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LCP02-150B1RL

STMicroelectronics

LCP02-150B1RL by STMicroelectronics

STMicroelectronics LCP02-150B1RL is a surge protection circuit for telecom applications. It features 8 terminals, matte tin finish, and operates b/w -20°C to 85°C. With a small outline package style and gull wing terminal form, it is ideal for telecom protection in compact designs.

Median Price

$2.590

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,585 parts In-Stock

1+ parts

$2.450

100+ parts

$1.240

1k+ parts

$0.996

10k+ parts

$0.805

1,585

$2.450

$1.240

$0.996

$0.805

DigiKey

USA . 63 parts In-Stock

1+ parts

$2.730

100+ parts

-

1k+ parts

-

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63

$2.730

-

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Avnet

USA . 1,500 parts In-Stock

1+ parts

-

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1,500

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Distributors (In-Stock)

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Flip Electronics

USA . 1,500 parts In-Stock

1+ parts

$0.145

100+ parts

-

1k+ parts

-

10k+ parts

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1,500

$0.145

-

-

-

Digiode

USA . 2,483 parts In-Stock

1+ parts

$2.546

100+ parts

-

1k+ parts

-

10k+ parts

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2,483

$2.546

-

-

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Vyrian

USA . 2,362 parts In-Stock

1+ parts

$2.680

100+ parts

-

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2,362

$2.680

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Chip Stock

USA . 37,330 parts In-Stock

1+ parts

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37,330

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ComSIT Distribution GmbH

Germany . 2,252 parts In-Stock

1+ parts

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2,252

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-

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Bristol Electronics

USA . 1,317 parts In-Stock

1+ parts

-

100+ parts

$1.062

1k+ parts

$0.595

10k+ parts

$0.561

1,317

-

$1.062

$0.595

$0.561

ACDS - Activité Composants Distribution Service

France . 1,317 parts In-Stock

1+ parts

-

100+ parts

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1,317

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Dan-Mar Components

USA . 1,317 parts In-Stock

1+ parts

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1,317

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LIBRA Elektronik GmbH

Germany . 1,180 parts In-Stock

1+ parts

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1,180

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LWI Electronics Inc

India . 690 parts In-Stock

1+ parts

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690

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Anansix

USA . 270 parts In-Stock

1+ parts

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270

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Vectronix, Inc

USA . 156 parts In-Stock

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156

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Cyclops Electronics Ltd

UK . 69 parts In-Stock

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69

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Distributors (Availability)

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Corphita

USA . 3,776 parts In-Stock

1+ parts

$2.412

100+ parts

-

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3,776

$2.412

-

-

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IDEA Electronic Components Group

UK . 569 parts In-Stock

1+ parts

$14.351

100+ parts

-

1k+ parts

$12.916

10k+ parts

-

569

$14.351

-

$12.916

-

MKK Technologies

India . 1,546 parts In-Stock

1+ parts

$26.986

100+ parts

-

1k+ parts

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10k+ parts

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1,546

$26.986

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DigiPath Technology Company

USA . 1,546 parts In-Stock

1+ parts

$26.986

100+ parts

-

1k+ parts

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10k+ parts

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1,546

$26.986

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Perfect Parts

USA . 12,793 parts In-Stock

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12,793

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Metaverse IC Inc.

Canada . 2,985 parts In-Stock

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2,985

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A-Z Elektronik GmbH

Germany . 2,636 parts In-Stock

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2,636

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Parana Technologies

USA . 2,054 parts In-Stock

1+ parts

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$17.159

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2,054

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$17.159

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Alle Elektronik GmbH

Germany . 1,757 parts In-Stock

1+ parts

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1,757

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GreenTree Electronics

Israel . 878 parts In-Stock

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878

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Legend Electronics Inc. (Excess)

USA . 878 parts In-Stock

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878

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Speed Components Ltd (Excess)

Israel . 878 parts In-Stock

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878

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Lixinc

USA . 807 parts In-Stock

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807

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Kepictronics

USA . 655 parts In-Stock

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655

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Cyclops Electronics Ltd (Excess)

UK . 246 parts In-Stock

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246

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Overview

Experience the ultimate protection with the LCP02-150B1RL by STMicroelectronics. As a leading manufacturer in Telecom Protection ICs, STMicroelectronics delivers top-notch quality and reliability. This surge protection circuit is designed for various applications, ensuring the safety and longevity of your telecom devices. Say goodbye to worries about voltage spikes and surges, as this product offers unmatched value and benefits to keep your equipment safe and running smoothly. Trust STMicroelectronics to provide superior protection for your telecom needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the IC, ensuring long-term reliability in a variety of environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, making it suitable for mass production and integration into telecom equipment.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easy placement in circuit designs, optimizing board space for other components.

No. of Terminals: 8

Having 8 terminals provides flexibility in connections and signal routing, enabling the IC to be used in a variety of applications within the telecom industry.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh environmental conditions and ensure reliable performance in extreme temperatures.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature range allows the IC to function effectively in colder climates or when exposed to cold air, making it versatile for different usage scenarios.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures good electrical conductivity, maintaining signal integrity and minimizing the risk of performance degradation over time.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and allow for versatile installation options, accommodating different board layouts and requirements.

Maximum Seated Height: 2.5 mm

The compact maximum seated height enables the IC to be used in space-constrained designs without compromising on performance or functionality.

Width: 5.62 mm

The narrow width of the IC makes it suitable for applications where board space is limited, allowing for efficient use of space in densely populated PCBs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints and secure attachment to the PCB during the assembly process, contributing to overall product quality and durability.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering during assembly, providing a strong and reliable connection that enhances the performance and longevity of the IC.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC helps safeguard telecom equipment from voltage spikes and surges, ensuring the protection of sensitive components and preventing damage due to transient events.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and secure connections during installation, ensuring proper alignment and reducing the risk of electrical shorts or signal interference.

Technical Specifications

Telecom - Protection ICs LCP02-150B1RL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.62 mm

Trade Compliance

LCP02-150B1RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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