Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TGS8122-SCC by Texas Instruments is an RF/Microwave SPDT switch with 34.77 dBm CW power, 1.4 VSWR, and 29 dBm compression point. Ideal for applications requiring reflective port termination in the frequency range of 8-11 GHz.
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High maximum input power allows for reliable performance even in high-power applications.
Low VSWR indicates good impedance matching and minimal signal reflections, leading to improved signal quality.
High compression point ensures minimal signal distortion even at high power levels.
Component construction enables ease of integration and maintenance within larger RF/microwave systems.
Wide operating temperature range allows for versatility in various environmental conditions.
Low minimum operating temperature ensures functionality even in colder environments.
Gallium arsenide (GaAs) technology offers high reliability and performance in RF/microwave applications.
Single-Pole Double-Throw configuration provides flexibility in signal routing and switching applications.
Low minimum operating frequency enables usage in a wide range of RF/microwave systems.
High maximum operating frequency allows for compatibility with a wide range of RF/microwave devices and systems.
Reflective port termination minimizes signal loss and enhances signal integrity within the system.
RF/Microwave Switches TGS8122-SCC attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments
Compression Point (1 dB):
Construction:
Maximum Input Power (CW):
No. of Functions:
Maximum Operating Frequency:
Minimum Operating Frequency:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Equivalence Code:
Port Termination:
RF or Microwave Device Type:
Sub-Category:
Technology:
Maximum Voltage Standing Wave Ratio:
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
SMBJ18CA
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Onsemi
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
LM555CN
Texas Instruments
LM555CN by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular package IC has dual terminals and uses bipolar technology for pulse generation in various electronic circuits.
Uniohm
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
B340A-13-F
Diodes Incorporated
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358D-T
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 200 Cel; No. of Elements: 1;
KSWA-2-46
Mini-circuits
The Mini-circuits KSWA-2-46 is an RF/Microwave SPDT switch with a max input power of 26.99 dBm and VSWR of 1.94, ideal for applications requiring high isolation (min 25 dB) and low insertion loss (max 2.6 dB). Constructed with GAAS technology, it operates from 0 to 4600 MHz in surface mount packages.
UPG2012TB-A
Renesas Electronics
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 24 dB;
MASWSS0180TR
M/a-com
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Nominal On Time: .02 us;
HMC550AE
Hittite Microwave
DIVERSITY SWITCH; Characteristic Impedance: 50 ohm; Minimum Operating Temperature: -40 Cel; Additional Features: CMOS COMPATIBLE; Maximum Operating Temperature: 85 Cel; Maximum Operating Frequency: 6000 MHz;
UPD5713TK-E2
SPDT; Maximum Operating Frequency: 2500 MHz; Construction: COMPONENT; Minimum Operating Temperature: -45 Cel; JESD-609 Code: e0; Minimum Operating Frequency: 50 MHz;
HMC446
Analog Devices
HMC446 by Analog Devices is an RF/Microwave switch with a max input power of 41.14 dBm and max insertion loss of 1 dB. It operates b/w 824-849 MHz, ideal for diversity switching applications in temperatures ranging from -40 to 85°C.
ADRF5424BCZ-GP
Analog Devices' ADRF5424BCZ-GP is a RF/Microwave Switch with 14 terminals, GAAS technology, and 50 ohm impedance. It operates from 100 MHz to 60 GHz, with a max insertion loss of 2.2 dB. Ideal for applications requiring high-frequency switching in communications systems.
ZXHF5000JB24TC
RF/Microwave Switches; JESD-609 Code: e3; Terminal Finish: MATTE TIN;
HMC784MS8GE
HMC784MS8GE by Analog Devices is a RF/Microwave Switch with max input power of 39 dBm and compression point of 35 dBm. It operates from -40 to 85 °C, has a max insertion loss of 2 dB, and offers min isolation of 26 dB. Ideal for diversity switch applications in the frequency range of 0-4000 MHz.
CSH210
Infineon Technologies
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Port Termination: REFLECTIVE;
PE42540D-Z
Psemi
PE42540D-Z by Psemi is a SP4T RF switch with 1.6 dB max insertion loss, handling up to 30 dBm CW power. Operating from -40°C to 85°C, it supports frequencies from 0.00001 MHz to 8000 MHz. Ideal for RF/Microwave applications requiring high-power switching in a compact component design.
HMC646LP2E
Analog Devices' HMC646LP2E is a SPDT RF/Microwave switch with 1.7 dB max insertion loss, 12 dB min isolation, and 44 dBm CW input power. It operates from -40 to 85°C, has a 0.32 us on time, and supports frequencies from 100 MHz to 2100 MHz. Ideal for applications requiring high-frequency switching in components like GaAs technology-based systems.
HMC349AMS8GE
DIVERSITY SWITCH; Maximum Operating Temperature: 85 Cel; JESD-609 Code: e3; Maximum Input Power (CW): 33.6 dBm; Maximum Insertion Loss: 2.1 dB; Minimum Operating Temperature: -40 Cel;
SPM3226
SPM3226 by Onsemi is a RF/Microwave Switch with 1.5 VSWR, 0.55 dB insertion loss, and 15 dB isolation. It's a SPDT device suitable for surface mount applications in temperature range of -40 to 85 °C.
QPC8019QSR
Qorvo
Qorvo's QPC8019QSR is a SPDT RF switch with 1.1 dB max insertion loss, 14.5 dB min isolation, and 1.75 max VSWR. AEC-Q100 screened for automotive applications, it operates from -40 to 105°C with reflective port termination and supports frequencies from 617 MHz to 8 GHz.
ADG902BRM-500RL7
ADG902BRM-500RL7 by Analog Devices is a CMOS RF/Microwave Diversity Switch with 8 terminals. It offers 1.25 dB max insertion loss, 31 dB min isolation, and operates from 0 to 2500 MHz. Ideal for applications requiring high-frequency signal routing in wireless communication systems.
TGS8632-SCC
TGS8632-SCC by Texas Instruments is a GAAS SPST RF switch with 16 dBm compression point, operating at 18 GHz. It has reflective port termination and requires a 12V power supply. Ideal for RF/microwave applications requiring high-frequency switching capabilities.
HMC349ALP4CE
Analog Devices' HMC349ALP4CE is a RF/Microwave Switch with 1.7 dB max insertion loss, 33.6 dBm CW power handling, and 0-4000 MHz frequency range. Ideal for diversity switch applications due to its 50 ohm impedance and -40 to 85°C operating temperature range.
TG2200F
Toshiba
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Frequency: 1895 MHz;
HMC241ALP3E
HMC241ALP3E by Analog Devices is a RF/Microwave Switch with 17.5 dBm CW power, 29 dBm compression point, and 1.5 dB max insertion loss. Ideal for diversity switch applications in the frequency range of 100 MHz to 4000 MHz with a characteristic impedance of 50 ohms.
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TGS8422-SCC
SP4T; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Maximum Voltage Standing Wave Ratio: 1.3; Construction: COMPONENT; Maximum Input Power (CW): 30 dBm;
TGS8122XPMX
SPDT; Minimum Operating Frequency: 8000 MHz; Maximum Insertion Loss: 1.4 dB; Maximum Input Power (CW): 34.77 dBm; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT;
TGS8122SPCX
SPDT; Maximum Voltage Standing Wave Ratio: 1.2; Minimum Operating Frequency: 8000 MHz; Maximum Insertion Loss: 1.4 dB; Construction: COMPONENT; Maximum Operating Frequency: 11000 MHz;
TGS8250XCCX
SPDT; Maximum Voltage Standing Wave Ratio: 1.5; Maximum Input Power (CW): 30 dBm; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Construction: COMPONENT;
TGS8250SCCX
SPDT; Maximum Input Power (CW): 30 dBm; Construction: COMPONENT; Minimum Operating Frequency: 0 MHz; Maximum Voltage Standing Wave Ratio: 1.5; Maximum Operating Frequency: 18000 MHz;
TGS8122XCMX
SPDT; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT; Maximum Insertion Loss: 1.4 dB; Minimum Operating Frequency: 8000 MHz; Maximum Input Power (CW): 34.77 dBm;
TGS8630-SCC
SPDT; Technology: GAAS; Package Equivalence Code: DIE OR CHIP; No. of Functions: 1; Power Supplies (V): 12; Nominal On Time: .014 us;
TGS8122SCCX
SPDT; Maximum Insertion Loss: 1.4 dB; Maximum Voltage Standing Wave Ratio: 1.2; Maximum Operating Frequency: 11000 MHz; Minimum Operating Frequency: 8000 MHz; Construction: COMPONENT;
TGS8250-SCC
SPDT; Technology: GAAS; Construction: COMPONENT; Port Termination: REFLECTIVE; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: 0 Cel;
TGS8122SPMX
SPDT; Minimum Operating Frequency: 8000 MHz; Maximum Input Power (CW): 34.77 dBm; Maximum Insertion Loss: 1.4 dB; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT;
TGS8250SSC
SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
TGS8250SCMX
SPDT; Maximum Insertion Loss: 2.7 dB; Maximum Operating Frequency: 18000 MHz; Maximum Voltage Standing Wave Ratio: 1.5; Minimum Operating Frequency: 0 MHz; Construction: COMPONENT;
TGS8122XCCX
SPDT; Maximum Operating Frequency: 11000 MHz; Maximum Insertion Loss: 1.4 dB; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2; Construction: COMPONENT;
TGS8250XCMX
SPDT; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Construction: COMPONENT; Maximum Insertion Loss: 2.7 dB; Maximum Voltage Standing Wave Ratio: 1.5;
TGS8122SPC
SPDT; Technology: GAAS; Minimum Operating Temperature: 0 Cel; No. of Functions: 1; Port Termination: REFLECTIVE; Maximum Operating Temperature: 70 Cel;
TGS8122XPCX
SPDT; Construction: COMPONENT; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2; Maximum Input Power (CW): 34.77 dBm; Maximum Insertion Loss: 1.4 dB;
TGS8122SCMX
SPDT; Maximum Operating Frequency: 11000 MHz; Maximum Input Power (CW): 34.77 dBm; Construction: COMPONENT; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2;
TGS8122SSC
SPDT; Technology: GAAS; Maximum Operating Frequency: 11000 MHz; Compression Point (1 dB): 29 dBm; No. of Functions: 1; Minimum Operating Temperature: 0 Cel;
TGS8250SPC
SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
TGS8122-SCC
Triquint Semiconductor
SPDT; Technology: GAAS; Maximum Input Power (CW): 34.77 dBm; Construction: COMPONENT; Nominal On Time: .002 us; No. of Functions: 1;
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