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IP4238CZ10,115

NXP Semiconductors

IP4238CZ10,115 by NXP Semiconductors

IP4238CZ10,115 by NXP Semiconductors is a surge protection IC designed for telecom applications. It features a compact 2.6mm x 2.6mm size, operates b/w -40 °C to 125 °C, and supports surface mount with no lead terminals. Ideal for automotive environments, it ensures reliable circuit protection.

Median Price

$0.630

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45,862 parts In-Stock

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$0.619

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$0.513

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$0.458

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$0.619

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Verical

USA . 45,862 parts In-Stock

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$0.642

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$0.572

45,862

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$0.642

$0.572

Distributors (In-Stock)

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Digiode

USA . 1,100 parts In-Stock

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$0.247

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Vyrian

USA . 8,639 parts In-Stock

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Anansix

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,806 parts In-Stock

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$0.234

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AZTECH Wire

Italy . 12,919 parts In-Stock

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Kepictronics

USA . 72,540 parts In-Stock

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Metaverse IC Inc.

Canada . 66,540 parts In-Stock

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UNI Independent Distributors

Spain . 7,924 parts In-Stock

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Supply Digital

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Authorized Procurement Solutions

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Overview

Elevate your telecom designs with the IP4238CZ10,115 from NXP Semiconductors, a leader in innovation and quality. This robust surge protection IC ensures your systems remain safe and reliable under extreme conditions, thanks to its wide temperature range and compact design. Perfect for automotive applications, it delivers exceptional performance while safeguarding against voltage spikes. Choose NXP for unparalleled reliability and elevate your projects with cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and stability under varying environmental conditions, making the product reliable in diverse applications.

Surface Mount: YES

Surface mount technology allows for efficient space-saving layouts on PCBs, facilitating easier assembly and integration into compact electronic devices.

Package Shape: SQUARE

The square package shape optimizes the use of board space while providing uniform thermal performance and electrical characteristics.

No. of Terminals: 10

With 10 terminals, the design allows for versatile connectivity options, enhancing the integration capabilities with various circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and very thin profile make it ideal for applications where space is at a premium, enabling efficient integration into compact devices.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C provides assurance of performance reliability under high-temperature conditions, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C ensures functionality in extreme environmental conditions, making it suitable for outdoor and harsh environments.

Terminal Position: DUAL

Dual terminal positioning enhances the layout flexibility and ease of integration in multilayer PCBs, simplifying design and assembly processes.

Maximum Seated Height: 0.5 mm

0.5 mm seated height aids in maintaining low-profile designs, perfect for enhancing the compactness of electronic devices.

Width: 2.6 mm

A compact width of 2.6 mm allows for better placement efficiency in tight PCB layouts, catering to miniature and space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Limiting the peak reflow time to 30 seconds minimizes the risk of thermal damage during assembly, ensuring better reliability of the IC.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with modern soldering processes, enhancing manufacturability and assembly efficiency.

Length: 2.6 mm

With a length of 2.6 mm, the IC supports compact device designs, ideal for portable electronics and applications with space constraints.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent temperature and reliability standards, ensuring safe and effective operation in vehicular environments.

Terminal Form: NO LEAD

The no-lead terminal form minimizes the footprint and enhances the thermal performance, making the IC ideal for high-density applications.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC provides vital protection against voltage spikes, ensuring the longevity and reliability of telecom equipment.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density designs and improves interconnectivity with other components, benefiting modern circuit design needs.

Technical Specifications

Telecom - Protection ICs IP4238CZ10,115 attributes and parameters. Explore more Telecom - Protection ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PDSO-N10

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.6 mm

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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