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TISP61089SDR

Texas Instruments

TISP61089SDR by Texas Instruments

TISP61089SDR by Texas Instruments is a Telecom Surge Protection IC with 8 terminals in a small outline package. Operating temperature range from -40 to 85°C, ideal for industrial applications. Features gull wing terminals and compact rectangular shape for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,641 parts In-Stock

1+ parts

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8,641

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Digiode

USA . 4,818 parts In-Stock

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4,818

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,008 parts In-Stock

1+ parts

$11.481

100+ parts

-

1k+ parts

$11.894

10k+ parts

-

1,008

$11.481

-

$11.894

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DigiPath Technology Company

USA . 540 parts In-Stock

1+ parts

$12.642

100+ parts

$11.631

1k+ parts

-

10k+ parts

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540

$12.642

$11.631

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ChromeModa Solutions

Germany . 1,846 parts In-Stock

1+ parts

$12.900

100+ parts

$10.578

1k+ parts

-

10k+ parts

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1,846

$12.900

$10.578

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IDEA Electronic Components Group

UK . 932 parts In-Stock

1+ parts

$12.900

100+ parts

$12.255

1k+ parts

$11.610

10k+ parts

-

932

$12.900

$12.255

$11.610

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AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$13.616

100+ parts

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693

$13.616

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One Stop Electronics

USA . 681 parts In-Stock

1+ parts

$562.000

100+ parts

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681

$562.000

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Corphita

USA . 3,377 parts In-Stock

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3,377

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Assy Fe

Spain . 2,500 parts In-Stock

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2,500

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Overview

Guard your telecom systems with the TISP61089SDR by Texas Instruments, a top-quality surge protection circuit designed to keep your equipment safe from harmful voltage spikes. With a reputation for excellence in manufacturing, Texas Instruments delivers reliable products that you can trust. Ideal for telecom applications, this small outline IC offers peace of mind and long-lasting protection. Invest in the TISP61089SDR and ensure the longevity of your telecom systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Being surface mountable allows for easier and more efficient integration onto circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape enables easy handling and placement of the IC during manufacturing and installation.

No. of Terminals: 8

With 8 terminals, this IC offers flexibility in connectivity options and can support multiple input and output configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable board space and allows for high-density board designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising functionality.

Terminal Position: DUAL

Dual terminal positions provide redundancy and ensure reliable connections, especially in high vibration environments.

Maximum Seated Height: 1.75 mm

The low seated height makes this IC suitable for applications with tight space constraints or when a slim profile is required.

Width: 3.9 mm

The compact width of the IC allows for efficient placement on the circuit board and contributes to a sleek overall design.

Length: 4.9 mm

The short length of the IC enhances its compatibility with various board layouts and facilitates easy integration into electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making this IC suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections during assembly and operation, reducing the risk of signal loss or damage.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC helps safeguard telecom equipment from voltage spikes and surges, ensuring long-term reliability and protection from damage.

Terminal Pitch: 1.27 mm

The fine terminal pitch enables precise connections and facilitates high-density board designs, making this IC suitable for space-constrained applications.

Technical Specifications

Telecom - Protection ICs TISP61089SDR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP61089SDR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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