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SSRP130B1

STMicroelectronics

SSRP130B1 by STMicroelectronics

STMicroelectronics SSRP130B1 is a Telecom IC for surge protection circuits. It features 8 terminals in a small outline package with Gull Wing form, suitable for surface mount applications. Operating temperature ranges from 0 to 70 °C, making it ideal for commercial telecom equipment.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,655 parts In-Stock

1+ parts

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4,655

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Digiode

USA . 3,221 parts In-Stock

1+ parts

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-

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3,221

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Anansix

USA . 2,423 parts In-Stock

1+ parts

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2,423

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 712 parts In-Stock

1+ parts

$13.062

100+ parts

-

1k+ parts

$11.756

10k+ parts

-

712

$13.062

-

$11.756

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MKK Technologies

India . 1,963 parts In-Stock

1+ parts

$24.563

100+ parts

-

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10k+ parts

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1,963

$24.563

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DigiPath Technology Company

USA . 1,963 parts In-Stock

1+ parts

$24.563

100+ parts

-

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10k+ parts

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1,963

$24.563

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Kepictronics

USA . 2,235 parts In-Stock

1+ parts

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2,235

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Parana Technologies

USA . 2,084 parts In-Stock

1+ parts

-

100+ parts

$15.618

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2,084

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$15.618

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Corphita

USA . 1,425 parts In-Stock

1+ parts

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1,425

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Overview

Enhance the reliability of your telecom applications with the SSRP130B1 surge protection circuit by STMicroelectronics. Manufactured by a trusted industry leader, this small outline rectangular package is designed for surface mount applications, providing high-quality protection against voltage surges. With a temperature grade suitable for commercial use and a gull wing terminal form for easy installation, this Telecom IC offers unmatched value and peace of mind for your electronic devices. Experience the benefits of superior quality and performance with the SSRP130B1 from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular package shape enables compact and space-saving design.

No. of Terminals: 8

Having 8 terminals allows for versatile connections and compatibility with different systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in optimizing board space and reduces overall size of the product.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability and performance even under challenging conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function effectively in various environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in connectivity options and ease of use.

Maximum Seated Height: 1.75 mm

Low maximum seated height allows for slim and compact design of the product.

Width: 3.9 mm

Narrow width makes the product suitable for applications where space is limited.

Length: 4.9 mm

Compact length ensures the product can fit into tight spaces on circuit boards.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Terminal Form: GULL WING

Gull wing terminal form provides strong and reliable connections with the circuit board.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuit type offers essential protection for telecom equipment against power surges and spikes.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm allows for precise and secure connection to the circuit board.

Technical Specifications

Telecom - Protection ICs SSRP130B1 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SSRP130B1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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