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TGS8422-SCC

Texas Instruments

TGS8422-SCC by Texas Instruments

TGS8422-SCC by Texas Instruments is an SP4T RF switch with 30 dBm CW power handling, VSWR of 1.3, and frequency range from 0-18000 MHz. Ideal for applications requiring high-frequency signal routing in RF/microwave systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,153 parts In-Stock

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7,153

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Digiode

USA . 1,672 parts In-Stock

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1,672

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Distributors (Availability)

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Ampacity Inc.

Singapore . 292 parts In-Stock

1+ parts

$2.000

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292

$2.000

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Parana Technologies

USA . 1,039 parts In-Stock

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$2.156

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1k+ parts

$2.667

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1,039

$2.156

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$2.667

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DigiPath Technology Company

USA . 2,060 parts In-Stock

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$2.374

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2,060

$2.374

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IDEA Electronic Components Group

UK . 1,976 parts In-Stock

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$2.422

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$2.180

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1,976

$2.422

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$2.180

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ChromeModa Solutions

Germany . 1,402 parts In-Stock

1+ parts

$2.422

100+ parts

$1.986

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1,402

$2.422

$1.986

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AZTECH Wire

Italy . 275 parts In-Stock

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$6.270

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275

$6.270

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Semicontronic

India . 947 parts In-Stock

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$7.000

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$6.825

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$6.790

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947

$7.000

$6.825

$6.790

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One Stop Electronics

USA . 902 parts In-Stock

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$8.000

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902

$8.000

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Corphita

USA . 3,007 parts In-Stock

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3,007

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Corohmni

South Africa . 460 parts In-Stock

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Overview

Enhance your RF/Microwave system with the TGS8422-SCC by Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable solutions for various applications in the RF/Microwave Switches category. This SP4T device offers a maximum input power of 30 dBm and a maximum VSWR of 1.3, ensuring optimal performance. Upgrade your system with this versatile component that provides value, efficiency, and unmatched benefits to customers seeking superior RF/Microwave solutions.

Feature Benefit Bullets

Maximum Input Power (CW): 30 dBm

The high maximum input power handling capability of 30 dBm ensures reliable performance under high power conditions, making this switch suitable for a wide range of applications.

Maximum Voltage Standing Wave Ratio: 1.3

With a low VSWR of 1.3, this switch provides efficient power transfer and minimizes signal reflections, resulting in improved system performance and signal integrity.

Construction: COMPONENT

The component-level construction ensures easy integration into existing systems or circuits, offering flexibility and customization options for different RF/microwave applications.

RF or Microwave Device Type: SP4T

Being a Single-Pole Four-Throw switch, this product allows for switching between four different RF/microwave signals, enabling versatile signal routing and connectivity options in RF systems.

Minimum Operating Frequency: 0 MHz

With a minimum operating frequency of 0 MHz, this switch is suitable for a wide range of RF and microwave applications, including those requiring low-frequency signal switching.

Maximum Operating Frequency: 18000 MHz

The high maximum operating frequency of 18000 MHz allows this switch to handle a broad spectrum of RF and microwave signals, making it ideal for high-frequency applications such as wireless communications and radar systems.

Technical Specifications

RF/Microwave Switches TGS8422-SCC attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments

Specs

Construction:

COMPONENT

Maximum Input Power (CW):

30 dBm

Maximum Operating Frequency:

18000 MHz

Minimum Operating Frequency:

0 MHz

RF or Microwave Device Type:

Maximum Voltage Standing Wave Ratio:

1.3

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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