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NIS2161MTTAG

Onsemi

NIS2161MTTAG by Onsemi

NIS2161MTTAG by Onsemi is a Telecom - Protection IC with a small outline, very thin profile package. It features 10 terminals with tin finish and surge protection circuit type. Ideal for telecom applications requiring surface mount technology in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,508 parts In-Stock

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Vyrian

USA . 605 parts In-Stock

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605

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SupplyDigital Components

Austria . 5,565 parts In-Stock

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5,565

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Problanco Electronics

Mexico . 2,923 parts In-Stock

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Kulean Microsystems

USA . 1,210 parts In-Stock

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TANS Electronics

Latvia . 1,097 parts In-Stock

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Corphita

USA . 963 parts In-Stock

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Corohmni

South Africa . 120 parts In-Stock

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UHIMA Technologies

Türkiye . 46 parts In-Stock

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Overview

Upgrade your telecom equipment with the NIS2161MTTAG surge protection circuit by Onsemi. Designed with high-quality materials and advanced technology, this product offers superior protection for your devices, ensuring reliable performance and longevity. Perfect for a wide range of applications in the telecom industry, this small outline package with a very thin profile is easy to install and provides peace of mind against unexpected power surges. Trust Onsemi to deliver top-notch protection ICs that prioritize quality, value, and customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, making it suitable for demanding telecom applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor for easy handling and installation in telecom devices.

No. of Terminals: 10

The presence of multiple terminals enables a secure connection and efficient signal transmission within the circuit.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile of the package make it ideal for compact telecom devices where space is limited.

Terminal Finish: TIN

Tin terminal finish offers excellent electrical conductivity and corrosion resistance, ensuring reliable performance over time.

Terminal Position: DUAL

Dual terminal position provides flexibility for various circuit configurations and simplifies the connection process.

Maximum Seated Height: 0.8 mm

The low seated height allows for a slim profile design, making it suitable for space-constrained telecom applications.

Width: 2 mm

The compact width of the IC enables efficient use of space on the circuit board without compromising performance.

Length: 3.5 mm

The moderate length of the IC provides a balanced form factor for easy handling and installation in telecom devices.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and ensures environmental compliance in telecom equipment.

Telecom IC Type: SURGE PROTECTION CIRCUIT

The surge protection circuit enhances the reliability of the telecom system by safeguarding against voltage spikes and transient surges.

Terminal Pitch: 0.675 mm

The small terminal pitch allows for high-density mounting of multiple ICs on a single PCB, optimizing board space utilization.

Technical Specifications

Telecom - Protection ICs NIS2161MTTAG attributes and parameters. Explore more Telecom - Protection ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-N10

JESD-609 Code:

e3

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.675 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

NIS2161MTTAG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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