Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SPDT; Terminal Finish: Tin/Bismuth (Sn/Bi); Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 36.02 dBm; Maximum Insertion Loss: .5 dB; Minimum Operating Temperature: -45 Cel;
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$2.013
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RF/Microwave Switches UPG2009TB-E3-A attributes and parameters. Explore more RF/Microwave Switches devices from Nec Compound Semiconductor Devices
Additional Features:
Characteristic Impedance:
Construction:
Maximum Input Power (CW):
Maximum Insertion Loss:
JESD-609 Code:
Maximum Operating Frequency:
Minimum Operating Frequency:
Maximum Operating Temperature:
Minimum Operating Temperature:
RF or Microwave Device Type:
Terminal Finish:
Tokyo, March 14, 2002 - NEC Compound Semiconductor Devices, Ltd. (NEC Compound Semiconductor Devices) and Sumitomo Electric Industries, Ltd. (SEI) today announced they have joined into a multi-source agreement (MSA) to set a common architecture for 10 Gigabit per second (Gbps) detector modules used in optical networking. Sample shipments will start from today of products based on this common standard. The new device is developed to work within the 1.3 micron ~ 1.55 micron wavelength range and is mounted with a amplifier on the industry's smallest class of metal ceramic packages (L x W x H = 9.8mm x 7.5mm x 4.0mm). This super-small module addresses the calls coming from the industry for downsizing of 10 Gbps optical network transceivers. The detector module facilitates conversion of optical signals to electric signals and is one of the essential devices for 10 Gbps digital transmissions over optical fiber networks. NEC Compound Semiconductor Devices, Ltd. (NEC Compound Semiconductor Devices) is a leading provider of opticaland microwave devices, committed to meeting the specialized needs of its customers in the broadband and mobile networking fields with its compound and silicon semiconductor technologies. NEC Compound Semiconductor Devices, was divided from NEC Corporation and established in October 2001.
1N4148
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ABS07-32.768KHZ-T
Abracon
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
USBLC6-2SC6
STMicroelectronics
USBLC6-2SC6 by STMicroelectronics is a unidirectional transient voltage suppressor diode with a breakdown voltage of 6V. It has a max clamping voltage of 17V and operates in temperatures ranging from -40 to 125°C. This device, with dual terminals and matte tin finish, is ideal for protecting sensitive electronics from voltage spikes in various applications.
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Changzhou Galaxy Century Microelectronics
2N7002-7-F
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
LL4148
Synsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Microsemi
1N4148WS-7-F
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
Semitronics
SW-277PIN
TE Connectivity's SW-277PIN is a GAAS SPDT RF switch with 8 terminals. It offers a max operating frequency of 2500 MHz and min isolation of 14 dB. Ideal for RF/Microwave applications, this switch has a compression point of 35.8 dBm and operates b/w -40 to 85°C.
TGS8250XCMX
Texas Instruments
TGS8250XCMX by Texas Instruments is an RF/Microwave SPDT switch with a max input power of 30 dBm and VSWR of 1.5. Featuring a max insertion loss of 2.7 dB, it operates from 0-18000 MHz. Ideal for applications requiring high-frequency signal routing in communication systems.
TGS8122XPMX
TGS8122XPMX by Texas Instruments is an RF/Microwave SPDT switch with max input power of 34.77 dBm, VSWR of 1.2, and insertion loss of 1.4 dB. Ideal for applications requiring frequency range from 8-11 GHz due to its high performance and reliability in RF systems.
TGS8122-SCC
TGS8122-SCC by Texas Instruments is an RF/Microwave SPDT switch with 34.77 dBm CW power, 1.4 VSWR, and 29 dBm compression point. Ideal for applications requiring reflective port termination in the frequency range of 8-11 GHz.
HMC190BMS8
Analog Devices
Analog Devices' HMC190BMS8 is a RF/Microwave Switch with max input power of 34 dBm, insertion loss of 1 dB, and operating frequency range from 0 to 3000 MHz. Ideal for diversity switch applications, it operates b/w -40°C to +85°C temperatures.
HMC276LP4RTR
Analog Devices' HMC276LP4RTR is a RF/Microwave Switch with 2 functions, 24 terminals, and GaAs technology. It offers a max insertion loss of 7 dB, min isolation of 31 dB, and operates up to 3000 MHz. Ideal for applications requiring high-frequency switching in temperature range from -40°C to 85°C.
MASWSS0178
Tyco Electronics M/a-com
DIVERSITY SWITCH; Additional Features: HIGH RELIABILITY; Construction: COMPONENT; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn); Maximum Input Power (CW): 33.01 dBm;
HMC70MS8G
Analog Devices' HMC70MS8G is an RF/Microwave Switch with 8 terminals, offering a compression point of 23 dBm and min isolation of 28 dB. With a max operating frequency of 8000 MHz, it is ideal for applications requiring high-speed switching in communication systems or radar equipment.
HMC922LP4E
Analog Devices' HMC922LP4E is an RF/Microwave SPDT switch with 1.5 dB max insertion loss, handling up to 34 dBm CW power. Operating from -40°C to 85°C, it supports frequencies from 0-4000 MHz. Ideal for applications requiring high-performance RF switching in various temperature environments.
HMC241QS16ETR
Hittite Microwave
SP4T; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Input Power (CW): 26.99 dBm;
SPM3313
The Onsemi SPM3313 is an RF/Microwave Switch with a max freq of 2500 MHz. It features a VSWR of 1.5, Compression Point at 30 dBm, and Insertion Loss of 0.55 dB. Ideal for SPDT applications in temperature range -40 to 85 °C, with 6 terminals and surface mounting feature.
UPG2189TB-E4-A
Renesas Electronics
SPST; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Power Supplies (V): 2.6;
HMC182S14
HMC182S14 by Analog Devices is a RF/Microwave Switch with 30 dBm CW input power, 22 dBm compression point, and 1.2 dB max insertion loss. It is a GaAs technology diversity switch with 50 ohm impedance, suitable for applications requiring high-frequency signal routing in wireless communication systems.
AS169-73LF
Skyworks Solutions
AS169-73LF by Skyworks Solutions is a SPDT RF/Microwave switch with 50 ohm impedance. It offers low insertion loss of 0.5 dB and high isolation of 21 dB. Ideal for applications requiring fast switching times, such as wireless communication systems.
F2913NLGK8
Integrated Device Technology
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Minimum Operating Temperature: -40 Cel; Additional Features: HIGH LINEARITY AND ISOLATION, I/P POWER-MAX(PEAK)=1W; Maximum Voltage Standing Wave Ratio: 1.22;
PE42553A-Z
Psemi
PE42553A-Z by Psemi is a RF/Microwave switch with 1.05 dB max insertion loss, 37 dBm CW power handling, and operates from 0.009 to 8000 MHz. It's a diversity switch with 50 ohm impedance, Ni/Pd/Au finish, and can withstand -40 to 85 °C. Ideal for applications requiring high-frequency signal routing in diverse environments.
SW-254
M/a-com Technology Solutions
SW-254 by M/a-com Technology Solutions is an RF/Microwave Switch with SP4T configuration, 50 ohm impedance, and 1.9 dB insertion loss. It operates b/w 5 MHz to 2000 MHz, with a VSWR of 2.3 and temperature range from -55°C to 85°C. Ideal for high-frequency applications requiring precise signal routing.
HMC221BE
Analog Devices' HMC221BE is a GAAS technology RF/Microwave switch with 6 terminals, offering 1.1 dB max insertion loss and 14 dB min isolation. It operates from -40 to 85°C, handles up to 20 dBm CW power, and has a reflective port termination. Ideal for diversity switching applications in the frequency range of 0.01-3000 MHz.
UPG2156TB-E4
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Compression Point (1 dB): 37 dBm;
HMC546LP2TR
Analog Devices' HMC546LP2TR is a GAAS SPDT RF switch with 1.5 dB max insertion loss, 10 dB min isolation, and 2700 MHz max operating frequency. Ideal for RF/microwave applications, it has a plastic/epoxy package, operates b/w -40 to 85 °C, and features tin/lead terminal finish.
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UPG2009TB-E3-A
Nec Electronics America
SPDT; Minimum Operating Temperature: -45 Cel; Maximum Insertion Loss: .5 dB; Maximum Operating Temperature: 85 Cel; Minimum Operating Frequency: 500 MHz; JESD-609 Code: e6;
UPG2009TB-E3-A by Renesas Electronics is a RF/Microwave Switch with SPDT technology. It has a max operating frequency of 2500 MHz and a min isolation of 24 dB. This component, made of plastic/epoxy, is commonly used in applications requiring high-frequency switching capabilities.
Nec Electronics
SPDT; Minimum Operating Frequency: 500 MHz; Minimum Operating Temperature: -45 Cel; Characteristic Impedance: 50 ohm; Terminal Finish: Tin/Bismuth (Sn/Bi); Maximum Operating Temperature: 85 Cel;
UPG2012TB-E-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; No. of Functions: 1;
UPG2012TB-E3-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;
UPG2012TK-A
SPDT; Maximum Operating Frequency: 2500 MHz; Maximum Input Power (CW): 26.02 dBm; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; JESD-609 Code: e6;
UPG2006TB-E3
SPDT; Maximum Insertion Loss: .65 dB; Characteristic Impedance: 50 ohm; Minimum Operating Temperature: -45 Cel; Terminal Finish: Tin/Lead (Sn/Pb); Construction: COMPONENT;
UPG2009TB
SPDT; Maximum Operating Frequency: 2500 MHz; Characteristic Impedance: 50 ohm; Maximum Input Power (CW): 36.02 dBm; Minimum Operating Temperature: -45 Cel; Construction: COMPONENT;
UPG2012TK-E2
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -45 Cel;
UPG2010TB-A
SPDT; Minimum Operating Temperature: -40 Cel; Maximum Operating Frequency: 2500 MHz; Construction: COMPONENT; Minimum Operating Frequency: 500 MHz; Maximum Input Power (CW): 36.02 dBm;
UPG2012TB-E3
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;
UPG2009TB-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 24 dB;
UPG2010TB-E3
UPG2008TK-E2
SPDT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Input Power (CW): 28.06 dBm; Minimum Operating Frequency: 500 MHz; Minimum Operating Temperature: -45 Cel; Maximum Operating Frequency: 2500 MHz;
UPG2010TB-E3-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Input Power (CW): 36.02 dBm;
UPG2005TB-E3
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Nominal On Time: .02 us;
UPG2008TB-E3
SPDT; Maximum Operating Temperature: 85 Cel; Maximum Input Power (CW): 28.06 dBm; Minimum Operating Frequency: 500 MHz; Characteristic Impedance: 50 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
UPG2009TB-E3
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Frequency: 2500 MHz;
UPG2012TB-A
SPDT; Minimum Operating Frequency: 500 MHz; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 85 Cel; Construction: COMPONENT;
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