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NIV1161MTWTAG

Onsemi

NIV1161MTWTAG by Onsemi

NIV1161MTWTAG by Onsemi is a Telecom - Protection IC with AEC-Q100 screening. It features a small outline, heat sink package style and operates b/w -55°C to 150°C. Ideal for surge protection circuits in military-grade telecom applications.

Median Price

$0.653

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,000 parts In-Stock

1+ parts

$0.636

100+ parts

$0.498

1k+ parts

$0.405

10k+ parts

$0.372

2,000

$0.636

$0.498

$0.405

$0.372

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

$0.670

100+ parts

$0.509

1k+ parts

$0.400

10k+ parts

-

2,000

$0.670

$0.509

$0.400

-

Mouser Electronics

USA . 2,245 parts In-Stock

1+ parts

$1.060

100+ parts

$0.613

1k+ parts

$0.431

10k+ parts

$0.388

2,245

$1.060

$0.613

$0.431

$0.388

DigiKey

USA . 725 parts In-Stock

1+ parts

$1.610

100+ parts

$0.680

1k+ parts

$0.535

10k+ parts

-

725

$1.610

$0.680

$0.535

-

Flip Electronics (Authorized)

USA . 7,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,585

-

-

-

-

RS (Exports)

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.564

1k+ parts

$0.391

10k+ parts

-

3,000

-

$0.564

$0.391

-

Farnell

UK . 2,880 parts In-Stock

1+ parts

-

100+ parts

$0.514

1k+ parts

$0.372

10k+ parts

$0.318

2,880

-

$0.514

$0.372

$0.318

Element14

Singapore . 2,880 parts In-Stock

1+ parts

-

100+ parts

$0.857

1k+ parts

$0.620

10k+ parts

$0.556

2,880

-

$0.857

$0.620

$0.556

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$0.498

1k+ parts

$0.405

10k+ parts

$0.372

2,000

-

$0.498

$0.405

$0.372

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,665 parts In-Stock

1+ parts

$0.352

100+ parts

-

1k+ parts

-

10k+ parts

-

1,665

$0.352

-

-

-

Digiode

USA . 507 parts In-Stock

1+ parts

$0.604

100+ parts

-

1k+ parts

-

10k+ parts

-

507

$0.604

-

-

-

Flip Electronics

USA . 7,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,585

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 234 parts In-Stock

1+ parts

$0.352

100+ parts

-

1k+ parts

-

10k+ parts

-

234

$0.352

-

-

-

Corphita

USA . 2,239 parts In-Stock

1+ parts

$0.572

100+ parts

-

1k+ parts

-

10k+ parts

-

2,239

$0.572

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Problanco Electronics

Mexico . 5,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,022

-

-

-

-

SupplyDigital Components

Austria . 3,462 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,462

-

-

-

-

iodParts Technologies Inc.

India . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Continental Prestige Electronics

USA . 2,915 parts In-Stock

1+ parts

-

100+ parts

$0.658

1k+ parts

$0.428

10k+ parts

$0.369

2,915

-

$0.658

$0.428

$0.369

TANS Electronics

Latvia . 1,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,247

-

-

-

-

Kulean Microsystems

USA . 1,203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,203

-

-

-

-

UHIMA Technologies

Türkiye . 479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

479

-

-

-

-

Overview

Experience unmatched protection and reliability with the NIV1161MTWTAG by Onsemi. As a leader in the industry, Onsemi delivers top-quality products that exceed expectations. The NIV1161MTWTAG falls into the Telecom Protection ICs category, offering advanced surge protection circuitry for various applications. With a temperature range from -55 to 150°C, this product ensures optimal performance in extreme conditions. Trust Onsemi to provide you with the best-in-class solutions for your telecom protection needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers good durability and resistance to external elements, making this product suitable for long-term use in various environments.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into circuit boards, reducing assembly time and making it ideal for compact electronic designs.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, making this product suitable for automotive applications where robustness is crucial.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, enabling a compact design and optimizing overall system layout.

No. of Terminals: 6

Having 6 terminals provides ample connectivity options, allowing for versatile integration within a circuit and ensuring compatibility with various system architectures.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this product can withstand elevated temperatures, making it suitable for applications where heat dissipation is a concern.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55°C ensures reliable performance even in extreme cold conditions, enhancing the product's versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and corrosion resistance, contributing to a reliable electrical connection and ensuring long-term performance.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in mounting orientation, allowing for easy integration within a system and facilitating efficient PCB layout.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm enables a slim profile design, making this product suitable for applications with space constraints or where height restrictions apply.

Width: 2 mm

The compact width of 2 mm allows for a space-saving design, ideal for applications where board space is limited or a slim form factor is desired.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature of 260°C ensures proper soldering and reflow process, contributing to product reliability and consistency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables reliable solder joints and ensures proper component mounting during assembly, enhancing overall product quality.

Length: 2.2 mm

The compact length of 2.2 mm contributes to a space-efficient design and allows for easy integration within a circuit board footprint, enhancing overall system performance.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh environmental conditions and compliance with stringent quality standards, making this product suitable for demanding applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the need for lead-based solder, making this product environmentally friendly and compliant with RoHS regulations.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Being a surge protection circuit, this product offers overvoltage protection and safeguards against electrical spikes, making it ideal for telecom applications where equipment protection is essential.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density PCB layout, allowing for compact design and efficient use of space, making this product ideal for space-constrained applications.

Technical Specifications

Telecom - Protection ICs NIV1161MTWTAG attributes and parameters. Explore more Telecom - Protection ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

2.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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