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THBT15011DRL

STMicroelectronics

THBT15011DRL by STMicroelectronics

STMicroelectronics THBT15011DRL is a Telecom IC with surge protection circuit. It comes in a small outline package with 8 terminals, Gull Wing form, and 1.27mm pitch. Ideal for telecom applications requiring surface mount protection ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,479 parts In-Stock

1+ parts

-

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1k+ parts

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4,479

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-

-

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Vyrian

USA . 3,565 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,565

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-

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

1+ parts

-

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2,500

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ComSIT USA

USA . 2,500 parts In-Stock

1+ parts

-

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-

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2,500

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-

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Anansix

USA . 1,634 parts In-Stock

1+ parts

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1,634

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Rebound Electronics

UK . 315 parts In-Stock

1+ parts

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315

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,848 parts In-Stock

1+ parts

$15.884

100+ parts

-

1k+ parts

$14.295

10k+ parts

-

1,848

$15.884

-

$14.295

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$17.483

100+ parts

$15.910

1k+ parts

$14.336

10k+ parts

-

500

$17.483

$15.910

$14.336

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AZTECH Wire

Italy . 297 parts In-Stock

1+ parts

$21.250

100+ parts

-

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297

$21.250

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MKK Technologies

India . 78 parts In-Stock

1+ parts

$29.868

100+ parts

-

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78

$29.868

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DigiPath Technology Company

USA . 78 parts In-Stock

1+ parts

$29.868

100+ parts

-

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78

$29.868

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Perfect Parts

USA . 11,200 parts In-Stock

1+ parts

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11,200

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A-Z Elektronik GmbH

Germany . 5,172 parts In-Stock

1+ parts

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5,172

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Corphita

USA . 4,858 parts In-Stock

1+ parts

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4,858

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Parana Technologies

USA . 2,061 parts In-Stock

1+ parts

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100+ parts

$18.992

1k+ parts

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2,061

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$18.992

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Overview

The THBT15011DRL by STMicroelectronics is a top-notch surge protection circuit designed to keep your telecom equipment safe from power surges and voltage spikes. With a reputation for excellence in manufacturing, STMicroelectronics ensures that this protection IC meets the highest quality standards. Perfect for a wide range of telecom applications, this compact and reliable device offers peace of mind to customers by safeguarding their valuable equipment. Trust STMicroelectronics for superior telecom protection solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making this product suitable for long-term use in telecom applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts and facilitates efficient placement on circuit boards.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the IC to other components, enhancing overall connectivity and functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact telecom devices or systems.

Terminal Position: DUAL

Dual terminal positioning allows for secure and stable connection, ensuring reliable performance in telecom applications.

Maximum Seated Height: 1.75 mm

Low maximum seated height minimizes the overall profile of the IC, making it suitable for slim telecom equipment or systems.

Width: 3.9 mm

Compact width enables easy integration into narrow spaces on the PCB, allowing for efficient use of board real estate.

Length: 4.9 mm

Short length facilitates space-saving placement on the PCB, contributing to a more streamlined and compact design.

Terminal Form: GULL WING

Gull-wing terminal form provides mechanical strength and ease of soldering, ensuring robust connections for reliable operation.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Being a surge protection circuit, this IC safeguards telecom equipment from voltage spikes and surges, enhancing device longevity and performance.

Terminal Pitch: 1.27 mm

With a standard terminal pitch, this IC is compatible with common PCB layouts, making it easier to design and integrate into telecom systems.

Technical Specifications

Telecom - Protection ICs THBT15011DRL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

THBT15011DRL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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