Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Onsemi's SPM3314 RF/Microwave Switch offers 1.5 VSWR, 29 dBm compression point, and 17 dB isolation. Ideal for SPDT applications up to 2500 MHz with a 0.5 dB insertion loss. Package is plastic/epoxy suitable for surface mount installations in temperatures ranging from -40 °C to 85°C.
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The use of plastic/epoxy material in the package body ensures lightweight construction and durability, making it suitable for various applications.
Low VSWR of 1.5 ensures efficient power transfer and minimal signal loss, making it a reliable choice for high-frequency applications.
High compression point of 29 dBm enables the switch to handle high power levels without distortion, ensuring reliable performance in demanding RF/microwave systems.
Low power supply requirement of 2.7V ensures energy efficiency and compatibility with a wide range of power sources.
6 terminals provide flexibility in connecting the switch to other components, enabling versatile integration into RF/microwave systems.
High maximum operating temperature of 85 °C ensures reliable performance in harsh environmental conditions, making it suitable for outdoor and industrial applications.
Low minimum operating temperature of -40 °C ensures reliable operation in cold environments, expanding the range of applications for this switch.
Low insertion loss of 0.5 dB ensures minimal signal degradation during switching, maintaining signal integrity in RF/microwave systems.
Single-pole, double-throw (SPDT) configuration allows for switching between two signal paths, providing flexibility in routing RF/microwave signals.
High isolation of 17 dB between switch ports ensures minimal interference between signal paths, maintaining signal purity in complex RF/microwave systems.
Surface mount design simplifies installation and integration of the switch into PCBs, saving space and reducing assembly time.
High maximum operating frequency of 2500 MHz allows the switch to handle a wide range of RF/microwave signals, making it suitable for multi-frequency applications.
RF/Microwave Switches SPM3314 attributes and parameters. Explore more RF/Microwave Switches devices from Onsemi
Compression Point (1 dB):
Maximum Insertion Loss:
Minimum Isolation:
Mounting Feature:
No. of Functions:
No. of Terminals:
Maximum Operating Frequency:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
RF or Microwave Device Type:
Sub-Category:
Maximum Voltage Standing Wave Ratio:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BAV99
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
1N4148
Rochester Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAT54SLT1G
Onsemi
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
Itt Semiconductor
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
2N2222A
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ROHM
Formosa Microsemi
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
MBRS130LT3G
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bkc Semiconductors
LM2931AZ-5.0RAG
LM2931AZ-5.0RAG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage, 0.1A max output current, and 0.6V max dropout voltage. Ideal for applications requiring stable voltage regulation in temperature-sensitive environments up to 150°C.
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
MASWSS0178TR-3000
Tyco Electronics M/a-com
DIVERSITY SWITCH; Maximum Operating Temperature: 85 Cel; Maximum Input Power (CW): 33.01 dBm; Characteristic Impedance: 50 ohm; Maximum Insertion Loss: .8 dB; Construction: COMPONENT;
HMC595A
Analog Devices
Analog Devices' HMC595A is a RF/Microwave Switch with max. input power of 39 dBm, 0.8 dB insertion loss, and 50 ohm impedance. Ideal for diversity switching applications in the frequency range of 0-3000 MHz, operating b/w -40 to 85°C.
HMC1084LC4TR
Hittite Microwave
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Power Supplies (V): -3;
UPG2164T5N-E2-A
Renesas Electronics
DPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Construction: COMPONENT;
MA4AGSW1
SPST; Maximum Input Power (CW): 30 dBm; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -55 Cel; Additional Features: IT CAN ALSO OPERATE AT 50 TO 70000 MHZ; Construction: COMPONENT;
UPG2418T6X-E2-A
RF/Microwave Switches;
ZXHF5002JB24
Diodes Incorporated
TGS8632-SCC
Texas Instruments
TGS8632-SCC by Texas Instruments is a GAAS SPST RF switch with 16 dBm compression point, operating at 18 GHz. It has reflective port termination and requires a 12V power supply. Ideal for RF/microwave applications requiring high-frequency switching capabilities.
HMC199MS8E
HMC199MS8E by Analog Devices is a RF/Microwave Switch with SPDT configuration and 50 ohm impedance. It has a max insertion loss of 1 dB, min isolation of 17 dB, and operates from 0 to 2500 MHz. This component is ideal for applications requiring fast switching times and high power handling up to 23.98 dBm CW.
ADG919BCP-REEL7
ADG919BCP-REEL7 by Analog Devices is a CMOS RF/Microwave switch with 8 terminals, operating from -40 to 85 °C. It offers low insertion loss of 1.25 dB, high isolation of 36 dB, and supports frequencies up to 4 GHz. Ideal for diversity switching applications in various electronic systems.
ADRF5300BCCZN-R7
Analog Devices' ADRF5300BCCZN-R7 is a SPDT RF switch with 50 ohm impedance, operating from 24-32 GHz. It has a CW input power of 28 dBm and VSWR of 1.17, suitable for high-frequency applications in temperatures ranging from -40 to 105°C. Ideal for surface mount setups with reflective port termination.
PE42540F-Z
Psemi
PE42540F-Z by Psemi is a SP4T RF switch with 1.6 dB max insertion loss, 21 dB min isolation, and 8000 MHz max operating frequency. It is ideal for RF/Microwave applications requiring high power handling up to 33 dBm CW and fast switching with a nominal on time of 5 us. The switch features CMOS technology, surface mounting, and operates within -40 to 85 °C temperature range.
LM96530SQE/NOPB
LM96530SQE/NOPB by Texas Instruments is a RF/Microwave Switch with 60 terminals, operating at 0-70°C. It has a power supply of 5V and a nominal on time of 2μs. Ideal for applications requiring a transfer switch, it features surface mounting and matte tin terminal finish.
UPG2411T7C-E3-A
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Characteristic Impedance: 50 ohm;
6056
Mercury Systems
SP3T; Minimum Operating Temperature: -55 Cel; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 125 Cel; Maximum Voltage Standing Wave Ratio: 1.5; Additional Features: SMA;
HMC574MS8ETR
Analog Devices' HMC574MS8ETR is a GAAS SPDT RF switch with 3000 MHz max frequency, 0.8 dB insertion loss, and 16 dB isolation. It operates b/w -40 to 85 °C with 5V supply, making it ideal for RF/microwave applications requiring high compression point and fast response time.
UPG2009TB-A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 24 dB;
TGS8250SSC
SPDT; Technology: GAAS; Port Termination: REFLECTIVE; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
MASW-002100-11910W
TE Connectivity
MASW-002100-11910W by TE Connectivity is an RF/Microwave SPDT switch with max freq of 20 GHz. It offers low insertion loss of 1.2 dB and high isolation of 34 dB. Ideal for applications requiring reliable switching in temperature range from -65°C to 125°C.
ADRF5132BCPZN-R7
Analog Devices' ADRF5132BCPZN-R7 is a RF/Microwave Switch with 16 terminals, operating from 700 MHz to 5000 MHz. It has a max input power of 43 dBm and operates at temperatures ranging from -40°C to 105°C. Ideal for diversity switch applications due to its reflective port termination and surface mount feature.
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SPM3202
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Nominal On Time: .02 us;
SPM3205
SPM3215
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Compression Point (1 dB): 26 dBm; Maximum Insertion Loss: 1.4 dB;
SPM3221
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Power Supplies (V): 3;
SPM3224
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Insertion Loss: .55 dB;
SPM3225
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;
SPM3226
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; No. of Functions: 1; Maximum Voltage Standing Wave Ratio: 1.5;
SPM3227
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Voltage Standing Wave Ratio: 1.5; Package Equivalence Code: SOLCC6,.03,18;
SPM3252
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Insertion Loss: .95 dB;
SPM3255
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Insertion Loss: .9 dB; Maximum Voltage Standing Wave Ratio: 2;
SPM3313
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: SOLCC6,.03,18; Maximum Voltage Standing Wave Ratio: 1.5;
SPM3315
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Insertion Loss: .5 dB; Maximum Voltage Standing Wave Ratio: 1.5;
SPM3501
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Minimum Isolation: 10 dB; Maximum Operating Temperature: 85 Cel;
SPM3314
Sanyo Electric
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Operating Frequency: 2500 MHz; Maximum Voltage Standing Wave Ratio: 1.5;
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Minimum Isolation: 17 dB; Characteristic Impedance: 50 ohm;
SPM3218
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -20 Cel; Maximum Operating Frequency: 2500 MHz;
SPM3212
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 3; Nominal On Time: .02 us;
SPM3211
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Operating Frequency: 2500 MHz; Compression Point (1 dB): 28 dBm;
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Maximum Insertion Loss: .55 dB; Construction: COMPONENT;
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