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TSI180B1RL

STMicroelectronics

TSI180B1RL by STMicroelectronics

STMicroelectronics TSI180B1RL is a telecom surge protection IC with 8 terminals in a small outline package. It features gull wing terminal form, 1.27mm pitch, and measures 3.9mm width by 4.9mm length at a seated height of 1.75mm. Ideal for telecom applications requiring surface mount protection circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,809 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,809

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-

-

-

Anansix

USA . 1,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,070

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-

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Vyrian

USA . 704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

704

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,730 parts In-Stock

1+ parts

$14.601

100+ parts

-

1k+ parts

$13.141

10k+ parts

-

1,730

$14.601

-

$13.141

-

MKK Technologies

India . 1,340 parts In-Stock

1+ parts

$27.457

100+ parts

-

1k+ parts

-

10k+ parts

-

1,340

$27.457

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-

-

DigiPath Technology Company

USA . 1,340 parts In-Stock

1+ parts

$27.457

100+ parts

-

1k+ parts

-

10k+ parts

-

1,340

$27.457

-

-

-

Parana Technologies

USA . 1,618 parts In-Stock

1+ parts

-

100+ parts

$17.458

1k+ parts

-

10k+ parts

-

1,618

-

$17.458

-

-

Corphita

USA . 161 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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161

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Overview

Enhance the reliability and durability of your telecom systems with the TSI180B1RL by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics brings you cutting-edge protection ICs that guarantee top-notch performance and peace of mind. Perfect for surge protection circuits, this small outline package offers dual terminal positions and gull wing terminal form for easy installation. Upgrade your telecom equipment today with the TSI180B1RL and experience unparalleled quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, maximizing density and functionality.

No. of Terminals: 8

Having 8 terminals provides flexibility in connections and allows for multiple input/output options.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces overall footprint on the PCB, ideal for applications with limited space.

Terminal Position: DUAL

Dual terminal position enables secure and stable connection, ensuring proper functionality and performance.

Maximum Seated Height: 1.75 mm

Low seated height allows for compact design and easy integration into tight spaces or crowded PCB layouts.

Width: 3.9 mm

Narrow width makes the product suitable for applications with space constraints, without compromising on performance.

Length: 4.9 mm

Compact length ensures minimal space usage on the PCB, contributing to an efficient design layout.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and reliability for the connection points, enhancing overall product durability.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry helps safeguard sensitive telecom equipment from voltage spikes or surges, preventing damage and ensuring uninterrupted operation.

Terminal Pitch: 1.27 mm

Close terminal pitch allows for precise and secure connections, enhancing overall performance and signal integrity of the product.

Technical Specifications

Telecom - Protection ICs TSI180B1RL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TSI180B1RL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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