Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SPM3226 by Onsemi is a RF/Microwave Switch with 1.5 VSWR, 0.55 dB insertion loss, and 15 dB isolation. It's a SPDT device suitable for surface mount applications in temperature range of -40 to 85 °C.
Median Price
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Vyrian
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TANS Electronics
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UHIMA Technologies
Corohmni
Plastic/Epoxy material offers durability and reliability, making the product suitable for various environmental conditions.
Low VSWR ensures efficient power transfer and minimal signal reflection, leading to better overall performance.
The higher number of terminals allow for more flexibility in connecting the switch to other components or devices.
High maximum operating temperature ensures the switch can function reliably even in elevated temperature environments.
Low minimum operating temperature allows the switch to operate effectively in cold environments without any performance issues.
Low insertion loss means minimal power loss during signal transmission, ensuring efficient operation of the switch.
Fast switching speed allows for quick and precise signal routing, making the switch suitable for applications requiring rapid switching.
Single-Pole Double-Throw design provides flexibility in signal routing, allowing the switch to be used in various RF/microwave applications.
High isolation helps in preventing unwanted signal leakage and ensures that signals remain separate, leading to improved overall performance.
Surface mount design facilitates easy and secure installation of the switch onto circuit boards, making it convenient for integration into electronic systems.
RF/Microwave Switches SPM3226 attributes and parameters. Explore more RF/Microwave Switches devices from Onsemi
Maximum Insertion Loss:
Minimum Isolation:
Mounting Feature:
No. of Functions:
No. of Terminals:
Nominal On Time:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
RF or Microwave Device Type:
Sub-Category:
Maximum Voltage Standing Wave Ratio:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N2222A
Micro Commercial Components
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Semicoa
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
Dc Components
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
1N4148WS
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
HMC232G8
Analog Devices
HMC232G8 by Analog Devices is a SPDT RF/Microwave switch with 50 ohm impedance, offering 29 dB isolation and 2.2 dB insertion loss up to 6 GHz. It operates from -40°C to +85°C, has a CW input power of 30 dBm, and 0.006 us nominal on time. Ideal for applications requiring high-frequency signal routing in components with surface mounting features.
HMC641ALC4
Hittite Microwave
DIVERSITY SWITCH; Terminal Finish: TUNGSTEN NICKEL GOLD; Minimum Operating Temperature: -40 Cel; Maximum Operating Frequency: 20000 MHz; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel;
HMC446ETR
Analog Devices' HMC446ETR is a SPDT RF/Microwave switch with 1 dB max insertion loss, 18 dB min isolation, and 41 dBm CW input power. It operates from -40 to 85 °C, suitable for applications requiring high-speed switching in the frequency range of 824-894 MHz.
HMC546MS8GETR
Analog Devices' HMC546MS8GETR is a GAAS technology RF/Microwave Switch with 1.5 dB max insertion loss, 8 dB min isolation, and 40 dBm CW max input power. Ideal for diversity switch applications operating b/w 200 MHz to 2200 MHz with a surface mount package body material made of plastic/epoxy.
MASW-008322-TR1000
M/a-com Technology Solutions
MASW-008322-TR1000 by M/a-com Technology Solutions is a RF/Microwave Switch with 2.5 dB max insertion loss, 39 dB min isolation, and 50 ohm characteristic impedance. It operates from -40 to 85 °C, suitable for SPDT applications in the frequency range of 0-20000 MHz.
TG2205F(TE85L)
Toshiba
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 20 dB;
ADG919BCP-500RL7
ADG919BCP-500RL7 by Analog Devices is a CMOS RF/Microwave Diversity Switch with 8 terminals, 50 ohm impedance, and 1.25 dB insertion loss. It operates from -40 to 85 °C, suitable for applications requiring high isolation and fast switching in the frequency range of 0-4000 MHz.
TGS2304-SCC
Texas Instruments
TGS2304-SCC by Texas Instruments is an SP4T RF switch with max input power of 33.01 dBm and VSWR of 1.2. Operating from 0-20000 MHz, it's ideal for RF/Microwave applications requiring high power handling and low insertion loss.
HMC547LC3TR
Analog Devices' HMC547LC3TR is a SPDT RF switch with 16 terminals, offering 30 dB isolation and 3 dB insertion loss at up to 28 GHz. Its GaAs technology ensures a compression point of 16 dBm, making it ideal for high-frequency applications in the -40°C to +85°C temperature range. The ceramic package and surface mount feature enhance durability and ease of installation.
AS186-302LF
Skyworks Solutions
AS186-302LF by Skyworks Solutions is a RF/Microwave Switch with 30 dBm CW power, 1.6 VSWR, and 25 dBm compression point. Ideal for diversity switch applications, it operates from -40 to 85°C with GAAS technology, offering 35 dB isolation and 1.25 dB insertion loss up to 4 GHz.
HMC234C8
Analog Devices' HMC234C8 is an RF/Microwave SPDT switch with 2.4 dB max insertion loss, 30 dBm CW input power, and 0-8000 MHz frequency range. Ideal for applications requiring high-frequency signal routing in environments ranging from -40 to 85°C.
AW002R2-12
AW002R2-12 by Skyworks Solutions is a GAAS technology RF/Microwave Switch with 1.1 dB max insertion loss, 20 dB min isolation, and 2500 MHz max operating frequency. Ideal for diversity switch applications due to its reflective port termination and surface mounting feature.
HMC536LP2ERTR
Analog Devices' HMC536LP2ERTR is a GAAS SPDT RF switch with 1.3 dB max insertion loss, 23 dB min isolation, and 6000 MHz max operating frequency. Ideal for applications requiring fast switching times and high performance in RF/microwave systems. Package body material is plastic/epoxy for surface mounting feature.
UPG183GR-E1
Renesas Electronics
SP4T; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 22 dB;
MASWSS0178
TE Connectivity's MASWSS0178 is a SPDT RF switch with 5V power supply, operating up to 3000 MHz. Featuring GAAS technology, it offers 0.7 dB insertion loss and 51 dB isolation. Ideal for RF/Microwave applications with surface mounting feature.
HMC536LP2RTR
Analog Devices' HMC536LP2RTR is a GAAS SPDT RF switch with 1.3 dB max insertion loss, 23 dB min isolation, and 6000 MHz max operating frequency. Ideal for RF/microwave applications, it features a 0.07 us nominal on time and operates b/w -40 to 85 °C in a surface mount package.
HMC199AMS8E
HMC199AMS8E by Analog Devices is a RF/Microwave Switch with 1 dB max insertion loss, 29.29 dBm CW input power, and operates from -40°C to 85°C. Ideal for diversity switching applications in the frequency range of 0-2500 MHz.
PE42424A-Z
Psemi
PE42424A-Z by Psemi is a SPDT RF switch with 1.6 dB max insertion loss, 29 dBm CW input power, and 1.2 VSWR. It operates from 100 MHz to 8500 MHz, ideal for RF/Microwave applications requiring high isolation (24 dB) and low power consumption (0.3 mA at 3.3V).
BGS12WN6E6327XTSA1
Infineon Technologies
BGS12WN6E6327XTSA1 by Infineon is a RF/Microwave Switch with max input power of 28 dBm, operating freq. from 50 MHz to 6000 MHz, and min isolation of 21 dB. It's a SPDT diversity switch suitable for applications requiring low insertion loss and high isolation in wireless communication systems.
NSG1001MXT1G
NSG1001MXT1G by Onsemi is a RF/Microwave Switch with 6 terminals, operating from -40 to 105 °C. It offers high isolation of 20 dB, low insertion loss of 0.95 dB, and can handle frequencies from 2500 to 8000 MHz. Ideal for diversity switch applications due to its surface mount construction and compression point of 27 dBm.
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SPM3202
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Nominal On Time: .02 us;
SPM3205
SPM3215
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Compression Point (1 dB): 26 dBm; Maximum Insertion Loss: 1.4 dB;
SPM3221
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Power Supplies (V): 3;
SPM3224
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Insertion Loss: .55 dB;
SPM3225
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;
SPM3227
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Voltage Standing Wave Ratio: 1.5; Package Equivalence Code: SOLCC6,.03,18;
SPM3252
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Insertion Loss: .95 dB;
SPM3255
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Insertion Loss: .9 dB; Maximum Voltage Standing Wave Ratio: 2;
SPM3313
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: SOLCC6,.03,18; Maximum Voltage Standing Wave Ratio: 1.5;
SPM3314
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; Maximum Voltage Standing Wave Ratio: 1.5;
SPM3315
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Insertion Loss: .5 dB; Maximum Voltage Standing Wave Ratio: 1.5;
SPM3501
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Minimum Isolation: 10 dB; Maximum Operating Temperature: 85 Cel;
Sanyo Electric
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -40 Cel;
SPM3226
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel;
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Minimum Operating Frequency: 100 MHz;
SPM3223
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT;
SPM3214
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Voltage Standing Wave Ratio: 1.5; No. of Functions: 1;
SPM3216
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: TSSOP6,.08; Nominal On Time: .02 us;
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