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TSI200B1

STMicroelectronics

TSI200B1 by STMicroelectronics

STMicroelectronics TSI200B1 is a Telecom IC with surge protection circuit. It features 8 terminals in small outline package, measuring 3.9mm width and 4.9mm length with gull wing terminal form. Ideal for telecom applications requiring surface mount protection against surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,345 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,345

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Vyrian

USA . 1,881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,881

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Digiode

USA . 288 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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288

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 46 parts In-Stock

1+ parts

$6.024

100+ parts

-

1k+ parts

$5.422

10k+ parts

-

46

$6.024

-

$5.422

-

MKK Technologies

India . 1,155 parts In-Stock

1+ parts

$11.328

100+ parts

-

1k+ parts

-

10k+ parts

-

1,155

$11.328

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DigiPath Technology Company

USA . 1,155 parts In-Stock

1+ parts

$11.328

100+ parts

-

1k+ parts

-

10k+ parts

-

1,155

$11.328

-

-

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Parana Technologies

USA . 2,246 parts In-Stock

1+ parts

-

100+ parts

$7.203

1k+ parts

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10k+ parts

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2,246

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$7.203

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Corphita

USA . 897 parts In-Stock

1+ parts

-

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897

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Overview

Upgrade your telecom systems with the TSI200B1 by STMicroelectronics! Designed with top-notch quality and expertise, this surge protection circuit offers unmatched reliability and performance. Safeguard your equipment from power surges and ensure uninterrupted communication with this small outline package that is easy to install. Trust in STMicroelectronics' reputation for excellence in the industry and experience the value and benefits of superior protection for your telecom applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external elements, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient utilization of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 8

Having 8 terminals allows for connectivity with multiple components, enhancing the functionality and versatility of the product.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for designs where size is a constraint.

Terminal Position: DUAL

Dual terminal position provides stability and better contact with the circuit board, ensuring reliable performance under various conditions.

Maximum Seated Height: 1.75 mm

Low seated height makes this product suitable for applications with limited vertical space, enabling compact and efficient designs.

Width: 3.9 mm

Narrow width allows for the placement of multiple components in a limited space, improving overall circuit density and functionality.

Length: 4.9 mm

Compact length dimension facilitates easy integration into PCB layouts, especially in designs with size constraints.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and stability during soldering, ensuring secure connections for reliable performance.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Surge protection circuitry helps safeguard sensitive electronic components from voltage spikes and ensures reliable operation in telecom applications.

Terminal Pitch: 1.27 mm

Close terminal pitch allows for high-density mounting on the PCB, enabling efficient use of space and enhancing overall design flexibility.

Technical Specifications

Telecom - Protection ICs TSI200B1 attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TSI200B1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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