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TIBPAL16L8-30MWB

Texas Instruments

TIBPAL16L8-30MWB by Texas Instruments

TIBPAL16L8-30MWB by Texas Instruments is a PLD with 30ns propagation delay, 64 product terms, and 25MHz clock frequency. Ideal for military applications requiring combinatorial output functions in a compact flatpack package with TTL technology.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 3,461 parts In-Stock

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Digiode

USA . 3,039 parts In-Stock

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Resion

USA . 29 parts In-Stock

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Velocity Electronics

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AZTECH Wire

Italy . 546 parts In-Stock

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$15.359

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One Stop Electronics

USA . 1,355 parts In-Stock

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$22.000

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Parana Technologies

USA . 275 parts In-Stock

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DigiPath Technology Company

USA . 2,323 parts In-Stock

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$88.767

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$81.666

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ChromeModa Solutions

Germany . 1,228 parts In-Stock

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$90.579

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$74.275

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IDEA Electronic Components Group

UK . 191 parts In-Stock

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$90.579

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$86.050

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$81.521

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Microchip USA

USA . 2,870 parts In-Stock

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Corphita

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Overview

Unlock the power of Texas Instruments with the TIBPAL16L8-30MWB programmable logic device. Perfect for a wide range of applications, this PAL-type device offers unmatched quality and reliability. With a fast 30ns propagation delay and a maximum clock frequency of 25MHz, this PLD is designed to meet your performance needs. Whether you're designing industrial controls or telecommunications equipment, the TIBPAL16L8-30MWB provides the flexibility and efficiency you need to bring your projects to life. Trust in Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the PLD, making it suitable for rugged environments.

Propagation Delay: 30 ns

Fast propagation delay ensures quick response time for input signals, making it ideal for time-sensitive applications.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for flexibility in power supply options.

Technology Used: TTL

TTL technology is known for its reliability and compatibility with a wide range of devices.

No. of Inputs: 16

Having a high number of inputs allows for versatile programming options and complex logic functions.

Output Function: COMBINATORIAL

Combinatorial output function enables the creation of logical functions without the need for sequential memory elements.

Maximum Clock Frequency: 25 MHz

High clock frequency capability allows for fast processing of signals and data.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures reliable operation in extreme temperature conditions.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-30MWB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

25 MHz

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

Flatpack

Package Code:

DFP

Package Shape:

Package Equivalence Code:

FL20,.3

Width:

6.92 mm

Length:

13.09 mm

Maximum Seated Height:

2.54 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Tin/Lead

Standards

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

TIBPAL16L8-30MWB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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