Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SPDT; Maximum Insertion Loss: 2.7 dB; Maximum Operating Frequency: 18000 MHz; Maximum Voltage Standing Wave Ratio: 1.5; Minimum Operating Frequency: 0 MHz; Construction: COMPONENT;
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RF/Microwave Switches TGS8250SCMX attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments
Construction:
Maximum Input Power (CW):
Maximum Insertion Loss:
Maximum Operating Frequency:
Minimum Operating Frequency:
RF or Microwave Device Type:
Maximum Voltage Standing Wave Ratio:
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
SMBJ18CA
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
Rectron
General Semiconductor
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Fairchild Semiconductor
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
OHN3020U
Tt Electronics Plc
OHN3020U by Tt Electronics Plc is a magnetic field sensor with a max supply voltage of 24V and hysteresis of 5mT. It features an output range of 25mA and operates in temperatures ranging from -20 to 85°C. Ideal for applications requiring precise detection and measurement of magnetic fields, such as automotive sensors or industrial automation systems.
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
LM7805CT/NOPB
LM7805CT/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a package style of flange mount, and offers low line/load regulation making it ideal for various electronic applications requiring stable power supply.
EU2B-YS3103F
Idec
ROTARY SWITCH;
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
1N4148WS
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADWRG4
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
ADG901SCPZ-EP
Analog Devices
ADG901SCPZ-EP by Analog Devices is an RF/Microwave Switch with 18 dBm CW input power, 1.25 dB max insertion loss, and 31 dB min isolation. It operates from -55 to 125°C and is ideal for applications requiring fast switching in CMOS technology for frequencies up to 1000 MHz.
UPG2012TK-E2
Renesas Electronics
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -45 Cel;
SKY13416-485LF
Skyworks Solutions
SKY13416-485LF by Skyworks Solutions is an RF/Microwave Switch with 1 function. It has a max input power of 37.5 dBm and a max voltage standing wave ratio of 5. This component, with its SP6T configuration, is suitable for applications requiring high-frequency switching in the range of 100 MHz to 6000 MHz.
UPG2008TK-E2
SPDT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Input Power (CW): 28.06 dBm; Minimum Operating Frequency: 500 MHz; Minimum Operating Temperature: -45 Cel; Maximum Operating Frequency: 2500 MHz;
SKY13290-313LF
SKY13290-313LF by Skyworks Solutions is an RF/Microwave Switch with 43.5 dBm CW power, 15 dBm compression point, and 0.7 dB max insertion loss. It is a SPDT device with 50 ohm impedance, offering 28 dB isolation. Ideal for applications requiring high-frequency switching in the range of 500 MHz to 2500 MHz.
SKY13370-374LF
SKY13370-374LF by Skyworks Solutions is an RF/Microwave Switch with max input power of 40 dBm, insertion loss of 1.3 dB, and operating frequency range from 500 MHz to 6 GHz. It is a diversity switch component suitable for applications requiring high-performance switching in temperature range -40°C to 85°C.
HMC344LC3RTR
Analog Devices' HMC344LC3RTR is a GAAS SP4T RF switch with 16 terminals, offering 30 dB isolation and 3 dB insertion loss at 8 GHz. Suitable for RF/microwave applications, it operates from -40 to 85°C, with 0.07 us nominal on time and -5 V power supply.
UPG2214TB-E4
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Input Power (CW): 30 dBm;
LM96530SQX/NOPB
LM96530SQX/NOPB by Texas Instruments is a RF/Microwave Switch with 60 terminals, operating at 0-70°C. It has a 5V power supply, matte tin finish, and 2us nominal on time. Ideal for applications requiring a transfer switch in surface mount configuration.
SW-277PIN
M/a-com
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; No. of Functions: 1;
BGS12WN6E6329
Infineon Technologies
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Maximum Insertion Loss: 2 dB;
UPG2163T5N-E2-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Characteristic Impedance: 50 ohm;
HMC546LP2E
Analog Devices' HMC546LP2E is a GAAS RF/Microwave Switch with 1.5 dB max insertion loss, 10 dB min isolation, and 40 dBm CW input power. Ideal for diversity switch applications operating b/w 200 MHz to 2700 MHz, it features a plastic/epoxy package body and matte tin terminal finish for surface mount assembly.
PE42452A-Z
Psemi
PE42452A-Z by Psemi is a RF/Microwave Switch with 1.9 dB Max Insertion Loss, 34 dBm CW Max Input Power, and operates b/w 450-4000 MHz. It's a Diversity Switch suitable for applications requiring high-frequency signal routing in temperature range of -40 to 105°C.
BGSA403ML10
SP4T;
MASWSS0115TR-3000
TE Connectivity
TE Connectivity's MASWSS0115TR-3000 is a SPDT RF switch with 6 terminals, operating up to 3000 MHz. It offers low insertion loss of 0.55 dB and high isolation of 20 dB. Ideal for RF/Microwave applications requiring fast response times and high compression points up to 21 dBm.
MASWSS0180
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 36 dB;
UPG2157T5F-E2-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Construction: COMPONENT;
HMC547LP3RTR
Analog Devices' HMC547LP3RTR is a SPDT RF switch with 2.5 dB max insertion loss and 33 dB min isolation. It operates up to 20 GHz, has a compression point of 23 dBm, and is ideal for high-frequency applications in the -40°C to 85°C temperature range.
HMC232LP4
HMC232LP4 by Analog Devices is a RF/Microwave Switch with 24 terminals, offering max insertion loss of 3.1 dB and min isolation of 37 dB. With a max operating frequency of 12 GHz, it is ideal for high-frequency applications requiring fast switching times (0.006 us) and high power handling (30 dBm CW).
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TGS8422-SCC
SP4T; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Maximum Voltage Standing Wave Ratio: 1.3; Construction: COMPONENT; Maximum Input Power (CW): 30 dBm;
TGS8122XPMX
SPDT; Minimum Operating Frequency: 8000 MHz; Maximum Insertion Loss: 1.4 dB; Maximum Input Power (CW): 34.77 dBm; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT;
TGS8122SPCX
SPDT; Maximum Voltage Standing Wave Ratio: 1.2; Minimum Operating Frequency: 8000 MHz; Maximum Insertion Loss: 1.4 dB; Construction: COMPONENT; Maximum Operating Frequency: 11000 MHz;
TGS8250XCCX
SPDT; Maximum Voltage Standing Wave Ratio: 1.5; Maximum Input Power (CW): 30 dBm; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Construction: COMPONENT;
TGS8250SCCX
SPDT; Maximum Input Power (CW): 30 dBm; Construction: COMPONENT; Minimum Operating Frequency: 0 MHz; Maximum Voltage Standing Wave Ratio: 1.5; Maximum Operating Frequency: 18000 MHz;
TGS8122XCMX
SPDT; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT; Maximum Insertion Loss: 1.4 dB; Minimum Operating Frequency: 8000 MHz; Maximum Input Power (CW): 34.77 dBm;
TGS8630-SCC
SPDT; Technology: GAAS; Package Equivalence Code: DIE OR CHIP; No. of Functions: 1; Power Supplies (V): 12; Nominal On Time: .014 us;
TGS8122SCCX
SPDT; Maximum Insertion Loss: 1.4 dB; Maximum Voltage Standing Wave Ratio: 1.2; Maximum Operating Frequency: 11000 MHz; Minimum Operating Frequency: 8000 MHz; Construction: COMPONENT;
TGS8250-SCC
SPDT; Technology: GAAS; Construction: COMPONENT; Port Termination: REFLECTIVE; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: 0 Cel;
TGS8122SPMX
SPDT; Minimum Operating Frequency: 8000 MHz; Maximum Input Power (CW): 34.77 dBm; Maximum Insertion Loss: 1.4 dB; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT;
TGS8250SSC
SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
TGS8122XCCX
SPDT; Maximum Operating Frequency: 11000 MHz; Maximum Insertion Loss: 1.4 dB; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2; Construction: COMPONENT;
TGS8250XCMX
SPDT; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Construction: COMPONENT; Maximum Insertion Loss: 2.7 dB; Maximum Voltage Standing Wave Ratio: 1.5;
TGS8122SPC
SPDT; Technology: GAAS; Minimum Operating Temperature: 0 Cel; No. of Functions: 1; Port Termination: REFLECTIVE; Maximum Operating Temperature: 70 Cel;
TGS8122XPCX
SPDT; Construction: COMPONENT; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2; Maximum Input Power (CW): 34.77 dBm; Maximum Insertion Loss: 1.4 dB;
TGS8122-SCC
SPDT; Technology: GAAS; Maximum Input Power (CW): 34.77 dBm; Construction: COMPONENT; Package Equivalence Code: DIE OR CHIP; Compression Point (1 dB): 29 dBm;
TGS8122SCMX
SPDT; Maximum Operating Frequency: 11000 MHz; Maximum Input Power (CW): 34.77 dBm; Construction: COMPONENT; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2;
TGS8122SSC
SPDT; Technology: GAAS; Maximum Operating Frequency: 11000 MHz; Compression Point (1 dB): 29 dBm; No. of Functions: 1; Minimum Operating Temperature: 0 Cel;
TGS8250SPC
SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
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