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NIS1161MTTAG

Onsemi

NIS1161MTTAG by Onsemi

NIS1161MTTAG by Onsemi is a Telecom Surge Protection IC with a package style of Small Outline, Heat Sink/Slug, and Very Thin Profile. It operates in temperatures ranging from -55 to 150 °C and features a matte tin terminal finish. Ideal for telecom applications requiring protection against surges.

Median Price

$0.704

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,000 parts In-Stock

1+ parts

$0.647

100+ parts

$0.608

1k+ parts

$0.550

10k+ parts

-

24,000

$0.647

$0.608

$0.550

-

Arrow

USA . 10,078 parts In-Stock

1+ parts

$0.761

100+ parts

$0.650

1k+ parts

-

10k+ parts

$0.539

10,078

$0.761

$0.650

-

$0.539

Mouser Electronics

USA . 2,799 parts In-Stock

1+ parts

$0.790

100+ parts

$0.679

1k+ parts

$0.668

10k+ parts

$0.554

2,799

$0.790

$0.679

$0.668

$0.554

DigiKey

USA . 9,419 parts In-Stock

1+ parts

$2.250

100+ parts

$0.972

1k+ parts

$0.709

10k+ parts

$0.554

9,419

$2.250

$0.972

$0.709

$0.554

Verical

USA . 198,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.558

198,000

-

-

-

$0.558

Chip1Stop

Japan . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.547

15,000

-

-

-

$0.547

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 61 parts In-Stock

1+ parts

$0.547

100+ parts

-

1k+ parts

-

10k+ parts

-

61

$0.547

-

-

-

Digiode

USA . 1,638 parts In-Stock

1+ parts

$0.615

100+ parts

-

1k+ parts

-

10k+ parts

-

1,638

$0.615

-

-

-

Flip Electronics

USA . 165,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

165,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,585 parts In-Stock

1+ parts

$0.465

100+ parts

-

1k+ parts

-

10k+ parts

-

13,585

$0.465

-

-

-

Corohmni

South Africa . 423 parts In-Stock

1+ parts

$0.534

100+ parts

-

1k+ parts

-

10k+ parts

-

423

$0.534

-

-

-

Corphita

USA . 1,934 parts In-Stock

1+ parts

$0.582

100+ parts

-

1k+ parts

-

10k+ parts

-

1,934

$0.582

-

-

-

Problanco Electronics

Mexico . 5,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,786

-

-

-

-

Perfect Parts

USA . 4,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,592

-

-

-

-

TANS Electronics

Latvia . 2,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,631

-

-

-

-

SupplyDigital Components

Austria . 1,641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,641

-

-

-

-

Kulean Microsystems

USA . 1,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,385

-

-

-

-

UHIMA Technologies

Türkiye . 279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

279

-

-

-

-

Overview

Enhance the performance and reliability of your telecom systems with the NIS1161MTTAG surge protection circuit by Onsemi. Manufactured with top-quality materials and advanced technology, this small outline IC offers superior protection against voltage surges, ensuring the longevity of your equipment. Ideal for telecom applications, this product boasts a wide operating temperature range, dual terminal position, and military-grade durability. Trust Onsemi to provide you with the best-in-class solutions for your telecom protection needs. Experience peace of mind knowing your systems are safeguarded with the NIS1161MTTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection against external elements, making this IC suitable for telecom applications where robustness is essential.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto printed circuit boards, saving time and effort in the assembly process.

Package Shape: SQUARE

Square package shape optimizes space utilization on the PCB, making it ideal for compact telecom equipment designs.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance in demanding telecom environments where temperature fluctuations are common.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature provides flexibility in deployment, allowing this IC to function effectively in extreme cold conditions as well.

Terminal Finish: MATTE TIN

Matte Tin finish on terminals enhances solderability and conductivity, ensuring secure connections for uninterrupted telecom operations.

Temperature Grade: MILITARY

Military-grade temperature grade indicates robustness and resilience, making this IC suitable for harsh environmental conditions typically encountered in military and industrial telecom applications.

Technical Specifications

Telecom - Protection ICs NIS1161MTTAG attributes and parameters. Explore more Telecom - Protection ICs devices from Onsemi

Specs

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NIS1161MTTAG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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