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SMTHDT80

STMicroelectronics

SMTHDT80 by STMicroelectronics

SMTHDT80 by STMicroelectronics is a Telecom - Protection IC with PLASTIC/EPOXY body, suitable for surge protection circuits. It operates b/w -40 to 85 °C, has 2 terminals in a small outline package style, and measures 5mm wide by 6.45mm long with a seated height of 3.1mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,362 parts In-Stock

1+ parts

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4,362

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Anansix

USA . 986 parts In-Stock

1+ parts

-

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-

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986

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Digiode

USA . 833 parts In-Stock

1+ parts

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833

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,457 parts In-Stock

1+ parts

$13.691

100+ parts

-

1k+ parts

$12.322

10k+ parts

-

1,457

$13.691

-

$12.322

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MKK Technologies

India . 378 parts In-Stock

1+ parts

$25.746

100+ parts

-

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10k+ parts

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378

$25.746

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DigiPath Technology Company

USA . 378 parts In-Stock

1+ parts

$25.746

100+ parts

-

1k+ parts

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10k+ parts

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378

$25.746

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-

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Kepictronics

USA . 99,800 parts In-Stock

1+ parts

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99,800

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-

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Parana Technologies

USA . 1,055 parts In-Stock

1+ parts

-

100+ parts

$16.370

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1,055

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$16.370

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Corphita

USA . 546 parts In-Stock

1+ parts

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546

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Overview

Protect your telecom equipment with the SMTHDT80 Surge Protection Circuit by STMicroelectronics. Designed with high-quality materials and advanced technology, this compact and versatile device offers reliable protection against power surges and voltage spikes, ensuring the longevity and performance of your valuable electronics. Whether you are a telecom professional or a DIY enthusiast, the SMTHDT80 is easy to install and will provide peace of mind knowing your devices are safeguarded. Upgrade your telecom setup today with the SMTHDT80 and enjoy uninterrupted connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection against environmental factors such as moisture and dust, ensuring longevity and reliability of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and resources during manufacturing.

Package Shape: RECTANGULAR

Rectangular shape enables compact and space-efficient design implementation in electronic devices.

No. of Terminals: 2

Having only 2 terminals simplifies the installation process and reduces chances of error during connection.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, allowing for more components to be accommodated in a limited area.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature allows for versatility in different working environments.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options, accommodating different circuit layouts.

Maximum Seated Height: 3.1 mm

Low seated height facilitates compact design and integration into slim electronic devices.

Width: 5 mm

Narrow width enables space-saving layout in the overall circuit design.

Length: 6.45 mm

Moderate length provides a balance between space efficiency and accessibility for handling during installation.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and durability in demanding applications.

Terminal Form: C BEND

C bend terminal form offers secure and stable connections, reducing the risk of disconnection or failure.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry helps safeguard telecom equipment from voltage spikes, ensuring longevity and protection against damage.

Technical Specifications

Telecom - Protection ICs SMTHDT80 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

Length:

6.45 mm

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

3.1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Width:

5 mm

Trade Compliance

SMTHDT80 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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