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TGS8122XCCX

Texas Instruments

TGS8122XCCX by Texas Instruments

TGS8122XCCX by Texas Instruments is an RF/Microwave SPDT switch with a max CW input power of 34.77 dBm and VSWR of 1.2. It operates b/w 8-11 GHz, offering low insertion loss at 1.4 dB, making it ideal for high-frequency applications in communications and radar systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,335 parts In-Stock

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6,335

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Digiode

USA . 2,101 parts In-Stock

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2,101

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,531 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

10k+ parts

-

1,531

$1.000

$0.975

$0.970

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Parana Technologies

USA . 742 parts In-Stock

1+ parts

$1.742

100+ parts

-

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$2.320

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742

$1.742

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$2.320

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DigiPath Technology Company

USA . 1,227 parts In-Stock

1+ parts

$1.918

100+ parts

$1.764

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1,227

$1.918

$1.764

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ChromeModa Solutions

Germany . 4,136 parts In-Stock

1+ parts

$1.957

100+ parts

$1.605

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4,136

$1.957

$1.605

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

1+ parts

$1.957

100+ parts

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$1.761

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2,216

$1.957

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$1.761

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AZTECH Wire

Italy . 536 parts In-Stock

1+ parts

$6.578

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536

$6.578

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Ampacity Inc.

Singapore . 1,627 parts In-Stock

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$17.000

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1,627

$17.000

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One Stop Electronics

USA . 517 parts In-Stock

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$27.000

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517

$27.000

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Corphita

USA . 1,979 parts In-Stock

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1,979

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Corohmni

South Africa . 434 parts In-Stock

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434

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Overview

Experience the next level of performance with the TGS8122XCCX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you high-quality RF/Microwave Switches that deliver exceptional reliability and efficiency. Whether you need seamless signal switching or precise frequency control, this SPDT switch offers unparalleled value and benefits for a wide range of applications. Trust Texas Instruments to provide you with cutting-edge technology that enhances your system's performance and reliability. Elevate your projects with the TGS8122XCCX today.

Feature Benefit Bullets

Maximum Input Power (CW) 34.77 dBm

Allows for high power handling capability, making it suitable for high-power applications.

Maximum Voltage Standing Wave Ratio 1.2

Low VSWR indicates good impedance matching, leading to efficient power transfer.

Construction COMPONENT

Component-level construction ensures reliability and ease of integration into larger systems.

Maximum Insertion Loss 1.4 dB

Low insertion loss minimizes signal attenuation, preserving signal integrity.

RF or Microwave Device Type SPDT

SPDT configuration provides flexibility in signal routing and switching capabilities.

Minimum Operating Frequency 8000 MHz

Supports operation at high frequencies, suitable for various RF and microwave applications.

Maximum Operating Frequency 11000 MHz

Wide operating frequency range allows for versatile use across different frequency bands.

Technical Specifications

RF/Microwave Switches TGS8122XCCX attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments

Specs

Construction:

COMPONENT

Maximum Input Power (CW):

34.77 dBm

Maximum Insertion Loss:

1.4 dB

Maximum Operating Frequency:

11000 MHz

Minimum Operating Frequency:

8000 MHz

RF or Microwave Device Type:

Maximum Voltage Standing Wave Ratio:

1.2

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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