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TSI200B1RL

STMicroelectronics

TSI200B1RL by STMicroelectronics

STMicroelectronics TSI200B1RL is a surge protection circuit in a small outline package with 8 terminals. It features nickel palladium gold terminal finish, gull wing form, and dual position. Ideal for telecom applications requiring surface mount protection ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,452 parts In-Stock

1+ parts

-

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3,452

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Vyrian

USA . 2,667 parts In-Stock

1+ parts

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2,667

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A&K Electronics

USA . 2,540 parts In-Stock

1+ parts

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2,540

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Bristol Electronics

USA . 2,540 parts In-Stock

1+ parts

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1k+ parts

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2,540

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-

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Anansix

USA . 2,401 parts In-Stock

1+ parts

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2,401

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Rotakorn

Sweden . 1,780 parts In-Stock

1+ parts

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1,780

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,220 parts In-Stock

1+ parts

$9.424

100+ parts

-

1k+ parts

$8.482

10k+ parts

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1,220

$9.424

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$8.482

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MKK Technologies

India . 1,507 parts In-Stock

1+ parts

$17.722

100+ parts

-

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1,507

$17.722

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DigiPath Technology Company

USA . 1,507 parts In-Stock

1+ parts

$17.722

100+ parts

-

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10k+ parts

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1,507

$17.722

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Benley Electronics

USA . 2,920 parts In-Stock

1+ parts

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2,920

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Corphita

USA . 2,450 parts In-Stock

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2,450

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Parana Technologies

USA . 1,212 parts In-Stock

1+ parts

-

100+ parts

$11.268

1k+ parts

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1,212

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$11.268

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Overview

Protect your valuable telecom equipment with the TSI200B1RL surge protection circuit from STMicroelectronics. With a reputation for quality and reliability, STMicroelectronics delivers cutting-edge technology in a compact and easy-to-install package. The TSI200B1RL offers superior protection against power surges, ensuring your equipment stays safe and operational. Perfect for a wide range of telecom applications, this product provides peace of mind and long-lasting performance. Trust STMicroelectronics to keep your telecom systems running smoothly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the integrated circuit.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, making it suitable for mass production.

Package Shape: RECTANGULAR

The rectangular package shape makes it easier to integrate into electronic systems and saves space on the PCB.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for various configurations in the circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it suitable for compact electronic devices where space is a constraint.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Maximum Seated Height: 1.75 mm

The low seated height allows for a slim and compact overall profile of the IC, making it suitable for thin devices.

Width: 3.9 mm

The narrow width of the IC enables high packing density on the PCB, optimizing space utilization in electronic designs.

Length: 4.9 mm

The compact length of the IC contributes to space-saving on the PCB while providing sufficient room for other components.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto the PCB, ensuring secure connections and reliable operation.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC helps safeguard telecom equipment from voltage spikes and transient surges, enhancing system reliability.

Terminal Pitch: 1.27 mm

The narrow terminal pitch allows for high-density mounting on the PCB, enabling efficient use of board space and reducing overall size.

Technical Specifications

Telecom - Protection ICs TSI200B1RL attributes and parameters. Explore more Telecom - Protection ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TSI200B1RL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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