 85,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

85,000

-

-

-

-

Kepictronics

USA . 39,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39,000

-

-

-

-

Perfect Parts

USA . 8,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,272

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,850

-

-

-

-

Parana Technologies

USA . 1,925 parts In-Stock

1+ parts

-

100+ parts

$10.366

1k+ parts

-

10k+ parts

-

1,925

-

$10.366

-

-

Alle Elektronik GmbH

Germany . 1,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,900

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Elevate your telecom applications with the DSL01-008SC5 from STMicroelectronics, a trusted leader in innovative technology. This compact surge protection IC guarantees robust performance across extreme temperatures, ensuring reliability and longevity in critical environments. Designed for seamless integration, it offers top-tier protection without compromising on space, making it ideal for automotive and communication systems. Experience peace of mind with unmatched quality and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures excellent protection and longevity, making it suitable for demanding telecom applications.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern PCB layouts, enhancing versatility and reliability.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for denser circuit designs without compromising performance.

No. of Terminals: 5

With 5 terminals, this IC provides multiple connection options, ensuring flexible integration into various circuit configurations.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design lead to minimized space requirements, making it ideal for compact electronic devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the IC to function reliably in harsh conditions, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures stable performance in extreme environments, making it an excellent choice for outdoor telecom installations.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, enhancing overall durability and reliability.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in design, allowing for better routing on PCBs and optimizing the footprint.

Maximum Seated Height: 1.45 mm

The low seated height enables surface mounting on even the thinnest boards, perfect for ultra-compact devices.

Width: 1.625 mm

This compact width facilitates space-saving designs, enabling efficient layouts in high-density circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum exposure time to peak reflow temperature ensures minimal thermal stress on the IC, promoting longevity and reliability.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature tolerance supports compatibility with various manufacturing processes, ensuring design flexibility.

Length: 2.9 mm

Its compact length is advantageous for integration into small electronic devices, ensuring efficient use of board space.

Temperature Grade: AUTOMOTIVE

The automotive-grade qualification ensures the IC meets stringent reliability and performance standards, making it suitable for critical applications in the automotive sector.

Terminal Form: GULL WING

The gull wing terminal form promotes secure solder connections, fostering reliable performance in demanding environments.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit designed for telecom applications, this IC effectively safeguards sensitive components from transient voltage spikes.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch allows for high-density placement while maintaining ease of soldering, ideal for compact telecom designs.

Technical Specifications

Telecom - Protection ICs DSL01-008SC5 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

DSL01-008SC5 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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