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SMP80MC-320

STMicroelectronics

SMP80MC-320 by STMicroelectronics

SMP80MC-320 by STMicroelectronics is a Telecom IC for surge protection circuits. It features a small outline package with matte tin finish, dual terminals, and plastic/epoxy body material. With dimensions of 4.325mm x 3.625mm x 2.65mm, it can withstand peak reflow temperature of 260°C for up to 30 seconds.

Median Price

$0.407

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.407

300

-

-

-

$0.407

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 40 parts In-Stock

1+ parts

$0.424

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$0.424

-

-

-

Digiode

USA . 3,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,475

-

-

-

-

Zilex Electronics Inc.

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Anansix

USA . 1,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,480

-

-

-

-

Vyrian

USA . 1,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,053

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,616 parts In-Stock

1+ parts

$0.424

100+ parts

-

1k+ parts

-

10k+ parts

$0.416

4,616

$0.424

-

-

$0.416

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.424

100+ parts

$0.416

1k+ parts

-

10k+ parts

-

2,000

$0.424

$0.416

-

-

Argo Parts USA

USA . 328 parts In-Stock

1+ parts

$0.424

100+ parts

-

1k+ parts

-

10k+ parts

$0.411

328

$0.424

-

-

$0.411

IDEA Electronic Components Group

UK . 643 parts In-Stock

1+ parts

$10.086

100+ parts

-

1k+ parts

$9.077

10k+ parts

-

643

$10.086

-

$9.077

-

MKK Technologies

India . 1,888 parts In-Stock

1+ parts

$18.966

100+ parts

-

1k+ parts

-

10k+ parts

-

1,888

$18.966

-

-

-

DigiPath Technology Company

USA . 1,888 parts In-Stock

1+ parts

$18.966

100+ parts

-

1k+ parts

-

10k+ parts

-

1,888

$18.966

-

-

-

Ampacity Inc.

Singapore . 1,220 parts In-Stock

1+ parts

$817.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

$817.000

-

-

-

Metaverse IC Inc.

Canada . 99,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

99,800

-

-

-

-

Corphita

USA . 3,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,584

-

-

-

-

Parana Technologies

USA . 2,064 parts In-Stock

1+ parts

-

100+ parts

$12.059

1k+ parts

-

10k+ parts

-

2,064

-

$12.059

-

-

Overview

Enhance the reliability and protection of your telecom systems with the SMP80MC-320 by STMicroelectronics. Known for their top-quality products, STMicroelectronics delivers cutting-edge technology and superior performance in the field of surge protection circuits. This small outline package is designed for easy integration into your telecom setups, offering peace of mind against unexpected surges and ensuring seamless operation. Upgrade your systems today with the SMP80MC-320 and experience unmatched quality and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, making this product ideal for telecom applications that require long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular shape provides compatibility with standard PCB layouts and makes integration into existing designs seamless.

No. of Terminals: 2

Having only 2 terminals simplifies the installation process and reduces the risk of errors during connections.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for more compact and efficient design layouts.

Terminal Finish: MATTE TIN

Matte Tin finish on terminals ensures good electrical connectivity and corrosion resistance, enhancing the overall performance and longevity of the product.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and allows for improved electrical connections, reducing the risk of signal interference.

Maximum Seated Height: 2.65 mm

Low seated height enables the product to be used in compact telecom equipment without compromising on protection capabilities.

Width: 3.625 mm

Narrow width of the product allows for efficient usage of PCB space and facilitates easy integration into various telecom devices.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product can withstand high temperatures during the assembly process without compromising on performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures robustness during the manufacturing process, making this product suitable for industrial applications.

Length: 4.325 mm

Compact length facilitates easy placement on the PCB and allows for flexibility in design layouts for telecom equipment.

Terminal Form: C BEND

C Bend terminal form ensures secure and stable connections, reducing the risk of disconnections or signal loss in telecom applications.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuit design helps safeguard telecom equipment from voltage spikes and ensures reliable operation in challenging environments.

Technical Specifications

Telecom - Protection ICs SMP80MC-320 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-C2

JESD-609 Code:

e3

Length:

4.325 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

2

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOC

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.625 mm

Trade Compliance

SMP80MC-320 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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