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TISP7180KC-00

Texas Instruments

TISP7180KC-00 by Texas Instruments

TISP7180KC-00 by Texas Instruments is a surge protection circuit for telecom applications. It features 2 functions, operates b/w 0°C to 70°C, and has a flange mount package style. Ideal for safeguarding telecom equipment from voltage surges in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

5,200

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-

-

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Digiode

USA . 2,482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,482

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 828 parts In-Stock

1+ parts

$8.394

100+ parts

-

1k+ parts

$9.026

10k+ parts

-

828

$8.394

-

$9.026

-

ChromeModa Solutions

Germany . 479 parts In-Stock

1+ parts

$9.432

100+ parts

$7.734

1k+ parts

-

10k+ parts

-

479

$9.432

$7.734

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-

IDEA Electronic Components Group

UK . 201 parts In-Stock

1+ parts

$9.432

100+ parts

$8.960

1k+ parts

$8.489

10k+ parts

-

201

$9.432

$8.960

$8.489

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AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$9.693

100+ parts

-

1k+ parts

-

10k+ parts

-

888

$9.693

-

-

-

One Stop Electronics

USA . 1,151 parts In-Stock

1+ parts

$971.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,151

$971.000

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-

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Corphita

USA . 2,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,630

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-

-

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DigiPath Technology Company

USA . 2,078 parts In-Stock

1+ parts

-

100+ parts

$8.504

1k+ parts

-

10k+ parts

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2,078

-

$8.504

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Overview

Elevate your telecom systems with the TISP7180KC-00 by Texas Instruments, a top-tier surge protection circuit designed to safeguard your equipment from power surges and spikes. With a reputation for excellence in manufacturing quality components, Texas Instruments brings you a reliable solution that not only protects your investment but also ensures uninterrupted communication. Ideal for a wide range of telecom applications, this product offers peace of mind, durability, and superior performance, making it a valuable addition to your setup. Trust Texas Instruments to deliver innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making this product a good choice for long-term use in telecom applications.

No. of Functions: 2

Having 2 functions within the IC provides added protection and functionality, making it a versatile and efficient choice for telecom applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement within telecom devices, optimizing space and design efficiency.

No. of Terminals: 3

With 3 terminals, this IC offers flexibility in connectivity options, allowing for versatile usage in various telecom circuit designs.

Package Style (Meter): FLANGE MOUNT

The flange mount package style enables easy and secure mounting onto telecom devices, ensuring stability and reliability in operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliability and performance even in challenging environmental conditions, making it suitable for telecom applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the IC can function effectively in a wide range of temperature conditions, making it a reliable choice for telecom applications.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and connection processes, making this IC user-friendly and easy to integrate into telecom systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this IC meets industry standards for reliability and performance, making it a trusted choice for telecom applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection, reducing the risk of disconnection or malfunction, making this IC a reliable choice for telecom protection circuits.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Being a surge protection circuit type, this IC offers robust protection against voltage spikes and surges, ensuring the safety and integrity of telecom equipment, making it an essential component for telecom systems.

Technical Specifications

Telecom - Protection ICs TISP7180KC-00 attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PSFM-T3

No. of Functions:

2

No. of Terminals:

3

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

TISP7180KC-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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