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SSRP130B1RL

STMicroelectronics

SSRP130B1RL by STMicroelectronics

STMicroelectronics SSRP130B1RL is a telecom surge protection IC with 8 terminals in small outline package. It operates b/w 0-70 °C, with peak reflow temperature of 260°C for 30s. Ideal for telecom applications requiring protection against surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

LIBRA Elektronik GmbH

Germany . 108,999 parts In-Stock

1+ parts

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108,999

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Vyrian

USA . 4,613 parts In-Stock

1+ parts

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4,613

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Digiode

USA . 1,957 parts In-Stock

1+ parts

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1,957

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Anansix

USA . 1,870 parts In-Stock

1+ parts

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1,870

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ComSIT Distribution GmbH

Germany . 1,129 parts In-Stock

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1,129

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ECAB

Sweden . 486 parts In-Stock

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486

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$8.472

100+ parts

$8.387

1k+ parts

$8.048

10k+ parts

-

10

$8.472

$8.387

$8.048

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IDEA Electronic Components Group

UK . 837 parts In-Stock

1+ parts

$14.524

100+ parts

-

1k+ parts

$13.072

10k+ parts

-

837

$14.524

-

$13.072

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MKK Technologies

India . 2,302 parts In-Stock

1+ parts

$27.312

100+ parts

-

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2,302

$27.312

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DigiPath Technology Company

USA . 2,302 parts In-Stock

1+ parts

$27.312

100+ parts

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2,302

$27.312

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Corphita

USA . 1,425 parts In-Stock

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1,425

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Parana Technologies

USA . 1,048 parts In-Stock

1+ parts

-

100+ parts

$17.366

1k+ parts

-

10k+ parts

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1,048

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$17.366

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-

Overview

Enhance the reliability and efficiency of your telecom devices with the SSRP130B1RL surge protection circuit from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics ensures top-notch quality and performance in their products. The SSRP130B1RL offers superior protection for your telecom equipment, safeguarding against potential damages from power surges. With its compact design and high-temperature tolerance, this protection IC is a valuable addition to any telecom system, providing peace of mind and longevity to your devices. Trust STMicroelectronics for cutting-edge solutions that deliver unmatched value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection, making this product suitable for rugged telecom environments.

Surface Mount: YES

Surface mount design simplifies installation and maintenance, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space in telecom equipment, optimizing layout and design.

No. of Terminals: 8

Having 8 terminals provides flexibility for connecting to different components in the telecom system.

Terminal Position: DUAL

Dual terminal positioning enhances stability and reliability of connections, reducing the risk of signal loss or interference.

Width: 3.9 mm

Compact width enables easy integration into telecom devices with limited space, ensuring efficient use of available area on circuit boards.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures robust soldering connections for reliable performance under varying operating conditions.

Temperature Grade: COMMERCIAL

Commercial-grade temperature rating makes this product suitable for standard telecom applications, providing consistent performance in typical operating environments.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry safeguards telecom equipment against power surges and voltage spikes, prolonging the lifespan of the devices and ensuring uninterrupted operation.

Technical Specifications

Telecom - Protection ICs SSRP130B1RL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SSRP130B1RL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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