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LCP3121

STMicroelectronics

LCP3121 by STMicroelectronics

LCP3121 by STMicroelectronics is a Telecom Surge Protection IC with 8 terminals in a small outline package. It features Gull Wing terminal form, measures 3.9mm in width, and is designed for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,469 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,469

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-

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Vyrian

USA . 2,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,870

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Anansix

USA . 2,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,704

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-

-

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ECAB

Sweden . 156 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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156

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,763 parts In-Stock

1+ parts

$8.851

100+ parts

-

1k+ parts

$7.966

10k+ parts

-

1,763

$8.851

-

$7.966

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MKK Technologies

India . 650 parts In-Stock

1+ parts

$16.644

100+ parts

-

1k+ parts

-

10k+ parts

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650

$16.644

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-

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DigiPath Technology Company

USA . 650 parts In-Stock

1+ parts

$16.644

100+ parts

-

1k+ parts

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10k+ parts

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650

$16.644

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-

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Corphita

USA . 4,265 parts In-Stock

1+ parts

-

100+ parts

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4,265

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-

-

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Parana Technologies

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$10.583

1k+ parts

-

10k+ parts

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600

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$10.583

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Overview

Elevate your telecom equipment's reliability with the LCP3121 surge protection circuit from STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers cutting-edge solutions to ensure optimal performance and protection for your devices. Ideal for various telecom applications, this small outline package offers ease of installation and superior protection against surges. Trust STMicroelectronics to provide you with the value, benefits, and advantages that your telecom equipment deserves.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the IC, ensuring reliable performance in telecom applications.

Surface Mount: YES

Surface mount capability allows for easy installation onto PCBs, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape is commonly used for telecom ICs, making it easy to integrate into existing designs and enclosures.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the IC to other components in the circuit, allowing for versatile use in different telecom applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact telecom devices or systems.

Terminal Position: DUAL

Dual terminal position allows for improved stability and reliability of connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 1.75 mm

Low seated height helps in keeping the overall profile of the IC and PCB compact, especially beneficial for telecom equipment with space constraints.

Width: 3.9 mm

Narrow width enables efficient use of space on the PCB, contributing to an overall compact design of the telecom system.

Length: 4.9 mm

Short length of the IC allows for efficient use of space on the PCB, particularly advantageous for miniaturized telecom devices.

Terminal Form: GULL WING

Gull wing terminal form ensures secure and reliable solder connections, enhancing the durability and longevity of the IC in telecom applications.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry helps in safeguarding telecom equipment from voltage spikes and surges, ensuring the longevity and reliability of the overall system.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density packaging on the PCB, making it suitable for telecom applications where space optimization is crucial.

Technical Specifications

Telecom - Protection ICs LCP3121 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

LCP3121 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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