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TISPPBL2P

Texas Instruments

TISPPBL2P by Texas Instruments

TISPPBL2P by Texas Instruments is a surge protection circuit for telecom applications. It features 8 terminals in an inline package style, with a temperature range of -40 to 85°C. The rectangular plastic/epoxy body has a width of 7.62mm and seated height of 5.08mm, making it suitable for industrial-grade telecom protection ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,833 parts In-Stock

1+ parts

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7,833

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Digiode

USA . 3,972 parts In-Stock

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3,972

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$10.141

100+ parts

-

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803

$10.141

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Parana Technologies

USA . 1,965 parts In-Stock

1+ parts

$15.249

100+ parts

-

1k+ parts

$15.646

10k+ parts

-

1,965

$15.249

-

$15.646

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ChromeModa Solutions

Germany . 6,025 parts In-Stock

1+ parts

$17.134

100+ parts

$14.050

1k+ parts

-

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6,025

$17.134

$14.050

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IDEA Electronic Components Group

UK . 630 parts In-Stock

1+ parts

$17.134

100+ parts

$16.277

1k+ parts

$15.421

10k+ parts

-

630

$17.134

$16.277

$15.421

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One Stop Electronics

USA . 893 parts In-Stock

1+ parts

$959.000

100+ parts

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893

$959.000

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Corphita

USA . 3,297 parts In-Stock

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3,297

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Assy Fe

Spain . 3,140 parts In-Stock

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3,140

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DigiPath Technology Company

USA . 1,947 parts In-Stock

1+ parts

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100+ parts

$15.448

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1,947

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$15.448

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Overview

Upgrade your telecom system with the TISPPBL2P surge protection circuit by Texas Instruments. Trust in the quality and reliability of this industry-leading manufacturer to safeguard your equipment from power surges and ensure uninterrupted communication. With its durable plastic/epoxy package and industrial-grade temperature rating, this protection IC offers peace of mind and long-lasting performance. Invest in the TISPPBL2P for superior protection and keep your telecom network running smoothly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection to the IC, ensuring reliable performance in various environmental conditions.

No. of Terminals: 8

Having multiple terminals allows for versatile connections, making it suitable for a range of telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures without compromising its functionality.

Terminal Position: DUAL

Dual terminal positions facilitate easy installation and connection, reducing the risk of errors during setup.

Width: 7.62 mm

The compact width of this IC allows for efficient use of space in telecom equipment, making it a suitable choice for compact designs.

Technical Specifications

Telecom - Protection ICs TISPPBL2P attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TISPPBL2P Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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