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CLP270M-TR

STMicroelectronics

CLP270M-TR by STMicroelectronics

CLP270M-TR by STMicroelectronics is a Telecom IC with surge protection circuit. It features 10 terminals in a small outline package, measuring 7.5mm in width and 9.4mm in length. This surface-mount device has a terminal pitch of 1.27mm and is ideal for telecom applications requiring protection against surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,488 parts In-Stock

1+ parts

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2,488

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Digiode

USA . 1,486 parts In-Stock

1+ parts

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1,486

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Anansix

USA . 1,123 parts In-Stock

1+ parts

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1,123

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Lantek

USA . 400 parts In-Stock

1+ parts

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400

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,113 parts In-Stock

1+ parts

$13.947

100+ parts

-

1k+ parts

$12.552

10k+ parts

-

1,113

$13.947

-

$12.552

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MKK Technologies

India . 1,798 parts In-Stock

1+ parts

$26.227

100+ parts

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1,798

$26.227

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DigiPath Technology Company

USA . 1,798 parts In-Stock

1+ parts

$26.227

100+ parts

-

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1,798

$26.227

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Native Components

USA . 155 parts In-Stock

1+ parts

$26.864

100+ parts

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155

$26.864

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Northwest PG Solutions

USA . 1,154 parts In-Stock

1+ parts

$29.550

100+ parts

$26.595

1k+ parts

-

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1,154

$29.550

$26.595

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Corphita

USA . 4,085 parts In-Stock

1+ parts

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4,085

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GreenTree Electronics

Israel . 400 parts In-Stock

1+ parts

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400

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Parana Technologies

USA . 283 parts In-Stock

1+ parts

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100+ parts

$16.676

1k+ parts

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283

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$16.676

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Overview

The CLP270M-TR by STMicroelectronics is a game-changer in the world of Telecom Protection ICs. Designed with precision and expertise, this surge protection circuit offers unmatched quality and reliability. Perfect for a wide range of applications, this product provides customers with peace of mind knowing their telecom equipment is safeguarded from power surges. With its small outline and heat sink package style, along with dual terminal position and gull wing terminal form, the CLP270M-TR is a must-have for anyone looking to protect their valuable devices. Trust STMicroelectronics to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides a good balance of durability and cost-effectiveness.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly in modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this protection IC into various PCB layouts.

No. of Terminals: 10

Having multiple terminals provides flexibility in connecting the protection IC within the circuit.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline and heat sink/slug design helps in efficient heat dissipation, ensuring proper functioning of the IC.

Terminal Finish: TIN LEAD

The tin lead finish on the terminals offers good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Having dual terminal positions provides redundancy and ensures a more stable electrical connection.

Maximum Seated Height: 3.75 mm

The low seated height allows for compact PCB designs, especially in space-constrained applications.

Width: 7.5 mm

The narrow width of the IC makes it suitable for use in small electronic devices or densely populated PCBs.

Length: 9.4 mm

The compact length of the IC contributes to space-saving designs in electronic assemblies.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability during soldering and assembly processes.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Being a surge protection circuit, this IC helps safeguard telecom equipment from voltage spikes and transient surges.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for high-density mounting on the PCB, optimizing space utilization.

Technical Specifications

Telecom - Protection ICs CLP270M-TR attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e0

Length:

9.4 mm

No. of Functions:

1

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

CLP270M-TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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