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SMP80MC-140

STMicroelectronics

SMP80MC-140 by STMicroelectronics

SMP80MC-140 by STMicroelectronics is a surge protection circuit designed for telecom applications. It features a compact rectangular package with 2 terminals, measuring 4.325 mm x 3.625 mm and withstands peak reflow temps of up to 260 °C. Ideal for safeguarding sensitive electronics from voltage spikes.

Median Price

$0.670

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3 parts In-Stock

1+ parts

$0.670

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$0.670

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,027 parts In-Stock

1+ parts

$0.636

100+ parts

-

1k+ parts

-

10k+ parts

-

4,027

$0.636

-

-

-

Vyrian

USA . 6,261 parts In-Stock

1+ parts

-

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6,261

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-

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Anansix

USA . 919 parts In-Stock

1+ parts

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919

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,581 parts In-Stock

1+ parts

$0.603

100+ parts

-

1k+ parts

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3,581

$0.603

-

-

-

IDEA Electronic Components Group

UK . 284 parts In-Stock

1+ parts

$11.856

100+ parts

-

1k+ parts

$10.670

10k+ parts

-

284

$11.856

-

$10.670

-

MKK Technologies

India . 1,689 parts In-Stock

1+ parts

$22.295

100+ parts

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1,689

$22.295

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-

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DigiPath Technology Company

USA . 1,689 parts In-Stock

1+ parts

$22.295

100+ parts

-

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10k+ parts

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1,689

$22.295

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Kepictronics

USA . 88,000 parts In-Stock

1+ parts

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88,000

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Perfect Parts

USA . 7,315 parts In-Stock

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7,315

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A-Z Elektronik GmbH

Germany . 5,538 parts In-Stock

1+ parts

-

100+ parts

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5,538

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-

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Cyclops Electronics Ltd (Excess)

UK . 2,490 parts In-Stock

1+ parts

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2,490

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Parana Technologies

USA . 1,234 parts In-Stock

1+ parts

-

100+ parts

$14.176

1k+ parts

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10k+ parts

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1,234

-

$14.176

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

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Overview

Unlock the potential of your telecom applications with the SMP80MC-140 from STMicroelectronics—an industry leader renowned for high-quality, reliable components. This robust surge protection IC offers unparalleled safety and efficiency in a compact design, ensuring your systems stay safeguarded against voltage spikes. Choose SMP80MC-140 for peace of mind, exceptional performance, and the trusted craftsmanship that only STMicroelectronics can provide. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material helps in providing excellent protection against environmental factors, ensuring long-term reliability.

Surface Mount: YES

Being a surface mount component facilitates easier and more efficient assembly processes, making it suitable for high-density PCB designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCB layouts, optimizing performance and design flexibility.

No. of Terminals: 2

Having two terminals simplifies the integration process and makes it easier to manage connections in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact electronic designs, enabling manufacturers to save valuable board space.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent solderability and enhanced corrosion resistance, improving the overall performance of the IC.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in layout and enhances the product's adaptability in different applications.

Maximum Seated Height: 2.65 mm

A low seated height ensures compatibility with slim profile designs, making it suitable for modern compact telecom devices.

Width: 3.625 mm

The width of 3.625 mm offers a balance between compactness and robustness, contributing to overall design efficiency.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum exposure time of 30 seconds at peak reflow temperature minimizes the risk of thermal damage, thus enhancing durability.

Peak Reflow Temperature: 260 °C

With a peak reflow temperature of 260 °C, this IC can withstand typical soldering processes without compromising performance.

Length: 4.325 mm

The length of 4.325 mm is suitable for a variety of circuit configurations, allowing for versatile integration into differing applications.

Terminal Form: C BEND

C bend terminal form provides mechanical stability and reduces stress on the solder joints, enhancing long-term reliability.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC is essential for safeguarding sensitive telecom equipment against voltage spikes, ensuring operational safety.

Technical Specifications

Telecom - Protection ICs SMP80MC-140 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Length:

4.325 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.625 mm

Trade Compliance

SMP80MC-140 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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