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SMTHDT120

STMicroelectronics

SMTHDT120 by STMicroelectronics

SMTHDT120 by STMicroelectronics is a Telecom - Protection IC with plastic/epoxy body, 2 terminals, and small outline package. Operating temperature range from -40 to 85 °C makes it suitable for industrial applications. It features surge protection circuit for telecom equipment.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,067 parts In-Stock

1+ parts

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2,067

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Digiode

USA . 1,404 parts In-Stock

1+ parts

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1,404

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Anansix

USA . 619 parts In-Stock

1+ parts

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619

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 994 parts In-Stock

1+ parts

$8.544

100+ parts

-

1k+ parts

$7.690

10k+ parts

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994

$8.544

-

$7.690

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MKK Technologies

India . 666 parts In-Stock

1+ parts

$16.067

100+ parts

-

1k+ parts

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10k+ parts

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666

$16.067

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DigiPath Technology Company

USA . 666 parts In-Stock

1+ parts

$16.067

100+ parts

-

1k+ parts

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666

$16.067

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Kepictronics

USA . 99,800 parts In-Stock

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99,800

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Corphita

USA . 4,246 parts In-Stock

1+ parts

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4,246

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Parana Technologies

USA . 1,453 parts In-Stock

1+ parts

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100+ parts

$10.216

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1,453

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$10.216

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Overview

Enhance the reliability of your telecom systems with the high-quality SMTHDT120 surge protection circuit from STMicroelectronics. Designed with precision and expertise, this small outline package offers superior protection for your devices, ensuring uninterrupted communication and safeguarding against voltage spikes. Perfect for a wide range of telecom applications, this product provides peace of mind with its industrial-grade temperature tolerance and dual terminal position. Trust STMicroelectronics to deliver top-notch telecom protection ICs that prioritize durability and performance, giving you the edge in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances the durability and reliability of the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various telecom devices, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and space-saving design, making it suitable for applications where space is limited.

No. of Terminals: 2

Having 2 terminals simplifies the connectivity process, reducing the chances of errors during installation.

Package Style (Meter): SMALL OUTLINE

Small outline package style enhances the overall aesthetics of the product and makes it suitable for modern telecom devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can withstand harsh environmental conditions, increasing its reliability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the product to function effectively in cold environments, making it versatile and dependable.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and allows for easy connection to other components in the system.

Maximum Seated Height: 3.1 mm

Low maximum seated height enables the product to be used in compact devices and tight spaces without compromising performance.

Width: 5 mm

Narrow width makes the product suitable for narrow spaces and compact telecom devices, improving overall design flexibility.

Length: 6.45 mm

Compact length ensures the product can fit seamlessly into telecom devices without taking up too much space, maintaining a sleek design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can operate reliably in a wide range of temperature conditions, making it suitable for industrial applications.

Terminal Form: C BEND

C bend terminal form facilitates easy soldering and secure connection, ensuring the product is installed correctly and efficiently.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuit functionality protects telecom devices from voltage spikes and ensures the longevity of the equipment, making it a valuable addition to any telecom system.

Technical Specifications

Telecom - Protection ICs SMTHDT120 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

Length:

6.45 mm

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

3.1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Width:

5 mm

Trade Compliance

SMTHDT120 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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