Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; No. of Functions: 1;
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RF/Microwave Switches UPG2015TB-E3-A attributes and parameters. Explore more RF/Microwave Switches devices from Renesas Electronics
Compression Point (1 dB):
Maximum Insertion Loss:
Minimum Isolation:
Mounting Feature:
No. of Functions:
No. of Terminals:
Maximum Operating Frequency:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
RF or Microwave Device Type:
Sub-Category:
Technology:
1N4148
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
BSS138
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
2N2222A
Comset Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138K-13
Diodes Incorporated
BSS138K-13 by Diodes Inc. is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, operating in enhancement mode. With 3 terminals and 0.31A max drain current, it offers high performance in small outline package style.
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
Digitron Semiconductors
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
BAV99
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
ADRF5046
Analog Devices
Analog Devices' ADRF5046 is a RF/Microwave switch with max input power of 27.48 dBm, operating freq range of 100 MHz to 44 GHz, and impedance of 50 ohm. Ideal for diversity switching applications due to its wide temp range (-40 °C to +105°C) and component construction.
HMC536LP2
Analog Devices' HMC536LP2 is a GAAS RF/Microwave Switch with 1.3 dB max insertion loss, 23 dB min isolation, and 6000 MHz max operating frequency. Ideal for diversity switch applications, it has a PLASTIC/EPOXY package body and operates b/w -40 to 85 °C temperatures.
HMC276LP4E
Analog Devices' HMC276LP4E is an RF/Microwave SPDT switch with 7 dB max insertion loss, 23.01 dBm CW input power, and 50 ohm impedance. It operates b/w -40°C to 85°C, suitable for applications spanning 200-3000 MHz frequencies in various communication systems.
HMC253LC4RTR
RF/Microwave Switches;
MA4SW310
Tyco Electronics M/a-com
SP3T; Minimum Operating Temperature: -65 Cel; Maximum Operating Frequency: 20000 MHz; Additional Features: HIGH ISOLATION; Maximum Input Power (CW): 30 dBm; Minimum Operating Frequency: 6000 MHz;
UPG2030TB-E3
Renesas Electronics
SPDT; Minimum Operating Frequency: 500 MHz; Maximum Input Power (CW): 33.01 dBm; Maximum Operating Frequency: 2500 MHz; Minimum Operating Temperature: -45 Cel; Maximum Insertion Loss: .55 dB;
UPG158TB-E3
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Nominal On Time: .05 us;
HMC182S14E
Analog Devices' HMC182S14E is a GAAS technology RF/Microwave Switch with 1.2 dB max insertion loss, 28 dB min isolation, and 30 dBm CW input power. Ideal for diversity switching applications in the frequency range of 0-2000 MHz, it features a compact surface mount package with 14 terminals and -40 to +85°C operating temperature range.
UPG2181T5R-E2-A
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; JESD-609 Code: e6;
HMC241LP3TR
SP4T; JESD-609 Code: e0; Terminal Finish: TIN LEAD;
UPG2406T6R-A
PE42427A-Z
Psemi
DIVERSITY SWITCH; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD;
HMC344LP3TR
Analog Devices' HMC344LP3TR is a GAAS SP4T RF switch with 2.5 dB max insertion loss, 31 dB min isolation, and 8000 MHz max operating frequency. Ideal for applications requiring high-frequency switching in RF/microwave systems.
TG2211AFT
Toshiba
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Input Power (CW): 25.05 dBm;
HMC232G7
Hittite Microwave
SPDT; Package Body Material: METAL; Technology: GAAS; Port Termination: ABSORPTIVE; Compression Point (1 dB): 27 dBm; Maximum Operating Frequency: 6000 MHz;
HMC545TR
HMC545TR by Analog Devices is a GAAS SPDT RF switch with 27 dBm compression point, 0.7 dB insertion loss, and 20 dB isolation. It operates up to 3000 MHz, suitable for RF/Microwave applications requiring fast switching times and high performance in surface mount packages.
ADG901BCP
ADG901BCP by Analog Devices is a CMOS RF/Microwave switch with 8 terminals. It offers low insertion loss of 1.25 dB and operates from 0 to 2500 MHz. Ideal for diversity switching applications, it has a max input power of 18.06 dBm and compression point of 20 dBm.
HMC446E
Analog Devices' HMC446E is an RF/Microwave switch with max input power of 41.14 dBm, insertion loss of 1 dB, and operating freq range of 824-849 MHz. Ideal for diversity switching applications due to its 50 ohm impedance and temp range of -40 to +85°C.
ADRF5042BCCZN-R7
Analog Devices' ADRF5042BCCZN-R7 is a SP4T RF/Microwave switch with 24 terminals. It has a CW input power of 25 dBm, VSWR of 1.13, and compression point at 27 dBm. Ideal for applications requiring high-frequency switching in the range of 100-44000 MHz with a characteristic impedance of 50 ohms.
AS222-92LF
Skyworks Solutions
AS222-92LF by Skyworks Solutions is a SPDT RF/Microwave switch with max input power of 33.01 dBm and VSWR of 1.4. It operates from -40 to 85°C, has insertion loss of 0.7 dB, and isolation of 16 dB. Ideal for applications requiring high-frequency switching in communication systems.
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UPG2009TB-E3-A
Nec Electronics America
SPDT; Minimum Operating Temperature: -45 Cel; Maximum Insertion Loss: .5 dB; Maximum Operating Temperature: 85 Cel; Minimum Operating Frequency: 500 MHz; JESD-609 Code: e6;
Nec Compound Semiconductor Devices
SPDT; Terminal Finish: Tin/Bismuth (Sn/Bi); Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 36.02 dBm; Maximum Insertion Loss: .5 dB; Minimum Operating Temperature: -45 Cel;
UPG2009TB-E3-A by Renesas Electronics is a RF/Microwave Switch with SPDT technology. It has a max operating frequency of 2500 MHz and a min isolation of 24 dB. This component, made of plastic/epoxy, is commonly used in applications requiring high-frequency switching capabilities.
Nec Electronics
SPDT; Minimum Operating Frequency: 500 MHz; Minimum Operating Temperature: -45 Cel; Characteristic Impedance: 50 ohm; Terminal Finish: Tin/Bismuth (Sn/Bi); Maximum Operating Temperature: 85 Cel;
UPG2012TB-E-A
UPG2012TB-E3-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;
UPG2012TK-A
SPDT; Maximum Operating Frequency: 2500 MHz; Maximum Input Power (CW): 26.02 dBm; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; JESD-609 Code: e6;
UPG2006TB-E3
SPDT; Maximum Insertion Loss: .65 dB; Characteristic Impedance: 50 ohm; Minimum Operating Temperature: -45 Cel; Terminal Finish: Tin/Lead (Sn/Pb); Construction: COMPONENT;
UPG2009TB
SPDT; Maximum Operating Frequency: 2500 MHz; Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 36.02 dBm; Minimum Operating Temperature: -45 Cel; Construction: COMPONENT;
UPG2012TK-E2
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -45 Cel;
UPG2010TB-A
SPDT; Minimum Operating Temperature: -40 Cel; Maximum Operating Frequency: 2500 MHz; Construction: COMPONENT; Minimum Operating Frequency: 500 MHz; Maximum Input Power (CW): 36.02 dBm;
UPG2012TB-E3
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;
UPG2009TB-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 24 dB;
UPG2010TB-E3
UPG2008TK-E2
SPDT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Input Power (CW): 28.06 dBm; Minimum Operating Frequency: 500 MHz; Minimum Operating Temperature: -45 Cel; Maximum Operating Frequency: 2500 MHz;
UPG2010TB-E3-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Input Power (CW): 36.02 dBm;
UPG2005TB-E3
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Nominal On Time: .02 us;
UPG2008TB-E3
SPDT; Maximum Operating Temperature: 85 Cel; Maximum Input Power (CW): 28.06 dBm; Minimum Operating Frequency: 500 MHz; Characteristic Impedance: 50 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
UPG2009TB-E3
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Frequency: 2500 MHz;
UPG2012TB-A
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