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TISP61521D

Texas Instruments

TISP61521D by Texas Instruments

TISP61521D by Texas Instruments is a Telecom IC with surge protection circuit. It features 8 terminals in small outline package, Gull Wing terminal form, and 1.27mm pitch. Ideal for telecom applications requiring surface mount protection against surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,740 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,740

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Vyrian

USA . 1,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,976

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 230 parts In-Stock

1+ parts

$12.419

100+ parts

-

1k+ parts

-

10k+ parts

-

230

$12.419

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-

-

Parana Technologies

USA . 943 parts In-Stock

1+ parts

$13.923

100+ parts

-

1k+ parts

$14.404

10k+ parts

-

943

$13.923

-

$14.404

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DigiPath Technology Company

USA . 992 parts In-Stock

1+ parts

$15.331

100+ parts

$14.105

1k+ parts

-

10k+ parts

-

992

$15.331

$14.105

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-

ChromeModa Solutions

Germany . 6,692 parts In-Stock

1+ parts

$15.644

100+ parts

$12.828

1k+ parts

-

10k+ parts

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6,692

$15.644

$12.828

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IDEA Electronic Components Group

UK . 165 parts In-Stock

1+ parts

$15.644

100+ parts

$14.862

1k+ parts

$14.080

10k+ parts

-

165

$15.644

$14.862

$14.080

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One Stop Electronics

USA . 1,193 parts In-Stock

1+ parts

$362.000

100+ parts

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1,193

$362.000

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Corphita

USA . 2,631 parts In-Stock

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2,631

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Overview

Experience unparalleled quality and protection with the TISP61521D by Texas Instruments. As a leading manufacturer in the telecom industry, Texas Instruments delivers exceptional products that guarantee reliability and performance. The TISP61521D is a must-have surge protection circuit that ensures your telecom equipment is safeguarded against unexpected power surges and voltage spikes. With its small outline package style and dual terminal position, this product offers ease of installation and peace of mind. Trust Texas Instruments to provide superior telecom protection ICs for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good thermal conductivity and electrical insulation, making the IC reliable and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient placement and orientation on the PCB, optimizing space usage.

No. of Terminals: 8

Having 8 terminals provides flexibility in connection options and functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact telecom devices.

Terminal Position: DUAL

Dual terminal position allows for better stability and reliability in connection.

Maximum Seated Height: 1.75 mm

Low seated height enables slim and sleek design, suitable for thin telecom devices.

Width: 3.9 mm

Narrow width allows for efficient use of space on the PCB, accommodating other components easily.

Length: 4.9 mm

Short length contributes to overall compactness of the IC, fitting well in tight spaces.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering process, enhancing assembly efficiency.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuit ensures the safety of telecom equipment by regulating voltage spikes and surges.

Terminal Pitch: 1.27 mm

Close terminal pitch allows for high-density packaging on the PCB, optimizing component layout.

Technical Specifications

Telecom - Protection ICs TISP61521D attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP61521D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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