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LCP3121RL

STMicroelectronics

LCP3121RL by STMicroelectronics

STMicroelectronics LCP3121RL is a surge protection circuit in a small outline package with 8 terminals. It features nickel palladium gold terminal finish, 1.75mm seated height, and 260 °C peak reflow temperature. Ideal for telecom applications requiring surface mount protection ICs.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 72,500 parts In-Stock

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72,500

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Vyrian

USA . 5,107 parts In-Stock

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5,107

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Digiode

USA . 4,564 parts In-Stock

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4,564

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R&J Components

USA . 1,849 parts In-Stock

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1,849

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Bristol Electronics

USA . 1,571 parts In-Stock

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1,571

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LWI Electronics Inc

India . 1,495 parts In-Stock

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1,495

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ACDS - Activité Composants Distribution Service

France . 600 parts In-Stock

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600

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Infinite Electronics LLP

India . 588 parts In-Stock

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588

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Anansix

USA . 571 parts In-Stock

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571

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Mentor Electronics Marketing, LLC

USA . 500 parts In-Stock

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500

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Speed Components Ltd

Israel . 495 parts In-Stock

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495

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 23 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,909 parts In-Stock

1+ parts

$14.093

100+ parts

-

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$12.683

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1,909

$14.093

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$12.683

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AZTECH Wire

Italy . 770 parts In-Stock

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$20.070

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770

$20.070

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MKK Technologies

India . 1,184 parts In-Stock

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$26.500

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$26.500

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DigiPath Technology Company

USA . 1,184 parts In-Stock

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$26.500

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$26.500

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Perfect Parts

USA . 8,368 parts In-Stock

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Corphita

USA . 4,331 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,700 parts In-Stock

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Kepictronics

USA . 3,351 parts In-Stock

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Assy Fe

Spain . 2,390 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,322 parts In-Stock

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GreenTree Electronics

Israel . 1,571 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 1,571 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,571 parts In-Stock

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1,571

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Alle Elektronik GmbH

Germany . 1,548 parts In-Stock

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RC Electronics

USA . 500 parts In-Stock

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500

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Glotronic Ltd.

UK . 480 parts In-Stock

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480

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Parana Technologies

USA . 401 parts In-Stock

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$16.850

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401

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$16.850

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Overview

Experience unparalleled protection with the LCP3121RL by STMicroelectronics. Designed with precision and quality in mind, this Telecom - Protection IC offers exceptional reliability and performance. Perfect for a wide range of applications, this product provides peace of mind with its surge protection circuit ensuring your devices are safeguarded at all times. Trust in STMicroelectronics to deliver cutting-edge solutions that prioritize your safety and satisfaction. Upgrade to the LCP3121RL today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for telecommunications equipment that may be subject to rough handling or environmental factors.

Surface Mount: YES

Being surface mountable means easy and efficient assembly onto circuit boards, saving time and effort during manufacturing processes.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for various input and output connections, making the product versatile and adaptable to different system configurations.

Maximum Seated Height: 1.75 mm

The low seated height profile allows for compact and space-saving designs in telecom equipment, especially in devices where size constraints are a concern.

Width: 3.9 mm

The narrow width of 3.9 mm enables the product to be used in applications where space is limited, making it a suitable choice for compact telecom devices.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260 °C, the IC can withstand the soldering process without damage, ensuring reliable and stable performance in manufacturing environments.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this product is designed to safeguard telecom equipment from voltage surges and transient overvoltage events, helping to protect sensitive components and ensure operational integrity.

Technical Specifications

Telecom - Protection ICs LCP3121RL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LCP3121RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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