Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TGS8250-SCC by Texas Instruments is a GAAS SPDT RF switch with 30 dBm CW power handling, VSWR of 1.5, and frequency range up to 18 GHz. Ideal for reflective port termination applications in RF/Microwave systems, operating b/w 0°C to 70°C.
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With a high maximum input power handling capability of 30 dBm, this RF/Microwave switch is suitable for applications where there is a need to handle moderate power levels without experiencing damage.
The low maximum VSWR of 1.5 indicates good impedance matching and signal transfer efficiency, ensuring minimal signal reflections and loss, making it a reliable choice for high-performance RF and microwave systems.
Being a component-level RF/Microwave switch, it allows for easy integration into existing systems or circuit designs, providing flexibility and customization options for specific application requirements.
With a high maximum operating temperature of 70°C, this RF/Microwave switch can withstand elevated temperatures without compromising performance, making it suitable for a wide range of operating environments.
The low minimum operating temperature of 0°C ensures reliable operation even in cold conditions, adding to the versatility and durability of this RF/Microwave switch.
Utilizing Gallium Arsenide (GaAs) technology, this RF/Microwave switch offers high performance, low noise figure, and excellent linearity, making it a preferred choice for demanding RF and microwave applications.
As a Single-Pole Double-Throw (SPDT) switch, this device provides versatility in routing signals between two different paths, offering flexibility and control in signal switching applications.
With a minimum operating frequency of 0 MHz, this RF/Microwave switch can handle a wide range of frequency signals, making it suitable for diverse RF and microwave applications.
The high maximum operating frequency of 18000 MHz allows this RF/Microwave switch to support a broad range of RF and microwave signals, making it versatile for various communication and wireless systems.
Featuring reflective port termination, this RF/Microwave switch enables signal reflection back to the source, enhancing signal integrity, isolation, and system performance in high-frequency applications.
RF/Microwave Switches TGS8250-SCC attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments
Construction:
Maximum Input Power (CW):
No. of Functions:
Maximum Operating Frequency:
Minimum Operating Frequency:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Equivalence Code:
Port Termination:
RF or Microwave Device Type:
Sub-Category:
Technology:
Maximum Voltage Standing Wave Ratio:
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
BAV99
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
PIC18F4550-I/PT
Microchip Technology
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
EU2B-YS3203F
Idec
ROTARY SWITCH;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
MBR0520LT1
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
USB3320C-EZK-TR
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Bytesonic Electronics
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
Itt Semiconductor
HMC349AMS8GE
Hittite Microwave
DIVERSITY SWITCH; Maximum Operating Temperature: 85 Cel; JESD-609 Code: e3; Maximum Input Power (CW): 33.6 dBm; Maximum Insertion Loss: 2.1 dB; Minimum Operating Temperature: -40 Cel;
CSH510
SP5T; Maximum Insertion Loss: 1.1 dB; Maximum Operating Frequency: 2000 MHz; Minimum Operating Frequency: 1000 MHz; Construction: COMPONENT; Maximum Input Power (CW): 37.78 dBm;
UPG2185T6R-E2-A
Renesas Electronics
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; No. of Functions: 1;
6055
Micronetics
SP3T; Minimum Operating Frequency: 2000 MHz; Maximum Input Power (CW): 30 dBm; Maximum Voltage Standing Wave Ratio: 2; Construction: COAXIAL; Maximum Operating Frequency: 18000 MHz;
HMC1055LP2CE
Analog Devices
Analog Devices' HMC1055LP2CE is a 50 ohm RF/Microwave Diversity Switch with a CW power handling of 34 dBm. Operating from -40 to 85°C, it covers frequencies from 0 to 4000 MHz. Ideal for applications requiring high-frequency signal routing and switching in various RF systems.
MASWSS0180
M/a-com
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 36 dB;
UPG2159T5K-E2
HMC544AETR
Analog Devices' HMC544AETR is a RF/Microwave switch with max. input power of 39 dBm, insertion loss of 1 dB, and operating frequency range from 0-4000 MHz. Ideal for diversity switching applications, it has a temp. range of -40 to 85°C and impedance of 50 ohms.
UPG2157T5F-E2
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: LCC12,.12SQ,20;
HMC784MS8GE
HMC784MS8GE by Analog Devices is a RF/Microwave Switch with max input power of 39 dBm and compression point of 35 dBm. It operates from -40 to 85 °C, has a max insertion loss of 2 dB, and offers min isolation of 26 dB. Ideal for diversity switch applications in the frequency range of 0-4000 MHz.
ADRF5050BCCZN-R7
SP4T;
UPG2054K-E3-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Frequency: 2150 MHz;
CMD203C4
Qorvo
The Qorvo CMD203C4 is a SP4T RF/Microwave switch with 50 ohm impedance. It offers 22 dB isolation, 3.6 dB insertion loss, and can handle up to 27 dBm CW power. Ideal for applications requiring high-frequency switching in environments with temperatures ranging from -40°C to 85°C.
UPG2031TQ-E1
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 10; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 17 dB;
TGS8704-SCC
Texas Instruments
TGS8704-SCC by Texas Instruments is a GAAS SPDT RF switch with 33.01 dBm CW power, 1.2 VSWR, and 26 dBm compression point. Operating from 0 to 6000 MHz, it has a low insertion loss of 1.2 dB making it ideal for RF/Microwave applications requiring high performance switches.
HMC270AMS8GETR
Analog Devices' HMC270AMS8GETR is a SPDT RF switch with 2.8 dB max insertion loss, 1.5 VSWR, and 28 dB min isolation. Ideal for RF/Microwave applications, it operates from -40 to 85°C and handles up to 25.5 dBm CW power, making it suitable for various communication systems.
HMC194AMS8TR
Analog Devices' HMC194AMS8TR is a SPDT RF/Microwave switch with 1.1 dB max insertion loss, 24 dB min isolation, and 27 dBm CW input power. Constructed with GAAS technology, it operates from -40 to 85 °C and has a reflective port termination. Ideal for high-frequency applications up to 3 GHz requiring fast switching times of 0.02 us.
UPG2015TB-E3
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Insertion Loss: .55 dB;
SPM3227
Onsemi's SPM3227 RF/Microwave Switch offers 1.5 VSWR, 15 dBm compression point, and 16 dB isolation. Ideal for SPDT applications up to 2500 MHz with a max insertion loss of 0.6 dB. Suitable for surface mount setups in temperature range -40 °C to 85°C.
ADG919BCP
ADG919BCP by Analog Devices is a CMOS RF/Microwave switch with 8 terminals. It has a max insertion loss of 1.25 dB and operates from 0 to 2000 MHz. Ideal for diversity switching applications, it can handle up to 18.06 dBm CW power and has a compression point at 20 dBm.
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TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TGS8422-SCC
SP4T; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Maximum Voltage Standing Wave Ratio: 1.3; Construction: COMPONENT; Maximum Input Power (CW): 30 dBm;
TGS8122XPMX
SPDT; Minimum Operating Frequency: 8000 MHz; Maximum Insertion Loss: 1.4 dB; Maximum Input Power (CW): 34.77 dBm; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT;
TGS8122SPCX
SPDT; Maximum Voltage Standing Wave Ratio: 1.2; Minimum Operating Frequency: 8000 MHz; Maximum Insertion Loss: 1.4 dB; Construction: COMPONENT; Maximum Operating Frequency: 11000 MHz;
TGS8250XCCX
SPDT; Maximum Voltage Standing Wave Ratio: 1.5; Maximum Input Power (CW): 30 dBm; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Construction: COMPONENT;
TGS8250SCCX
SPDT; Maximum Input Power (CW): 30 dBm; Construction: COMPONENT; Minimum Operating Frequency: 0 MHz; Maximum Voltage Standing Wave Ratio: 1.5; Maximum Operating Frequency: 18000 MHz;
TGS8122XCMX
SPDT; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT; Maximum Insertion Loss: 1.4 dB; Minimum Operating Frequency: 8000 MHz; Maximum Input Power (CW): 34.77 dBm;
TGS8630-SCC
SPDT; Technology: GAAS; Package Equivalence Code: DIE OR CHIP; No. of Functions: 1; Power Supplies (V): 12; Nominal On Time: .014 us;
TGS8122SCCX
SPDT; Maximum Insertion Loss: 1.4 dB; Maximum Voltage Standing Wave Ratio: 1.2; Maximum Operating Frequency: 11000 MHz; Minimum Operating Frequency: 8000 MHz; Construction: COMPONENT;
TGS8122SPMX
SPDT; Minimum Operating Frequency: 8000 MHz; Maximum Input Power (CW): 34.77 dBm; Maximum Insertion Loss: 1.4 dB; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT;
TGS8250SSC
SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
TGS8250SCMX
SPDT; Maximum Insertion Loss: 2.7 dB; Maximum Operating Frequency: 18000 MHz; Maximum Voltage Standing Wave Ratio: 1.5; Minimum Operating Frequency: 0 MHz; Construction: COMPONENT;
TGS8122XCCX
SPDT; Maximum Operating Frequency: 11000 MHz; Maximum Insertion Loss: 1.4 dB; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2; Construction: COMPONENT;
TGS8250XCMX
SPDT; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Construction: COMPONENT; Maximum Insertion Loss: 2.7 dB; Maximum Voltage Standing Wave Ratio: 1.5;
TGS8122SPC
SPDT; Technology: GAAS; Minimum Operating Temperature: 0 Cel; No. of Functions: 1; Port Termination: REFLECTIVE; Maximum Operating Temperature: 70 Cel;
TGS8122XPCX
SPDT; Construction: COMPONENT; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2; Maximum Input Power (CW): 34.77 dBm; Maximum Insertion Loss: 1.4 dB;
TGS8122-SCC
SPDT; Technology: GAAS; Maximum Input Power (CW): 34.77 dBm; Construction: COMPONENT; Package Equivalence Code: DIE OR CHIP; Compression Point (1 dB): 29 dBm;
TGS8122SCMX
SPDT; Maximum Operating Frequency: 11000 MHz; Maximum Input Power (CW): 34.77 dBm; Construction: COMPONENT; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2;
TGS8122SSC
SPDT; Technology: GAAS; Maximum Operating Frequency: 11000 MHz; Compression Point (1 dB): 29 dBm; No. of Functions: 1; Minimum Operating Temperature: 0 Cel;
TGS8250SPC
SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
TGS8250-SCC
Triquint Semiconductor
SPDT; Technology: GAAS; Package Equivalence Code: DIE OR CHIP; No. of Functions: 1; Terminal Finish: GOLD; Compression Point (1 dB): 21 dBm;
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