Loading...

NIV2161MTTAG

Onsemi

NIV2161MTTAG by Onsemi

NIV2161MTTAG by Onsemi is a surge protection circuit for telecom applications. It features a small outline package with 10 terminals, matte tin finish, and dual terminal position. With a rectangular shape and 0.8mm seated height, it is ideal for surface mount applications in the telecom industry.

Median Price

$0.663

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,950 parts In-Stock

1+ parts

$0.451

100+ parts

$0.449

1k+ parts

$0.448

10k+ parts

-

2,950

$0.451

$0.449

$0.448

-

Chip1Stop

Japan . 2,950 parts In-Stock

1+ parts

$0.733

100+ parts

$0.463

1k+ parts

-

10k+ parts

-

2,950

$0.733

$0.463

-

-

Mouser Electronics

USA . 5,246 parts In-Stock

1+ parts

$1.030

100+ parts

$0.556

1k+ parts

$0.514

10k+ parts

$0.490

5,246

$1.030

$0.556

$0.514

$0.490

DigiKey

USA . 2,544 parts In-Stock

1+ parts

$1.070

100+ parts

$0.611

1k+ parts

$0.534

10k+ parts

$0.479

2,544

$1.070

$0.611

$0.534

$0.479

Flip Electronics (Authorized)

USA . 119,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

119,835

-

-

-

-

Rochester

USA . 33,900 parts In-Stock

1+ parts

-

100+ parts

$0.593

1k+ parts

$0.492

10k+ parts

$0.439

33,900

-

$0.593

$0.492

$0.439

Verical

USA . 33,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.515

10k+ parts

-

33,900

-

-

$0.515

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,205 parts In-Stock

1+ parts

$0.428

100+ parts

-

1k+ parts

-

10k+ parts

-

1,205

$0.428

-

-

-

Vyrian

USA . 798 parts In-Stock

1+ parts

$0.451

100+ parts

-

1k+ parts

-

10k+ parts

-

798

$0.451

-

-

-

Flip Electronics

USA . 107,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

107,835

-

-

-

-

Cyclops Electronics Ltd

UK . 2,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,525

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 29,348 parts In-Stock

1+ parts

$0.383

100+ parts

-

1k+ parts

-

10k+ parts

-

29,348

$0.383

-

-

-

Corphita

USA . 1,986 parts In-Stock

1+ parts

$0.406

100+ parts

-

1k+ parts

-

10k+ parts

-

1,986

$0.406

-

-

-

Corohmni

South Africa . 480 parts In-Stock

1+ parts

$0.451

100+ parts

-

1k+ parts

-

10k+ parts

-

480

$0.451

-

-

-

Lixinc

USA . 11,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,755

-

-

-

-

Problanco Electronics

Mexico . 5,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,905

-

-

-

-

SupplyDigital Components

Austria . 5,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,567

-

-

-

-

Kulean Microsystems

USA . 4,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,734

-

-

-

-

Perfect Parts

USA . 3,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,386

-

-

-

-

TANS Electronics

Latvia . 1,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,083

-

-

-

-

UHIMA Technologies

Türkiye . 889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

889

-

-

-

-

Overview

Elevate your telecom device's performance with the NIV2161MTTAG by Onsemi. Crafted with precision and expertise, this surge protection circuit offers unmatched quality and reliability. With a compact design and dual terminal position, this IC is perfect for a wide range of telecom applications. Experience the peace of mind that comes with superior protection against surges and voltage spikes, thanks to Onsemi's cutting-edge technology. Upgrade your telecom devices today and enjoy the benefits of enhanced durability and performance with the NIV2161MTTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the internal components of the IC, ensuring reliability in harsh telecom environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and facilitating mass production of telecom devices.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design that fits well within telecom equipment, optimizing space usage and allowing for easy integration.

No. of Terminals: 10

Having 10 terminals provides multiple connection points, enabling the IC to handle various input and output signals in telecom systems effectively.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile design of the package style saves valuable space on the PCB while maintaining high performance in surge protection for telecom applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers corrosion resistance and good solderability, ensuring a reliable electrical connection for the IC in telecom devices.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in PCB layout and allows for efficient routing of signals, contributing to overall system performance.

Maximum Seated Height: 0.8 mm

The low maximum seated height makes the IC suitable for compact telecom devices with limited vertical space, enabling easy integration without compromising on protection capabilities.

Width: 2 mm

The narrow width of 2 mm allows for space-efficient placement on the PCB, making it ideal for densely populated telecom equipment and improving overall system reliability.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this IC can withstand high-temperature soldering processes, ensuring reliable and robust connections in telecom applications.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C indicates the IC's ability to withstand high-temperature soldering, ensuring proper solder joints and overall reliability in telecom devices.

Length: 3.5 mm

The compact length of 3.5 mm allows for space-efficient placement on the PCB, contributing to a streamlined design in telecom equipment without compromising on surge protection performance.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of lead contamination and makes the IC environmentally friendly, meeting modern regulatory standards for telecom components.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC safeguards telecom devices from voltage spikes and transient surges, ensuring the longevity and reliability of the equipment in various operating conditions.

Terminal Pitch: 0.675 mm

The fine terminal pitch of 0.675 mm allows for precise and compact soldering on the PCB, enabling a reliable electrical connection in telecom systems while optimizing board space.

Technical Specifications

Telecom - Protection ICs NIV2161MTTAG attributes and parameters. Explore more Telecom - Protection ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-N10

JESD-609 Code:

e3

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.675 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NIV2161MTTAG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.