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TGS8250SSC

Texas Instruments

TGS8250SSC by Texas Instruments

SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,675 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,675

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Digiode

USA . 1,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,787

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 222 parts In-Stock

1+ parts

$1.324

100+ parts

-

1k+ parts

$2.063

10k+ parts

-

222

$1.324

-

$2.063

-

DigiPath Technology Company

USA . 1,509 parts In-Stock

1+ parts

$1.458

100+ parts

$1.342

1k+ parts

-

10k+ parts

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1,509

$1.458

$1.342

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ChromeModa Solutions

Germany . 1,752 parts In-Stock

1+ parts

$1.488

100+ parts

$1.220

1k+ parts

-

10k+ parts

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1,752

$1.488

$1.220

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IDEA Electronic Components Group

UK . 1,023 parts In-Stock

1+ parts

$1.488

100+ parts

-

1k+ parts

$1.339

10k+ parts

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1,023

$1.488

-

$1.339

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Semicontronic

India . 607 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

10k+ parts

-

607

$3.000

$2.925

$2.910

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Ampacity Inc.

Singapore . 541 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

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10k+ parts

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541

$12.000

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AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$14.770

100+ parts

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709

$14.770

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One Stop Electronics

USA . 1,231 parts In-Stock

1+ parts

$40.000

100+ parts

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1,231

$40.000

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Corphita

USA . 2,941 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,941

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Corohmni

South Africa . 395 parts In-Stock

1+ parts

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395

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Technical Specifications

RF/Microwave Switches TGS8250SSC attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments

Specs

No. of Functions:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Equivalence Code:

DIE OR CHIP

Port Termination:

REFLECTIVE

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Technology:

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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