Loading...

NUS6189MNTWG

Onsemi

NUS6189MNTWG by Onsemi

NUS6189MNTWG by Onsemi is a Telecom IC with surge protection circuit. It features 22 terminals in a rectangular chip carrier package, with dimensions of 4mm x 3mm x 1mm. Ideal for telecom applications requiring surface mount protection ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,795

-

-

-

-

Digiode

USA . 1,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 727 parts In-Stock

1+ parts

$17.290

100+ parts

-

1k+ parts

-

10k+ parts

-

727

$17.290

-

-

-

SupplyDigital Components

Austria . 8,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,089

-

-

-

-

TANS Electronics

Latvia . 5,392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,392

-

-

-

-

Kulean Microsystems

USA . 4,135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,135

-

-

-

-

Corphita

USA . 1,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,962

-

-

-

-

Corohmni

South Africa . 451 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

451

-

-

-

-

UHIMA Technologies

Türkiye . 257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

257

-

-

-

-

Problanco Electronics

Mexico . 203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

203

-

-

-

-

Overview

Enhance your telecom systems with the NUS6189MNTWG surge protection circuit by Onsemi. With a sleek rectangular chip carrier design and 22 terminals for easy installation, this surface mount device offers top-notch quality and reliability. Safeguard your equipment from power surges and voltage spikes while maximizing performance and longevity. Trust in Onsemi's expertise in the telecom industry to provide you with unmatched protection and peace of mind. Upgrade your telecommunications setup today with the NUS6189MNTWG and experience the difference in quality and durability.

Feature Benefit Bullets

Surface Mount: YES

The ability to be surface mounted allows for easy and efficient integration into telecommunications equipment.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design, important in telecom applications where space is limited.

No. of Terminals: 22

Having 22 terminals allows for multiple connections and interfaces, enabling flexibility in the use of the protection IC.

Terminal Finish: TIN

The use of tin as terminal finish ensures good conductivity and reliability in signal transmission and protection functions.

Maximum Seated Height: 1 mm

The low seated height of 1 mm contributes to a slim profile and helps in maintaining a compact and slim design of the overall telecom equipment.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the IC can withstand high-temperature soldering processes, ensuring secure and reliable solder joints.

Terminal Form: NO LEAD

The absence of lead in the terminal form is environmentally friendly and complies with RoHS regulations, making it a more sustainable choice.

Telecom IC Type: SURGE PROTECTION CIRCUIT

Being a surge protection circuit, this IC protects telecom equipment from electrical surges, ensuring the longevity and reliability of the devices connected to it.

Technical Specifications

Telecom - Protection ICs NUS6189MNTWG attributes and parameters. Explore more Telecom - Protection ICs devices from Onsemi

Specs

JESD-30 Code:

R-XQCC-N22

JESD-609 Code:

e3

Length:

4 mm

No. of Functions:

1

No. of Terminals:

22

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NUS6189MNTWG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.