Loading...

SPM3224

Onsemi

SPM3224 by Onsemi

Onsemi's SPM3224 RF/Microwave Switch offers 1.5 VSWR, 0.55 dB insertion loss, and 15 dB isolation. Ideal for SPDT applications up to 2500 MHz, with a GAAS technology and surface mounting feature.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,070

-

-

-

-

Digiode

USA . 476 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

476

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 5,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,768

-

-

-

-

Problanco Electronics

Mexico . 5,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,540

-

-

-

-

Kulean Microsystems

USA . 3,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,614

-

-

-

-

Corphita

USA . 2,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,409

-

-

-

-

TANS Electronics

Latvia . 1,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,550

-

-

-

-

UHIMA Technologies

Türkiye . 455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

455

-

-

-

-

Corohmni

South Africa . 315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

315

-

-

-

-

Overview

Upgrade your RF/Microwave system with the SPM3224 by Onsemi, a high-quality SPDT switch that offers unparalleled performance and reliability. Designed with cutting-edge GAAS technology, this switch boasts a low insertion loss of 0.55 dB and a minimum isolation of 15 dB, ensuring seamless signal transmission. With a maximum operating frequency of 2500 MHz, the SPM3224 is ideal for a wide range of applications, from telecommunications to aerospace. Trust in Onsemi's reputation for excellence and unlock the full potential of your system with the SPM3224.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material ensures a lightweight and durable construction for the RF/Microwave Switch, making it ideal for various applications.

Maximum Voltage Standing Wave Ratio: 1.5

Low VSWR value indicates efficient power transfer and minimal signal loss within the system, resulting in reliable performance.

Power Supplies (V): 2.8

Operates at a low voltage of 2.8V, making it energy efficient and suitable for battery-powered devices.

No. of Terminals: 6

Having 6 terminals allows for versatile connectivity options and integration with other components in the RF/Microwave system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this switch can withstand harsh environmental conditions and ensure reliable performance in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for consistent performance even in extreme cold environments.

Maximum Insertion Loss: 0.55 dB

Low insertion loss of 0.55 dB ensures minimal signal loss and high signal integrity, making it suitable for high-frequency applications.

Nominal On Time: 0.02 us

Fast switching speed with a nominal on time of 0.02 microseconds ensures quick and efficient signal routing.

Technology: GAAS

Utilizing Gallium Arsenide (GaAs) technology ensures high performance, low noise, and reliable operation in RF and microwave applications.

RF or Microwave Device Type: SPDT

Single Pole Double Throw (SPDT) configuration provides switching between two signal paths, offering versatility and flexibility in signal routing.

Minimum Isolation: 15 dB

With a minimum isolation of 15 dB, the switch ensures minimal signal interference between input and output ports, enhancing overall signal quality.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and secure installation on PCBs, saving space and facilitating integration into compact electronic devices.

Maximum Operating Frequency: 2500 MHz

High maximum operating frequency of 2500 MHz enables the switch to handle high-frequency RF and microwave signals with precision and minimal loss.

Technical Specifications

RF/Microwave Switches SPM3224 attributes and parameters. Explore more RF/Microwave Switches devices from Onsemi

Specs

Maximum Insertion Loss:

.55 dB

Minimum Isolation:

15 dB

Mounting Feature:

No. of Functions:

1

No. of Terminals:

6

Nominal On Time:

.02 us

Maximum Operating Frequency:

2500 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

TSSOP6,.08

Power Supplies (V):

2.8

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Technology:

Maximum Voltage Standing Wave Ratio:

1.5

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20