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SPM3313

Onsemi

SPM3313 by Onsemi

The Onsemi SPM3313 is an RF/Microwave Switch with a max freq of 2500 MHz. It features a VSWR of 1.5, Compression Point at 30 dBm, and Insertion Loss of 0.55 dB. Ideal for SPDT applications in temperature range -40 to 85 °C, with 6 terminals and surface mounting feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,483 parts In-Stock

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Vyrian

USA . 2,185 parts In-Stock

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SupplyDigital Components

Austria . 8,244 parts In-Stock

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Kulean Microsystems

USA . 7,599 parts In-Stock

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Problanco Electronics

Mexico . 6,956 parts In-Stock

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TANS Electronics

Latvia . 4,929 parts In-Stock

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UHIMA Technologies

Türkiye . 922 parts In-Stock

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Corphita

USA . 817 parts In-Stock

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Corohmni

South Africa . 172 parts In-Stock

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Overview

Experience superior performance and reliability with the SPM3313 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch RF/Microwave Switches that are designed to meet your needs. The SPM3313 offers exceptional value, benefits, and advantages for a wide range of applications. Whether you're looking for high-quality materials, precise operation, or seamless integration, this product has got you covered. Trust Onsemi to provide you with the best in class solutions for all your RF/Microwave Switches needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective, making it suitable for a wide range of applications.

Maximum Voltage Standing Wave Ratio: 1.5

Low VSWR ensures efficient power transfer and signal integrity, making this switch ideal for high-frequency applications.

Compression Point (1 dB): 30 dBm

With a high compression point, this switch can handle high power levels without distortion, ensuring reliable performance in demanding environments.

Power Supplies (V): 2.7

Operating at a low voltage of 2.7V, this switch is energy-efficient and suitable for battery-powered applications.

No. of Terminals: 6

Having 6 terminals allows for versatile connections and configurations, making this switch adaptable to different system setups.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of -40 °C to 85°C ensures reliable performance in various environmental conditions, making it suitable for outdoor applications.

Maximum Insertion Loss: 0.55 dB

Low insertion loss minimizes signal attenuation, ensuring high signal integrity and efficiency in signal transmission.

RF or Microwave Device Type: SPDT

As a Single Pole Double Throw (SPDT) switch, it offers flexibility in routing signals, making it a versatile choice for RF and microwave applications.

Minimum Isolation: 16 dB

High isolation between ports prevents signal interference, ensuring clean and reliable signal routing for optimal performance.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies installation and allows for space-saving integration into compact electronic systems.

Maximum Operating Frequency: 2500 MHz

Support for high frequencies up to 2500 MHz makes this switch suitable for a wide range of RF and microwave applications, including wireless communication systems.

Technical Specifications

RF/Microwave Switches SPM3313 attributes and parameters. Explore more RF/Microwave Switches devices from Onsemi

Specs

Compression Point (1 dB):

30 dBm

Maximum Insertion Loss:

.55 dB

Minimum Isolation:

16 dB

Mounting Feature:

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Frequency:

2500 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOLCC6,.03,18

Power Supplies (V):

2.7

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Switches

Maximum Voltage Standing Wave Ratio:

1.5

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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