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TISP9180KC-00

Texas Instruments

TISP9180KC-00 by Texas Instruments

TISP9180KC-00 by Texas Instruments is a surge protection circuit for telecom applications. It features 2 functions, operates b/w 0°C to 70°C, and has a flange mount package style. Ideal for safeguarding telecom equipment from voltage surges in commercial environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,422 parts In-Stock

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Digiode

USA . 2,806 parts In-Stock

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2,806

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Distributors (Availability)

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AZTECH Wire

Italy . 569 parts In-Stock

1+ parts

$10.165

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569

$10.165

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Parana Technologies

USA . 1,219 parts In-Stock

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$15.911

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$16.266

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1,219

$15.911

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$16.266

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DigiPath Technology Company

USA . 1,984 parts In-Stock

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$17.519

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1,984

$17.519

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IDEA Electronic Components Group

UK . 2,105 parts In-Stock

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$17.877

100+ parts

$16.983

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$16.089

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2,105

$17.877

$16.983

$16.089

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ChromeModa Solutions

Germany . 667 parts In-Stock

1+ parts

$17.877

100+ parts

$14.659

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667

$17.877

$14.659

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One Stop Electronics

USA . 1,239 parts In-Stock

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$167.000

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1,239

$167.000

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Ampacity Inc.

Singapore . 711 parts In-Stock

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$230.000

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711

$230.000

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Semicontronic

India . 551 parts In-Stock

1+ parts

$793.000

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$773.175

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$769.210

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551

$793.000

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$769.210

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Corphita

USA . 4,801 parts In-Stock

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Corohmni

South Africa . 398 parts In-Stock

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Overview

Enhance the reliability and durability of your telecom systems with the TISP9180KC-00 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch protection ICs that ensure the safety of your equipment. The TISP9180KC-00 offers superior surge protection, making it ideal for a wide range of applications in the telecom sector. Say goodbye to downtime and costly repairs with this high-quality product that provides peace of mind and added value to your operations. Trust Texas Instruments to deliver the protection your telecom systems need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the IC, ensuring a longer lifespan.

No. of Functions: 2

Having 2 functions allows for comprehensive protection against multiple types of surges or voltage fluctuations.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to mount and integrate into various telecom equipment.

No. of Terminals: 2

Having 2 terminals simplifies the installation process, making it easier for technicians to connect the IC.

Package Style (Meter): FLANGE MOUNT

The flange mount package style ensures secure and stable attachment to the equipment, preventing any dislodgement.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range of 70°C allows the IC to function reliably even in demanding conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the IC can function effectively in a wide range of environments.

Terminal Position: SINGLE

The single terminal position simplifies the installation process and ensures proper connection.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this IC is suitable for telecom systems used in commercial settings.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and reliable connection, ensuring stable performance of the IC.

Telecom IC Type: SURGE PROTECTION CIRCUIT

This IC is specifically designed for surge protection in telecom systems, offering reliable protection against voltage surges.

Technical Specifications

Telecom - Protection ICs TISP9180KC-00 attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PSFM-T2

No. of Functions:

2

No. of Terminals:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

TISP9180KC-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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