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SPM3227

Onsemi

SPM3227 by Onsemi

Onsemi's SPM3227 RF/Microwave Switch offers 1.5 VSWR, 15 dBm compression point, and 16 dB isolation. Ideal for SPDT applications up to 2500 MHz with a max insertion loss of 0.6 dB. Suitable for surface mount setups in temperature range -40 °C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,420 parts In-Stock

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Vyrian

USA . 1,210 parts In-Stock

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TANS Electronics

Latvia . 7,864 parts In-Stock

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SupplyDigital Components

Austria . 6,042 parts In-Stock

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Kulean Microsystems

USA . 1,754 parts In-Stock

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Problanco Electronics

Mexico . 1,419 parts In-Stock

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Corphita

USA . 660 parts In-Stock

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Corohmni

South Africa . 253 parts In-Stock

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UHIMA Technologies

Türkiye . 23 parts In-Stock

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Overview

Elevate your RF/Microwave system with the SPM3227 by Onsemi. Designed with top-notch quality and reliability, this SPDT switch offers unmatched performance and durability in a compact, surface mount package. Perfect for a wide range of applications, from telecommunications to aerospace, this versatile switch delivers maximum insertion loss of 0.6 dB and minimum isolation of 16 dB. Trust Onsemi's expertise in RF technology to enhance your system's efficiency and productivity. Experience seamless connectivity and superior signal control with the SPM3227 - the ultimate choice for your RF/Microwave needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for various applications.

Maximum Voltage Standing Wave Ratio: 1.5

With a low maximum VSWR of 1.5, this RF/Microwave switch ensures efficient power transfer and minimal signal loss.

Compression Point (1 dB): 15 dBm

The high compression point of 15 dBm allows the switch to handle high power levels without distortion, ensuring reliable performance.

No. of Terminals: 6

Having 6 terminals provides versatility in connection options and allows for more complex circuit configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this switch can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that the switch remains operational even in extreme cold conditions.

Maximum Insertion Loss: 0.6 dB

With a maximum insertion loss of only 0.6 dB, minimal signal loss is achieved during signal routing, ensuring high-quality transmission.

RF or Microwave Device Type: SPDT

Being a SPDT (Single-Pole, Double-Throw) switch, this product provides flexibility in signal routing and selection, making it suitable for various applications.

Minimum Isolation: 16 dB

The high minimum isolation of 16 dB ensures minimal crosstalk between signal paths, maintaining signal integrity and reducing interference.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation on PCBs, saving space and simplifying assembly processes.

Maximum Operating Frequency: 2500 MHz

With a high maximum operating frequency of 2500 MHz, this switch is suitable for high-frequency RF and microwave applications, offering versatile use.

Technical Specifications

RF/Microwave Switches SPM3227 attributes and parameters. Explore more RF/Microwave Switches devices from Onsemi

Specs

Compression Point (1 dB):

15 dBm

Maximum Insertion Loss:

.6 dB

Minimum Isolation:

16 dB

Mounting Feature:

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Frequency:

2500 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOLCC6,.03,18

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Maximum Voltage Standing Wave Ratio:

1.5

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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