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NIV1161MTTAG

Onsemi

NIV1161MTTAG by Onsemi

SURGE PROTECTION CIRCUIT; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: SQUARE;

Median Price

$0.638

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,924 parts In-Stock

1+ parts

$0.525

100+ parts

$0.461

1k+ parts

$0.407

10k+ parts

$0.360

2,924

$0.525

$0.461

$0.407

$0.360

Arrow

USA . 1,044 parts In-Stock

1+ parts

$0.664

100+ parts

$0.525

1k+ parts

$0.474

10k+ parts

-

1,044

$0.664

$0.525

$0.474

-

Mouser Electronics

USA . 5,995 parts In-Stock

1+ parts

$0.920

100+ parts

$0.604

1k+ parts

$0.536

10k+ parts

$0.434

5,995

$0.920

$0.604

$0.536

$0.434

DigiKey

USA . 9,257 parts In-Stock

1+ parts

$1.880

100+ parts

$0.801

1k+ parts

$0.578

10k+ parts

$0.439

9,257

$1.880

$0.801

$0.578

$0.439

Rochester

USA . 74,689 parts In-Stock

1+ parts

-

100+ parts

$0.590

1k+ parts

$0.489

10k+ parts

$0.436

74,689

-

$0.590

$0.489

$0.436

Verical

USA . 73,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.612

10k+ parts

$0.545

73,000

-

-

$0.612

$0.545

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,421 parts In-Stock

1+ parts

$0.458

100+ parts

-

1k+ parts

-

10k+ parts

-

1,421

$0.458

-

-

-

Vyrian

USA . 51 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

-

10k+ parts

-

51

$0.482

-

-

-

IBS Electronics

USA . 355 parts In-Stock

1+ parts

$1.935

100+ parts

$1.627

1k+ parts

-

10k+ parts

$1.080

355

$1.935

$1.627

-

$1.080

NAC Semi

USA . 72,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.720

72,400

-

-

-

$1.720

Flip Electronics

USA . 12,002 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,002

-

-

-

-

Bristol Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 24,462 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

24,462

$0.410

-

-

-

Corphita

USA . 1,866 parts In-Stock

1+ parts

$0.434

100+ parts

-

1k+ parts

-

10k+ parts

-

1,866

$0.434

-

-

-

Corohmni

South Africa . 363 parts In-Stock

1+ parts

$0.482

100+ parts

-

1k+ parts

-

10k+ parts

-

363

$0.482

-

-

-

Authorized Procurement Solutions

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40,000

-

-

-

-

Kepictronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,000

-

-

-

-

GreenTree Electronics

Israel . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

TANS Electronics

Latvia . 6,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,456

-

-

-

-

ChipstoGo Electronic ltd

UK . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Perfect Parts

USA . 5,023 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,023

-

-

-

-

Kulean Microsystems

USA . 4,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,432

-

-

-

-

Problanco Electronics

Mexico . 3,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,619

-

-

-

-

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.660

10k+ parts

-

3,000

-

-

$0.660

-

UHIMA Technologies

Türkiye . 704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

704

-

-

-

-

SupplyDigital Components

Austria . 221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

221

-

-

-

-

Technical Specifications

Telecom - Protection ICs NIV1161MTTAG attributes and parameters. Explore more Telecom - Protection ICs devices from Onsemi

Specs

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NIV1161MTTAG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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