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SMP2300SCMC

STMicroelectronics

SMP2300SCMC by STMicroelectronics

SMP2300SCMC by STMicroelectronics is a telecom surge protection circuit in a small outline package. With 2 terminals, it offers dual terminal position and C bend form. Ideal for telecom applications, it provides surface mount capability with a compact size of 3.625mm width and 4.325mm length.

Median Price

$0.266

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,118 parts In-Stock

1+ parts

$0.035

100+ parts

$0.024

1k+ parts

$0.016

10k+ parts

-

2,118

$0.035

$0.024

$0.016

-

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

$0.480

100+ parts

$0.435

1k+ parts

$0.425

10k+ parts

$0.400

1,000

$0.480

$0.435

$0.425

$0.400

Adafruit Industries

USA . 1,200 parts In-Stock

1+ parts

$8.859

100+ parts

$8.771

1k+ parts

-

10k+ parts

-

1,200

$8.859

$8.771

-

-

DigiKey

USA . 2,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.438

2,350

-

-

-

$0.438

Verical

USA . 2,118 parts In-Stock

1+ parts

-

100+ parts

$0.095

1k+ parts

$0.091

10k+ parts

-

2,118

-

$0.095

$0.091

-

Chip1Stop

Japan . 2,118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.016

10k+ parts

-

2,118

-

-

$0.016

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,011 parts In-Stock

1+ parts

$0.016

100+ parts

-

1k+ parts

-

10k+ parts

-

4,011

$0.016

-

-

-

Digiode

USA . 1,915 parts In-Stock

1+ parts

$0.033

100+ parts

-

1k+ parts

-

10k+ parts

-

1,915

$0.033

-

-

-

IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

$0.624

100+ parts

$0.566

1k+ parts

$0.552

10k+ parts

$0.520

1,000

$0.624

$0.566

$0.552

$0.520

Anansix

USA . 1,821 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,821

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,298 parts In-Stock

1+ parts

$0.032

100+ parts

-

1k+ parts

-

10k+ parts

-

2,298

$0.032

-

-

-

IDEA Electronic Components Group

UK . 1,829 parts In-Stock

1+ parts

$8.079

100+ parts

-

1k+ parts

$7.271

10k+ parts

-

1,829

$8.079

-

$7.271

-

Advanced Electronics

New Zealand . 1,200 parts In-Stock

1+ parts

$8.859

100+ parts

$8.771

1k+ parts

$8.416

10k+ parts

-

1,200

$8.859

$8.771

$8.416

-

MKK Technologies

India . 730 parts In-Stock

1+ parts

$15.193

100+ parts

-

1k+ parts

-

10k+ parts

-

730

$15.193

-

-

-

DigiPath Technology Company

USA . 730 parts In-Stock

1+ parts

$15.193

100+ parts

-

1k+ parts

-

10k+ parts

-

730

$15.193

-

-

-

Kepictronics

USA . 85,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

85,000

-

-

-

-

Perfect Parts

USA . 11,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,200

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,268 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,268

-

-

-

-

Parana Technologies

USA . 2,080 parts In-Stock

1+ parts

-

100+ parts

$9.660

1k+ parts

-

10k+ parts

-

2,080

-

$9.660

-

-

Overview

Enhance the durability and reliability of your telecom systems with the SMP2300SCMC by STMicroelectronics. Designed with precision and quality in mind, this surge protection circuit offers unparalleled protection for your valuable equipment. Whether you're looking to safeguard communication networks or telecommunications infrastructure, this product ensures peace of mind and uninterrupted connectivity. Trust in the expertise of STMicroelectronics to deliver cutting-edge solutions that exceed expectations. Upgrade to the SMP2300SCMC today and experience the difference in performance and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the Telecom IC, ensuring it can withstand harsh environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the Telecom IC onto PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB, making it easier to integrate the Telecom IC into various electronic devices.

No. of Terminals: 2

Having 2 terminals simplifies the connection process and reduces the likelihood of wiring errors, making the Telecom IC easier to integrate into circuit designs.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for more components to be placed on the board without sacrificing functionality or performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design, allowing the Telecom IC to be connected in multiple configurations to suit different applications.

Maximum Seated Height: 2.65 mm

Low maximum seated height enables the Telecom IC to be used in compact electronic devices where space is limited, without compromising on performance or reliability.

Width: 3.625 mm

Narrow width makes the Telecom IC suitable for applications where space is a constraint, allowing for efficient use of PCB real estate and enabling compact designs.

Length: 4.325 mm

Compact length of the Telecom IC makes it easy to fit into tight spaces within electronic devices, ensuring that it can be integrated into various products without taking up excessive room.

Terminal Form: C BEND

C bend terminal form ensures secure and reliable connections within the circuit, reducing the risk of disconnection or signal loss, making the Telecom IC a dependable choice for protection against surges.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Being a surge protection circuit, this Telecom IC is designed to safeguard electronic devices from damaging voltage spikes, making it an essential component for ensuring the longevity and reliability of telecom equipment.

Technical Specifications

Telecom - Protection ICs SMP2300SCMC attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

Length:

4.325 mm

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.625 mm

Trade Compliance

SMP2300SCMC Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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