Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TGS8122XPCX by Texas Instruments is an RF/Microwave SPDT switch with 34.77 dBm CW power, 1.2 VSWR, and 1.4 dB insertion loss. Ideal for applications requiring switching b/w frequencies of 8-11 GHz in COMPONENT construction.
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$2.000
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$1.940
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$2.458
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$2.707
$2.490
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$2.762
$2.486
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$2.265
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$11.000
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$15.073
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Corohmni
With a high maximum input power, this RF/Microwave switch can handle strong signals without distortion, making it suitable for high-power applications.
The low VSWR value indicates good impedance matching, leading to minimal signal loss and improved overall performance of the switch.
Being a COMPONENT construction, this switch offers durability and reliability, ensuring long-term operation in various environments.
With a low insertion loss, this switch maintains signal integrity and minimizes signal attenuation, making it suitable for high-frequency applications.
As a SPDT device, this switch offers flexibility in routing RF or microwave signals, allowing for versatile signal management in electronic systems.
With a low minimum operating frequency, this switch is capable of handling a wide range of frequencies, making it suitable for diverse RF and microwave applications.
With a high maximum operating frequency, this switch can accommodate higher-frequency signals, making it ideal for applications that require handling of high-frequency signals.
RF/Microwave Switches TGS8122XPCX attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments
Construction:
Maximum Input Power (CW):
Maximum Insertion Loss:
Maximum Operating Frequency:
Minimum Operating Frequency:
RF or Microwave Device Type:
Maximum Voltage Standing Wave Ratio:
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
SMBJ18CA
Hy Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Synsemi
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
Formosa Microsemi
EU2B-YS3203C
Idec
ROTARY SWITCH;
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Diodes Incorporated
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
Comchip Technology
LM107H/883C
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Package Equivalence Code: CAN8,.2;
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
UPG2156TB-E4-A
Renesas Electronics
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Input Power (CW): 38.06 dBm;
ADG902BCP-500RL7
Analog Devices
ADG902BCP-500RL7 by Analog Devices is a CMOS RF/Microwave Diversity Switch with 8 terminals. It offers 1.25 dB max insertion loss, 34 dB min isolation, and operates from 0 to 2500 MHz. Ideal for applications requiring high-frequency signal routing in wireless communication systems.
HMC607
Analog Devices' HMC607 RF/Microwave Switch offers 30 dBm CW input power, 26 dBm compression point, and 3.4 dB max insertion loss. Ideal for applications requiring SPDT technology, with a frequency range of 0-15000 MHz and high isolation at 45 dB.
ZXHF5000JB24TC
RF/Microwave Switches; JESD-609 Code: e3; Terminal Finish: MATTE TIN;
UPG2155TB-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Power Supplies (V): 2.6;
TGS2352-2-SM
Qorvo
The Qorvo TGS2352-2-SM RF/Microwave Switch offers a max input power of 44 dBm and VSWR of 1.43, ideal for SPDT applications in the frequency range of 500 MHz to 12 GHz. With GAN technology and ceramic package, it operates b/w -40°C to 85°C with a fast 0.031 us nominal on time.
F2950NEGK
Renesas Electronics' F2950NEGK is a SPDT RF/Microwave Switch with max input power of 30 dBm and insertion loss of 0.9 dB. Operating from -40 to 105 °C, it covers frequencies from 100 MHz to 8 GHz. Ideal for applications requiring high-frequency switching in various electronic systems.
HMC1055LP2CE
Analog Devices' HMC1055LP2CE is a 50 ohm RF/Microwave Diversity Switch with a CW power handling of 34 dBm. Operating from -40 to 85°C, it covers frequencies from 0 to 4000 MHz. Ideal for applications requiring high-frequency signal routing and switching in various RF systems.
SW-277TR
M/a-com Technology Solutions
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Additional Features: HIGH RELIABILITY;
HMC-C583
Analog Devices' HMC-C583 is a RF/Microwave Switch with max input power of 25.05 dBm, insertion loss of 10 dB, and operating frequency range from 100 MHz to 40 GHz. Ideal for applications requiring diversity switching in environments ranging from -55 °C to 85°C.
BGS13SN8
Infineon Technologies
SP3T;
UPG137GV
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -50 Cel;
UPG2009TB-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 24 dB;
ADRF5345BCCZN-RL
Analog Devices' ADRF5345BCCZN-RL is a SP4T RF/Microwave switch with 42.5 dBm CW power, 1.13 VSWR, and 50 ohm impedance. Ideal for applications requiring high-frequency switching in the range of 1800-3800 MHz, such as wireless communication systems and radar equipment.
UPG2214TB-E4-A
Renesas Electronics UPG2214TB-E4-A is a RF/Microwave Switch with 30 dBm CW input power and 20 dBm compression point. It operates from -45 to 85 °C, has 0.6 dB max insertion loss, and offers SPDT technology. Ideal for applications requiring high-frequency switching in compact designs.
HMC536LP2TR
Analog Devices' HMC536LP2TR is a GAAS SPDT RF switch with 1.3 dB max insertion loss, 23 dB min isolation, and 6000 MHz max operating frequency. Ideal for applications requiring fast 0.07 us on time, it has a surface mount package suitable for -40 to 85 °C environments.
UPG2012TB-E3
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;
ADRF5046BCCZN-R7
Analog Devices' ADRF5046BCCZN-R7 is a RF/Microwave Switch with 27.48 dBm CW power, 100-44000 MHz frequency range, and 50 ohm impedance. Ideal for diversity switch applications due to its wide operating temperature range (-40 to 105 °C) and nickel palladium gold finish.
MASW-007072-000100
Tyco Electronics M/a-com
SPDT; Maximum Operating Temperature: 85 Cel; Maximum Input Power (CW): 33.98 dBm; Maximum Insertion Loss: 1.45 dB; Minimum Operating Temperature: -40 Cel; Construction: COMPONENT;
BGS12AE6327X1SA1
SPDT; Maximum Input Power (CW): 23.98 dBm; Maximum Insertion Loss: .8 dB; Minimum Operating Frequency: 100 MHz; Construction: COMPONENT; Characteristic Impedance: 50 ohm;
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DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TGS8422-SCC
SP4T; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Maximum Voltage Standing Wave Ratio: 1.3; Construction: COMPONENT; Maximum Input Power (CW): 30 dBm;
TGS8122XPMX
SPDT; Minimum Operating Frequency: 8000 MHz; Maximum Insertion Loss: 1.4 dB; Maximum Input Power (CW): 34.77 dBm; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT;
TGS8122SPCX
SPDT; Maximum Voltage Standing Wave Ratio: 1.2; Minimum Operating Frequency: 8000 MHz; Maximum Insertion Loss: 1.4 dB; Construction: COMPONENT; Maximum Operating Frequency: 11000 MHz;
TGS8250XCCX
SPDT; Maximum Voltage Standing Wave Ratio: 1.5; Maximum Input Power (CW): 30 dBm; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Construction: COMPONENT;
TGS8250SCCX
SPDT; Maximum Input Power (CW): 30 dBm; Construction: COMPONENT; Minimum Operating Frequency: 0 MHz; Maximum Voltage Standing Wave Ratio: 1.5; Maximum Operating Frequency: 18000 MHz;
TGS8122XCMX
SPDT; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT; Maximum Insertion Loss: 1.4 dB; Minimum Operating Frequency: 8000 MHz; Maximum Input Power (CW): 34.77 dBm;
TGS8630-SCC
SPDT; Technology: GAAS; Package Equivalence Code: DIE OR CHIP; No. of Functions: 1; Power Supplies (V): 12; Nominal On Time: .014 us;
TGS8122SCCX
SPDT; Maximum Insertion Loss: 1.4 dB; Maximum Voltage Standing Wave Ratio: 1.2; Maximum Operating Frequency: 11000 MHz; Minimum Operating Frequency: 8000 MHz; Construction: COMPONENT;
TGS8250-SCC
SPDT; Technology: GAAS; Construction: COMPONENT; Port Termination: REFLECTIVE; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: 0 Cel;
TGS8122SPMX
SPDT; Minimum Operating Frequency: 8000 MHz; Maximum Input Power (CW): 34.77 dBm; Maximum Insertion Loss: 1.4 dB; Maximum Operating Frequency: 11000 MHz; Construction: COMPONENT;
TGS8250SSC
SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
TGS8250SCMX
SPDT; Maximum Insertion Loss: 2.7 dB; Maximum Operating Frequency: 18000 MHz; Maximum Voltage Standing Wave Ratio: 1.5; Minimum Operating Frequency: 0 MHz; Construction: COMPONENT;
TGS8122XCCX
SPDT; Maximum Operating Frequency: 11000 MHz; Maximum Insertion Loss: 1.4 dB; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2; Construction: COMPONENT;
TGS8250XCMX
SPDT; Minimum Operating Frequency: 0 MHz; Maximum Operating Frequency: 18000 MHz; Construction: COMPONENT; Maximum Insertion Loss: 2.7 dB; Maximum Voltage Standing Wave Ratio: 1.5;
TGS8122SPC
SPDT; Technology: GAAS; Minimum Operating Temperature: 0 Cel; No. of Functions: 1; Port Termination: REFLECTIVE; Maximum Operating Temperature: 70 Cel;
TGS8122-SCC
SPDT; Technology: GAAS; Maximum Input Power (CW): 34.77 dBm; Construction: COMPONENT; Package Equivalence Code: DIE OR CHIP; Compression Point (1 dB): 29 dBm;
TGS8122SCMX
SPDT; Maximum Operating Frequency: 11000 MHz; Maximum Input Power (CW): 34.77 dBm; Construction: COMPONENT; Minimum Operating Frequency: 8000 MHz; Maximum Voltage Standing Wave Ratio: 1.2;
TGS8122SSC
SPDT; Technology: GAAS; Maximum Operating Frequency: 11000 MHz; Compression Point (1 dB): 29 dBm; No. of Functions: 1; Minimum Operating Temperature: 0 Cel;
TGS8250SPC
SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
Triquint Semiconductor
SPDT; Technology: GAAS; Maximum Input Power (CW): 34.77 dBm; Construction: COMPONENT; Nominal On Time: .002 us; No. of Functions: 1;
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